Patents by Inventor Takashi Kidoguchi

Takashi Kidoguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with reduced electromigration
    Patent number: 7474008
    Abstract: A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 including a base film 1 and multiple wires 9; a semiconductor chip 5 mounted to the flexible wiring board 11; and a sealing resin 6 disposed between the flexible wiring board 11 and the semiconductor chip 5 so as to at least partially in contact with the wires 9. The sealing resin 6 contains a metal ion binder mixed thereto.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: January 6, 2009
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kazuhiko Fukuta, Kenji Toyosawa, Takashi Kidoguchi
  • Semiconductor device
    Publication number: 20050263909
    Abstract: A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 including a base film 1 and multiple wires 9; a semiconductor chip 5 mounted to the flexible wiring board 11; and a sealing resin 6 disposed between the flexible wiring board 11 and the semiconductor chip 5 so as to at least partially in contact with the wires 9. The sealing resin 6 contains a metal ion binder mixed thereto.
    Type: Application
    Filed: May 20, 2005
    Publication date: December 1, 2005
    Inventors: Kazuhiko Fukuta, Kenji Toyosawa, Takashi Kidoguchi