Patents by Inventor Takashi Kakegawa
Takashi Kakegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220396876Abstract: A showerhead includes a shower plate and a base member including a gas flow path, the base member fixing the shower plate. The showerhead includes gas supply members disposed at a gas diffusion space, the gas diffusion space being provided between the shower plate and the base member, the gas supply members being connected to the gas flow path, each of the gas supply members including outlets via which gas is radially discharged, and the gas supply members being arranged such that the gas discharged via the outlets of the gas supply members generates a rotational flow.Type: ApplicationFiled: June 2, 2022Publication date: December 15, 2022Inventors: Takuya KAWAGUCHI, Takanobu HOTTA, Kensaku NARUSHIMA, Hideaki YAMASAKI, Takashi KAKEGAWA, Toshio TAKAGI, Takaya YAMAUCHI
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Publication number: 20220396875Abstract: A showerhead includes a shower plate, a base member in which a gas flow passage is provided, the base member fixing the shower plate, a plurality of gas supply members disposed in a gas diffusion space and connected to the gas flow passage, the gas diffusion space being formed between the shower plate and the base member, and a flow adjusting plate disposed in the gas diffusion space, the flow adjusting plate being disposed on an outer periphery on an outer side from the plurality of gas supply members.Type: ApplicationFiled: June 2, 2022Publication date: December 15, 2022Inventors: Takanobu HOTTA, Takuya KAWAGUCHI, Hideaki YAMASAKI, Toshio TAKAGI, Takashi KAKEGAWA
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Patent number: 11306847Abstract: A valve device includes: valves configured to control a flow of processing gases supplied to a process vessel; a housing in which first flow paths through which the processing gases flow are formed; a heat diffuser configured to cover the housing and diffuse heat of the housing; a heating part configured to cover the housing covered with the heat diffuser and heat the housing via the heat diffuser; a supply configured to supply a coolant to a second flow path formed between the housing and the heat diffuser; and a controller configure to control the heating part to heat the housing to a first temperature when a predetermined process is performed on a target substrate, and before a start of a cleaning process of the process vessel, control the heating part to stop heating of the housing and control the supply to supply the coolant to the second flow path.Type: GrantFiled: August 12, 2019Date of Patent: April 19, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Tomohisa Kimoto, Yuichi Furuya, Takashi Kakegawa, Eiichi Komori, Hideaki Fujita, Hiroyuki Mori
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Publication number: 20200056724Abstract: A valve device includes: valves configured to control a flow of processing gases supplied to a process vessel; a housing in which first flow paths through which the processing gases flow are formed; a heat diffuser configured to cover the housing and diffuse heat of the housing; a heating part configured to cover the housing covered with the heat diffuser and heat the housing via the heat diffuser; a supply configured to supply a coolant to a second flow path formed between the housing and the heat diffuser; and a controller configure to control the heating part to heat the housing to a first temperature when a predetermined process is performed on a target substrate, and before a start of a cleaning process of the process vessel, control the heating part to stop heating of the housing and control the supply to supply the coolant to the second flow path.Type: ApplicationFiled: August 12, 2019Publication date: February 20, 2020Inventors: Tomohisa KIMOTO, Yuichi FURUYA, Takashi KAKEGAWA, Eiichi KOMORI, Hideaki FUJITA, Hiroyuki MORI
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Publication number: 20190078207Abstract: A gas supply apparatus is capable of intermittently supplying a source gas into a processing container via a buffer tank and a first high speed opening/closing valve. The gas supply apparatus includes: an evacuation line connected to a second side of the buffer tank and configured to evacuate the inside of the buffer tank; and a second high speed opening/closing valve provided on the evacuation line.Type: ApplicationFiled: September 6, 2018Publication date: March 14, 2019Inventors: Hironori Yagi, Takashi Kakegawa, Katsumasa Yamaguchi, Yuichi Furuya, Kennan Mo
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Patent number: 10156014Abstract: A gas treatment apparatus includes: a mounting part of a substrate; a gas diffusion plate of a processing gas; gas dispersion parts forming a diffusion space of the processing gas between the gas dispersion parts and the gas diffusion plate; and a flow path having an upstream side forming a common flow path of the gas dispersion parts and a downstream side connected to each of the gas dispersion parts, lengths from the common flow path to respective of the gas dispersion parts being aligned, wherein centers of the gas dispersion parts are located around a central portion of the diffusion space, and the gas dispersion parts are arranged along first circles with two or more of the gas dispersion parts arranged on each of the first circles and distances from the central portion of the diffusion space to the centers of gas dispersion parts being different from one another.Type: GrantFiled: December 15, 2017Date of Patent: December 18, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Kakegawa, Yuichi Furuya, Daisuke Toriya
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Publication number: 20180171478Abstract: A gas treatment apparatus includes: a mounting part of a substrate; a gas diffusion plate of a processing gas; gas dispersion parts forming a diffusion space of the processing gas between the gas dispersion parts and the gas diffusion plate; and a flow path having an upstream side forming a common flow path of the gas dispersion parts and a downstream side connected to each of the gas dispersion parts, lengths from the common flow path to respective of the gas dispersion parts being aligned, wherein centers of the gas dispersion parts are located around a central portion of the diffusion space, and the gas dispersion parts are arranged along first circles with two or more of the gas dispersion parts arranged on each of the first circles and distances from the central portion of the diffusion space to the centers of gas dispersion parts being different from one another.Type: ApplicationFiled: December 15, 2017Publication date: June 21, 2018Inventors: Takashi KAKEGAWA, Yuichi FURUYA, Daisuke TORIYA
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Publication number: 20150322571Abstract: A substrate processing apparatus for processing a substrate by using a plasma includes a processing chamber configured to airtightly accommodate a substrate, a lower electrode serving as a mounting table configured to mount thereon the substrate in the processing chamber, an upper electrode, serving as a shower plate having a plurality of gas supply openings, provided opposite to the substrate to be mounted on the mounting table, an insulating member disposed to surround an outer peripheral portion of the upper electrode, and a processing gas supply source configured to supply a processing gas into the processing chamber through the shower plate. The substrate processing apparatus further includes a heating unit provided at the insulating member to heat the insulating member.Type: ApplicationFiled: May 6, 2015Publication date: November 12, 2015Inventors: Hideaki YAMASAKI, Takashi KAKEGAWA, Einosuke TSUDA, Tomohiro OOTA
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Publication number: 20120115400Abstract: The method of the present invention includes: a first blasting step of carrying out blasting of the surface of a metal base material, such as a shower head or a processing container, by using a blasting material composed of a non-sublimable material (e.g. alumina); and a second blasting step of carrying out blasting of the surface of the metal base material, which has undergone the first blasting step, by using a blasting material composed of a sublimable material (e.g. dry ice). The first blasting step properly roughens the surface of the metal base material so that a film, which adheres to the surface during film-forming processing, hardly peels off. In addition, the second blasting step almost fully removes the residual non-sublimable blasting material adhering to the surface of the metal base material, thereby preventing the generation of particles deriving from the residual non-sublimable blasting material falling off the metal base material.Type: ApplicationFiled: January 17, 2012Publication date: May 10, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Takashi KAKEGAWA, Kensaku NARUSHIMA
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Patent number: 8133323Abstract: A film forming apparatus is provided with a chamber which defines a processing space for performing a film forming process to a substrate a stage arranged in the chamber for mounting the substrate thereon; a substrate heating unit arranged on the stage for heating the substrate; a shower head which is arranged to face the stage and has many gas injecting holes; a gas supply unit for supplying cooling unit arranged above the shower head for cooling the shower head; and a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.Type: GrantFiled: December 19, 2008Date of Patent: March 13, 2012Assignee: Tokyo Electron LimitedInventor: Takashi Kakegawa
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Patent number: 8128751Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: GrantFiled: March 16, 2009Date of Patent: March 6, 2012Assignee: Tokyo Electron LimitedInventors: Shigeru Kasai, Takashi Kakegawa
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Publication number: 20110061432Abstract: The method of the present invention includes: a first blasting step of carrying out blasting of the surface of a metal base material, such as a shower head or a processing container, by using a blasting material composed of a non-sublimable material (e.g. alumina); and a second blasting step of carrying out blasting of the surface of the metal base material, which has undergone the first blasting step, by using a blasting material composed of a sublimable material (e.g. dry ice). The first blasting step properly roughens the surface of the metal base material so that a film, which adheres to the surface during film-forming processing, hardly peels off. In addition, the second blasting step almost fully removes the residual non-sublimable blasting material adhering to the surface of the metal base material, thereby preventing the generation of particles deriving from the residual non-sublimable blasting material falling off the metal base material.Type: ApplicationFiled: September 16, 2010Publication date: March 17, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Takashi KAKEGAWA, Kensaku Narushima
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Publication number: 20100107977Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: ApplicationFiled: January 6, 2010Publication date: May 6, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Shigeru KASAI, Takashi KAKEGAWA
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Patent number: 7661386Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: GrantFiled: February 8, 2002Date of Patent: February 16, 2010Assignee: Tokyo Electron LimitedInventors: Shigeru Kasai, Takashi Kakegawa
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Publication number: 20090178614Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: ApplicationFiled: March 16, 2009Publication date: July 16, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Shigeru KASAI, Takashi KAKEGAWA
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Publication number: 20090104351Abstract: A film forming apparatus is provided with a chamber which defines a processing space for performing a film forming process to a substrate a stage arranged in the chamber for mounting the substrate thereon; a substrate heating unit arranged on the stage for heating the substrate; a shower head which is arranged to face the stage and has many gas injecting holes; a gas supply unit for supplying cooling unit arranged above the shower head for cooling the shower head; and a shower head heating unit arranged above the cooling unit for heating the shower head through the cooling unit.Type: ApplicationFiled: December 19, 2008Publication date: April 23, 2009Applicant: TOKYO ELECTRON LIMITEDInventor: Takashi KAKEGAWA
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Publication number: 20070175396Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: ApplicationFiled: March 27, 2007Publication date: August 2, 2007Inventors: Shigeru Kasai, Takashi Kakegawa
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Publication number: 20070131168Abstract: The invention relates to a gas supplying unit to be arranged to hermetically fit in an opening formed at a ceiling part of a processing container for conducting a process to a substrate. The gas supplying unit includes a plurality of nickel members. A large number of gas-supplying holes is formed at a lower surface of the gas supplying unit, a process gas is adapted to be supplied from the large number of gas-supplying holes into the processing container, and the plurality of nickel members is fixed to each other via an intermediate member for preventing sticking made of a material different from nickel.Type: ApplicationFiled: October 27, 2006Publication date: June 14, 2007Inventors: Hisashi Gomi, Tetsuya Saito, Takashi Kakegawa, Takahisa Mase, Makoto Koizumi, Kunihiro Tada, Satoshi Wakabayashi, Kensaku Narushima, Fang Cheng
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Publication number: 20050000423Abstract: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes, a gas-supplying mechanism that supplies a process gas into the chamber through the showerhead, and a showerhead-temperature controlling unit that controls a temperature of the showerhead.Type: ApplicationFiled: February 8, 2002Publication date: January 6, 2005Inventors: Shigeru Kasai, Takashi Kakegawa