Abstract: A sound signal processor and a control method therefor that enable appropriate processing to be applied to each sound signal and the sound signals to be outputted to an appropriate output destination, while avoiding equipment connection complexity. A first processing unit performs first processing on a first sound signal to generate a second sound signal, and outputs the second sound signal to a mix bus, a second processing unit performs second processing on a third sound signal to generate a fourth sound signal, and outputs the fourth sound signal to the mix bus and a first output destination, and the mix bus mixes the second sound signal with the fourth sound signal to generate a fifth sound signal, and outputs the fifth sound signal to a second output destination.

Abstract: A semiconductor device includes a substrate, an adhesive layer formed on a lower surface of the substrate, a semiconductor element adhered to a lower surface of the adhesive layer, a through hole extending through the substrate and the adhesive layer and exposing a first electrode arranged on an upper surface of the semiconductor element, a via wiring formed in the through hole, a wiring layer formed on an upper surface of the substrate and electrically connected to the first electrode through the via wiring, and a protective insulation layer formed on the lower surface of the adhesive layer. The protective insulation layer covers an entirety of all side surfaces of the semiconductor element and a peripheral part of a lower surface of the semiconductor element and exposes a central part of the lower surface of the semiconductor element.

Abstract: The present invention relates to an oxyalkylene polymer including: a polyoxyalkylene chain containing an oxyethylene group; and a reactive silicon group which is bonded to the polyoxyalkylene chain via an organic group containing one group represented by —C(?O)NH—, wherein a number average molecular weight is from 3,000 to 150,000, a molecular weight distribution is 2.00 or less, an amount of the oxyethylene group is from 3 to 90% by mass, and the number of the reactive silicon groups per molecule is 0.5 or more.

Abstract: The curable composition is a curable composition containing an oxyalkylene polymer A having a reactive silicon group represented by —SiRa(X)3-a, wherein the oxyalkylene polymer A has 6 or more terminal groups per molecule; the terminal group contains at least one selected from the group consisting of a reactive silicon group represented by —SiRa(X)3-a, an active hydrogen-containing group, and an unsaturated group; the oxyalkylene polymer A has 0.3 or more reactive silicon groups per terminal group; and the number average molecular weight of the oxyalkylene polymer A is more than 25,000 and not more than 100,000.

Abstract: A catheter capable of suppressing separation of an end portion of a reinforcing body while applying a flat wire effective for making the catheter thin and have high strength to the reinforcing body includes a shaft having a lumen communicating from a distal end to a proximal end, in which the shaft includes a reinforcing member including a wire disposed on at least a part between an inner surface of the shaft forming the lumen and an outer surface of the shaft and braided in a tubular shape. The reinforcing body includes a round wire group including plural round wires each of which is a wire having a circular cross-section, and plural flat wires intersecting the round wire group, and a cross-sectional area ratio NB of a total cross-sectional area A of the round wire groups to a total cross-sectional area B of the flat wires is larger than 0.5.

Abstract: A sound signal processor and a control method therefor that enable appropriate processing to be applied to each sound signal and the sound signals to be outputted to an appropriate output destination, while avoiding equipment connection complexity. A first processing unit performs first processing on a first sound signal to generate a second sound signal, and outputs the second sound signal to a mix bus, a second processing unit performs second processing on a third sound signal to generate a fourth sound signal, and outputs the fourth sound signal to the mix bus and a first output destination, and the mix bus mixes the second sound signal with the fourth sound signal to generate a fifth sound signal, and outputs the fifth sound signal to a second output destination.

Abstract: The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.

Abstract: A distributed winding coil structure for automatic winding in a fractional slot three-phase AC motor has a stator in which the slot number 6N (N is a positive integer) of the slots positioned in the circumferential direction is greater than 1.5 times the pole number 2P (P is a positive integer), and the value obtained by dividing the slot number 6N by the pole number 2P is an irreducible fraction. Six coil groups are provided which include coils positioned in a wave winding inside a slot at a slot pitch of X or X+1, if the quotient obtained by dividing the slot number 6N by the pole number 2P is X (X is a positive integer), and each of the six coil groups is positioned so as to be offset by 60 degrees in the circumferential direction.

Abstract: A three-phase AC electric motor in which the value obtained by dividing the number of slots by the number of poles is an irreducible fraction, wherein there is implemented a stator having a lap-winding coil structure of a distributed winding that can be wound automatically. A stator of a fractional-slot-type three-phase AC electric motor in which the number of slots of slots positioned in the circumferential direction is more than 1.5 times the number of poles, and in which the value obtained by dividing the number of slots by the number of poles is an irreducible fraction, the stator being such that each of two or three coils having the same coil pitch comprises a plurality of sets of coils that are offset for each slot pitch and that are positioned inside the slots, and each of the plurality of sets of coils is positioned at a location mutually offset by 60 degrees in the circumferential direction.

Abstract: A catheter includes a shaft having a lumen extending from a distal end to a proximal end. The shaft includes a reinforcement body including a plurality of wires that are disposed on at least a part between an inner surface of the shaft forming the lumen and an outer surface of the shaft and that are braided in a tubular shape, and at least one radiopaque marker disposed between the reinforcement body and the outer surface of the shaft. An outer diameter difference, which is a difference between an outer diameter of the shaft in a portion where the marker is disposed and an outer diameter of the shaft in a portion adjacent to the marker in an axial direction of the shaft, is smaller than twice a thickness of the marker.

Abstract: A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Abstract: A laser chamber apparatus may include a pipe, an inner electrode extending along a longitudinal direction of the pipe and disposed in a through hole in the pipe, an outer electrode including a contact plate extending along the longitudinal direction of the pipe and being in contact with an outer circumferential surface of the pipe and a ladder section formed of bar members each having one end connected to the contact plate and juxtaposed along a longitudinal direction of the contact plate, and a leaf spring extending along the longitudinal direction of the pipe and configured to press the outer electrode against the pipe. The leaf spring may include leaf spring pieces separated by slits, and the leaf spring pieces may each include a bent section bent along the edge and are configured to press the bar members in a position shifted from the bent sections toward the edge.

Abstract: An anonymization apparatus (100) includes an anonymization unit (120), a plurality of attack units (131), a degree of safety calculation unit (133), and a parameter adjustment unit (140). The anonymization unit (120) generates anonymized data. Each of the plurality of attack units (131) generates re-identification data that corresponds to the anonymized data using a re-identification attack algorithm that differs from each other. The degree of safety calculation unit (133) calculates a degree of safety of each piece of the re-identification data that each of the plurality of attack units (131) generated. The parameter adjustment unit (140) adjusts an anonymization parameter in a case where at least one of the degrees of safety does not satisfy a degree of safety standard.

Abstract: In an image-recording device, a cartridge has a first chamber and an outlet. A mount body includes a tank, first and second sensors. The tank has an inlet, and a second chamber. The liquid in the first chamber flows into the second chamber via the outlet and the inlet. The first sensor outputs a first signal when a level of the liquid in the second chamber is higher than a first position, and outputs a second signal when the level is lower than the first position. The second sensor outputs a third signal when the level is higher than a second position higher than the first position, and outputs the fourth signal when the level is lower than the second position. A controller controls a notification device to issue a notification if a condition based on the first and second signals is satisfied.

Abstract: A lens holder which supports a projection lens is screwed and fixed to a bracket which supports a spatial light modulator. A positioning pin configured to position the lens holder in a left-right direction with respect to the bracket is inserted into a long hole which is formed in the bracket and extends in a lamp front-rear direction. The screwing and fixing is performed in a state where the positioning pin is inserted into the long hole and is appropriately moved in the lamp front-rear direction, so that the lens holder is restricted from being displaced in a left-right direction with respect to the bracket, and it is possible to finely adjust a positional relationship between the projection lens and the spatial light modulator in the lamp front-rear direction.

Abstract: A semiconductor device includes a logic circuit, a memory, and a storage device. The storage device has a first special information storage region into which special information is written before a solder reflow process, a second special information storage region into which special information for updating is written after the solder reflow process, and a data storage region. The first special information storage region is constituted by a memory cell having a high reflow resistance and in which data is retained even after the solder reflow process. The second special information storage region and the data storage region are constituted by memory cells having a low reflow resistance and in which data may not be retained during the solder reflow process.

Abstract: To provide a polyether polyol having a high degree of freedom in the design of a polyurethane foam, and capable of providing a polyol system solution excellent in storage stability. A polyether polyol having a polyoxyalkylene chain consisting of oxyalkylene units, and having a degree of unsaturation of at most 0.020 meq/g, a hydroxy value of from 1 to 80 mgKOH/g, a content of oxyethylene units of from 0 to 50 mass %, and a content of ultra-high molecular weight components which have molecular weights of from 12 to 46 times the number average molecular weight of at most 1,000 mass ppm. The number average molecular weight is a molecular weight as calculated as polystyrene measured by gel permeation chromatography (GPC) method, and the content of ultra-high molecular weight components is a value measured by high performance liquid chromatography (HPLC) method using a charged aerosol detector (CAD).

Abstract: Provided are an imaging device and an electronic apparatus capable of suppressing deterioration in performance due to charge accumulation. An imaging device includes: a photoelectric conversion layer having a first surface and a second surface located on an opposite side to the first surface; a first electrode located on a side of the first surface; and a second electrode located on a side of the second surface. In a thickness direction of the photoelectric conversion layer, when a region overlapping with the first electrode is defined as a first region, and a region deviating from the first electrode is defined as a second region, a first film thickness of the photoelectric conversion layer in at least a part of the first region is thinner than a second film thickness of the photoelectric conversion layer in the second region.