Patents by Inventor Takashi Imanaka

Takashi Imanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240019504
    Abstract: A magnetic sensor includes an insulating substrate, at least one magnetoresistive element, a conductor, and an encapsulant. The conductor electrically connects the magnetoresistive element to an external circuit. The encapsulant encapsulates not only the magnetoresistive element entirely but also the insulating substrate and the conductor at least partially. The magnetoresistive element includes a magnetoresistive film and an electrode. The magnetoresistive film is formed on a first surface of the insulating substrate. The electrode is provided on the first surface of the insulating substrate. One end of the electrode is electrically connected to the magnetoresistive film. The other end of the electrode is electrically connected to a first end portion of the conductor. The encapsulant exposes a second surface of the insulating substrate and a second end portion of the conductor from mutually different surfaces.
    Type: Application
    Filed: December 6, 2021
    Publication date: January 18, 2024
    Inventor: Takashi IMANAKA
  • Publication number: 20240021376
    Abstract: A method for manufacturing a capacitor includes a groove forming, a masking layer forming, a porous part forming, a dielectric layer forming, and a conductor layer forming. A silicon substrate having a first surface and a second surface and including a capacitance generation region and a non-capacitance generation region is prepared, and a groove recessed from the first surface toward the second surface is formed at a boundary between the capacitance generation region and the non-capacitance generation region. A masking layer including a first masking part and a second masking part is formed on the first surface of the silicon substrate. A porous part having fine pores is formed in the capacitance generation region of the silicon substrate by an anodic oxidation process. A dielectric layer is formed on inner surfaces of the fine pores. A conductor layer including a first conductive part and a second conductive part is formed.
    Type: Application
    Filed: December 6, 2021
    Publication date: January 18, 2024
    Inventor: Takashi IMANAKA
  • Patent number: 11150092
    Abstract: A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 19, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Imanaka, Shoichi Taji, Soichiro Hiraoka, Katsuya Morinaka
  • Patent number: 10761065
    Abstract: An inspection device inspects a joint-type outer joint member of a constant velocity universal joint that includes a cup section having a bottomed cylindrical shape and track grooves in an inner periphery thereof for torque transmitting elements, and a shaft section extending from a bottom of the cup section. The inspection device inspects the outer joint member, which is obtained through melt-welding on a cup member forming the cup section and a shaft member forming the shaft section. The inspection device includes a surface inspection unit to inspect for a defect which appears on a surface of the outer joint member due to welding, an internal inspection unit to inspect for an internal defect of a welded portion, and a recording unit to record an inspection result of the inspection. The inspection device is configured to efficiently perform in-line total inspection for the melt-welded joint-type outer joint member.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: September 1, 2020
    Assignee: NTN CORPORATION
    Inventors: Hiromi Nagai, Daisuke Kagawa, Naoki Nakagawa, Takashi Imanaka, Yasuhiko Sakakibara, Tokio Ueda, Masazumi Kobayashi, Tatsuro Sugiyama
  • Publication number: 20190242709
    Abstract: A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.
    Type: Application
    Filed: December 19, 2017
    Publication date: August 8, 2019
    Inventors: TAKASHI IMANAKA, SHOICHI TAJI, SOICHIRO HIRAOKA, KATSUYA MORINAKA
  • Patent number: 10191078
    Abstract: An acceleration sensor includes a detection device, an opposed electrode, and a top lid. The detection device includes an active layer, a base layer, an oxide layer disposed between the active layer and the base layer, a first insulating layer, a contact portion, and a self-check electrode. The first insulating layer is disposed on the active layer at a side opposite to the oxide layer and provided with a first opening. The contact portion is disposed on a part of the first insulating layer at a side opposite to the active layer and includes a first metal layer connected to the active layer through the first opening. The opposed electrode is disposed at a location opposing the self-check electrode, and the top lid supports the opposed electrode.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: January 29, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Atsuhiro Fujii, Takashi Imanaka, Yuichi Miyoshi, Hiroyuki Aizawa
  • Publication number: 20170234836
    Abstract: An inspection device inspects a joint-type outer joint member of a constant velocity universal joint that includes a cup section having a bottomed cylindrical shape and track grooves in an inner periphery thereof for torque transmitting elements, and a shaft section extending from a bottom of the cup section. The inspection device inspects the outer joint member, which is obtained through melt-welding on a cup member forming the cup section and a shaft member forming the shaft section. The inspection device includes a surface inspection unit to inspect for a defect which appears on a surface of the outer joint member due to welding, an internal inspection unit to inspect for an internal defect of a welded portion, and a recording unit to record an inspection result of the inspection. The inspection device is configured to efficiently perform in-line total inspection for the melt-welded joint-type outer joint member.
    Type: Application
    Filed: July 23, 2015
    Publication date: August 17, 2017
    Applicant: NTN CORPORATION
    Inventors: Hiromi NAGAI, Daisuke KAGAWA, Naoki NAKAGAWA, Takashi IMANAKA, Yasuhiko SAKAKIBARA, Tokio UEDA, Masazumi KOBAYASHI, Tatsuro SUGIYAMA
  • Publication number: 20170160307
    Abstract: A sensor includes a first substrate, a first protruding portion provided on an upper surface of the first substrate, a support portion provided on the upper surface of the first substrate, a beam portion supported at a first end of the beam portion by the support portion, and a weight portion provided to a second end of the beam portion. The upper surface of the first protruding portion has a first surface and a second surface. The second surface is located above the first surface with the upper surface of the first substrate as a reference.
    Type: Application
    Filed: July 3, 2015
    Publication date: June 8, 2017
    Inventors: KIYOHIKO TAKAGI, RITSU NAKAYOSHI, YOUHEI SHIMADA, MASANORI YAMAUCHI, TAKASHI IMANAKA
  • Publication number: 20170089941
    Abstract: A sensor includes an upper lid layer, a lower lid layer, and a sensor layer disposed between the upper lid layer and the lower lid layer. One of the upper lid layer and the lower lid layer includes an insulative region mainly made of glass, a via-electrode covered with the insulative region, and an outer circumferential region mainly made of silicon and provided at an outer circumference of the insulative region. This sensor allows reducing outer dimensions of a wafer, which is a material for the sensor.
    Type: Application
    Filed: April 7, 2015
    Publication date: March 30, 2017
    Inventors: TAKASHI IMANAKA, TAKANORI AOYAGI, TAKAMI ISHIDA, HIROYUKI AIZAWA
  • Publication number: 20160258975
    Abstract: An acceleration sensor includes a detection device, an opposed electrode, and a top lid. The detection device includes an active layer, a base layer, an oxide layer disposed between the active layer and the base layer, a first insulating layer, a contact portion, and a self-check electrode. The first insulating layer is disposed on the active layer at a side opposite to the oxide layer and provided with a first opening. The contact portion is disposed on a part of the first insulating layer at a side opposite to the active layer and includes a first metal layer connected to the active layer through the first opening. The opposed electrode is disposed at a location opposing the self-check electrode, and the top lid supports the opposed electrode.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: ATSUHIRO FUJII, TAKASHI IMANAKA, YUICHI MIYOSHI, HIROYUKI AIZAWA
  • Publication number: 20160084870
    Abstract: A sensor includes a first substrate, a supporter connected to the first substrate, a weight facing the first substrate, a beam of which first end is connected to the supporter and of which second end is connected to the weight, a second substrate facing the weight, and a first projection disposed on the first substrate. This senor allows effectively preventing the beam from a breakage caused by the beam twisted due to a rotation of the weight when an impact is applied to the sensor. The sensor thus can improve anti-impact property.
    Type: Application
    Filed: April 17, 2014
    Publication date: March 24, 2016
    Inventors: Takashi Imanaka, Khai Jun Kek, Rie Okamoto, Tsuyoshi Sakaue, Hiroshi Nakatsuka
  • Patent number: 9231119
    Abstract: A sensor includes a circuit board, a wiring connection layer, a sensor element, and a conductive post. The circuit board has a first electrode. The wiring connection layer has second and third electrodes. The second electrode is connected to the first electrode. The sensor element has a fourth electrode. The conductive post connects the third electrode electrically with the fourth electrode. This sensor can be driven efficiently.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: January 5, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shigehiro Yoshiuchi, Takashi Imanaka, Takami Ishida, Satoshi Ohuchi, Hideo Ohkoshi, Katsuya Morinaka, Daisuke Nakamura, Hiroyuki Nakamura
  • Patent number: 8991248
    Abstract: An angular velocity sensor includes a support body, a retaining portion connected to the support body, first to fourth weights, first to fourth arms, a drive unit for driving the first to fourth arms, and a monitor unit for detecting displacements of the first to fourth arms. An X-axis, a Y-axis, and a Z-axis that are perpendicular to each other are defined. The detector unit is symmetrical with respect to both an axis parallel to the X-axis and an axis parallel to the Y-axis. This angular velocity sensor can cancel an undesired signal caused by external disturbances, such as acceleration or impact, thus detecting an angular velocity accurately.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takashi Imanaka, Hiroyuki Aizawa
  • Publication number: 20150059430
    Abstract: An inertial force sensor includes a fixed part, a beam connected to the fixed part, a plummet connected to another end of the beam and being displaceable due to inertial force to cause the beam to deform, a conductive part provided at the plummet, a strain-sensitive resistor provided at the beam for detecting a deformation of the first beam, first and second fault diagnostic electrodes provided at the fixed part, a first fault diagnostic wiring for connecting the first fault diagnostic electrode to the conductive part through the beam, and a second fault diagnostic wiring for connecting the second fault diagnostic electrode to the conductive part through the beam. The inertial force sensor does not continue to output an erroneous output signal when a crack occurs in the plummet, thus having high reliability.
    Type: Application
    Filed: April 18, 2013
    Publication date: March 5, 2015
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takashi Imanaka, Hiroyuki Aizawa, Takeshi Yokota
  • Publication number: 20130307094
    Abstract: A sensor includes a circuit board, a wiring connection layer, a sensor element, and a conductive post. The circuit board has a first electrode. The wiring connection layer has second and third electrodes. The second electrode is connected to the first electrode. The sensor element has a fourth electrode. The conductive post connects the third electrode electrically with the fourth electrode. This sensor can be driven efficiently.
    Type: Application
    Filed: March 5, 2012
    Publication date: November 21, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Shigehiro Yoshiuchi, Takashi Imanaka, Takami Ishida, Satoshi Ohuchi, Hideo Ohkoshi, Katsuya Morinaka, Daisuke Nakamura, Hiroyuki Nakamura
  • Publication number: 20130283914
    Abstract: An acceleration sensor includes a frame having a hollow space at an inside thereof, four beams extending from the frame to the hollow space, four plummets connected to ends of the four beams, and four sensing units provided on the four beams. One ends of the beams is connected to portions of the frame opposite to each other with respect to the hollow space. The two plummets face each other across the center of the hollow space. One ends of the other two beams are connected to portions of the frame opposite to each other with respect to the hollow space. The other two plummets face each other across the center of the hollow space. This acceleration sensor reduces variations and temporal changes in its sensitivity.
    Type: Application
    Filed: January 20, 2012
    Publication date: October 31, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Takashi Imanaka, Hiroyuki Aizawa, Hiroki Umehara
  • Publication number: 20120255358
    Abstract: An acceleration sensor includes a frame, a weight portion, an arm portion for connecting the frame and the weight portion, and a sensing portion for detecting a bend of the arm portion. The sensing portion includes a first electrode portion, a second electrode portion, and a strain resistor portion. The first electrode portion and the second electrode portion are provided on the weight portion. A first end of the strain resistor portion is connected to the first electrode portion, and a second end of the strain resistor portion is connected to the second electrode portion. The strain resistor portion is formed of a strain resistor film comprising a metal oxide. The strain resistor portion is formed in meander shape in the part which is nearer to the weight portion than the frame in the arm portion.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 11, 2012
    Applicant: Panasonic Corporation
    Inventor: Takashi IMANAKA
  • Publication number: 20120227489
    Abstract: An angular velocity sensor includes a support body, a retaining portion connected to the support body, first to fourth weights, first to fourth arms, a drive unit for driving the first to fourth arms, and a monitor unit for detecting displacements of the first to fourth arms. An X-axis, a Y-axis, and a Z-axis that are perpendicular to each other are defined. The detector unit is symmetrical with respect to both an axis parallel to the X-axis and an axis parallel to the Y-axis. This angular velocity sensor can cancel an undesired signal caused by external disturbances, such as acceleration or impact, thus detecting an angular velocity accurately.
    Type: Application
    Filed: January 27, 2011
    Publication date: September 13, 2012
    Inventors: Takashi Imanaka, Hiroyuki Aizawa
  • Patent number: 7835160
    Abstract: First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: November 16, 2010
    Assignee: Panasonic Corporation
    Inventors: Kenichi Yamamoto, Daisuke Suetsugu, Daido Komyoji, Takashi Imanaka, Hirotaka Hisamura
  • Publication number: 20100149777
    Abstract: First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.
    Type: Application
    Filed: September 27, 2006
    Publication date: June 17, 2010
    Inventors: Kenichi Yamamoto, Daisuke Suetsugu, Daido Komyoji, Takashi Imanaka, Hirotaka Hisamura