Patents by Inventor Takashi Kayama

Takashi Kayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible metal-clad laminates and preparation of the same
    Patent number: 6340518
    Abstract: A flexible metal foil laminate sheet wherein a polyimide layer comprises a polyimide laminate having a three-layer structure in which thermoplastic polyimide layers are formed on both the surfaces of a polyimide film; metal foil layers are heated and pressed against both the sides of the polyimide laminate; and the thickness of the thermoplastic polyimide layer is 100% or more of an average roughness at 10 points on the surface of the metal foil which contacts the thermoplastic polyimide layer; and a method for manufacturing the flexible metal foil laminate sheet. According to the present invention, there can be manufactured the flexible metal foil laminate sheet in which a necessary and sufficient adhesive force is present in an interface between a metal foil and an insulating layer and which is excellent in heat resistance, chemical resistance, electrical properties and the like.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: January 22, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Mikio Kitahara, Minehiro Mori, Naoshi Mineta, Takashi Kayama
  • Solid printed substrate and electronic circuit package using the same
    Patent number: 5639990
    Abstract: The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers.
    Type: Grant
    Filed: January 26, 1994
    Date of Patent: June 17, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Kunio Nishihara, Youichi Hosono, Kunihiro Nagamine, Takashi Kayama, Takayuki Ishikawa
  • Fiber glass reinforced resin compositions
    Patent number: 4292235
    Abstract: There are provided fiber glass reinforced resin compositions comprising an acrylic copolymer consisting mainly of methyl methacrylate, fiber glass and an inorganic or organic compound containing pentavalent phosphorus atoms, whereby a deterioration phenomenon of whitening under the influence of water over a long period of time is remarkably improved.
    Type: Grant
    Filed: September 4, 1979
    Date of Patent: September 29, 1981
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Yasuo Uemoto, Shigenori Togami, Tsumoru Takano, deceased, Ichiro Ono, Takashi Kayama