Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: An electronic apparatus is equipped with housing, a motherboard, a stud, and a lid. The housing constitutes an outer shell of the main body having a shielding property against electromagnetic radiation and an opening located on the bottom wall. The opening is smaller than the total mounting area of a plurality of extension modules which are layered each other. The motherboard is installed in the housing. The stud is attached on the bottom surface side of the motherboard and is fastened by a set of screws together with the plurality of extension modules. The lid has a shielding property against electromagnetic radiation and covers the opening.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: According to one embodiment, a mounting assembly according to the invention comprises a substrate, a first heat sink, a coupling mechanism, a first heat emitter, a second heat emitter, first thermally conductive grease, second thermally conductive grease, and a second heat sink. The first heat emitter and the second heat emitter are mounted on the substrate between the substrate and the first heat sink. The first thermally conductive grease thermally couples the first heat sink to the first heat emitter. The second thermally conductive grease thermally couples the first heat sink to the second heat emitter. The second heat sink is vertically movable relative to the first heat sink.

Abstract: An electronic apparatus is equipped with housing, a motherboard, a stud, and a lid. The housing constitutes an outer shell of the main body having a shielding property against electromagnetic radiation and an opening located on the bottom wall. The opening is smaller than the total mounting area of a plurality of extension modules which are layered each other. The motherboard is installed in the housing. The stud is attached on the bottom surface side of the motherboard and is fastened by a set of screws together with the plurality of extension modules. The lid has a shielding property against electromagnetic radiation and covers the opening.