Abstract: In an information processing apparatus for managing or controlling a moving body used by a user based on a predetermined use condition, the moving body is configured to be switchable between an automatic driving mode and a manual driving mode, and the information processing apparatus comprises a use condition acquisition section for acquiring information related to the use condition of the moving body, a switch command acquisition section for acquiring a switch command for switching a driving mode of the moving body, and a switch judgment section for judging permission/prohibition of switching of the driving mode indicated by the switch command, based on the use condition of the moving body.

Abstract: A search execution device receives a trapdoor generated based on a user secret key in which a search auxiliary key and an attribute of a user are set and a search keyword, together with a key identifier (ID) that identifies the search auxiliary key. The search execution device decrypts an encrypted tag in which an attribute of a user who is allowed retrieval and a search word are set, using the received trapdoor and the search auxiliary key indicated by the received key ID, so as to identify a tag that is retrievable for the attribute set in the user secret key and contains a search word corresponding to the search keyword.

Abstract: A method for manufacturing a forged article, capable of improving the durability of a die for forging is provided. The method, includes forging a steel material, by using a die, by spraying or applying a water-soluble polymer lubricant containing 0.01 to 0.98 mass % of a water-soluble sulfate onto a working surface of the die, the die being made of a raw material having a constituent composition of by mass %, of 0.4 to 0.7% of C, 1.0% or less of Si, 1.0% or less of Mn, 4.0 to 6.0% of Cr, 2.0 to 4.0% of (Mo+½W), 0.5 to 2.5% of (V+Nb), 0 to 1.0% of Ni, 0 to 5.0% of Co, 0.02% or less of N, and a remnant composed of Fe and impurities, and having hardness of 55 to 60 HRC, and the die including a nitrided layer or a nitrosulfidized layer on the working surface thereof.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

Abstract: An optical semiconductor module including a base having installed on an optical fiber and an optical semiconductor element, and a package which houses the base on a bottom thereof and has a first side wall with an optical section through which the optical fiber is led and a second side wall facing the first side wall, where the base is cut off to form a curved surface with respect to the bottom at a lower corner on a side of the base facing the second side wall of the housing, and a ratio of r/t is from 0.4 to 1.0, where t is a thickness of the base, and r is a curvature radius of the curved surface.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Abstract: The invention provides a semiconductor laser module which can suppress overcurrent flowing into a thermo-module, wherein the thermo-module (5) carries out a heating action when a reverse current flows from lead pin (16f) through lead pin (16a), and contrarily carries out a cooling action when a current flows from the lead pin (16a) through the lead pin (16f). An overcurrent limiting means (20) is provided, which can suppress overcurrent flowing into the thermo-module (5) in its heating direction. The overcurrent limiting circuit (20) is provided with a bypass line (21), a resistor (22), and a diode (23). When a current flows in the heating direction, the diode (23) is turned on, whereby the current is shunted to the thermo-module (5) and bypass line (21) for flow, and accordingly, the overcurrent flowing into the thermo-module (5) can be effectively suppressed.

Abstract: An improved optical module mounted body is disclosed. The optical module mounted body comprising: a mounting board having a mounting surface with a plurality of holes formed thereon; an optical module placed on the mounting surface; and a securing member configured to secure the optical module, the securing member including an upper portion, a plurality of legs extending from the upper portion and a plurality of engagement portions formed at ends of the plurality of legs, wherein the optical module is held between the mounting board and the securing member such that the upper portion of the securing member abuts on an upper surface of the optical module, and wherein the plurality of legs are inserted in the plurality of holes, the plurality of engagement portion engaging with the mounting board.

Abstract: A package accommodates an LD device for emitting laser light with the center wavelength of which is in a range of 1300 to 1440 nm and airtight seals a light path extending from the LD device to an incident end of an optical fiber. The package is filled with a nitrogen gas at a standard atmospheric pressure with the amount of moisture limited to a value lower than 100000 ppm by volume or less. Therefore, the amount of moisture in the light path for laser light within the package is limited to 100000 ppm by volume or less.

Abstract: A semiconductor laser module is packaged on a mounting substrate through a thermal diffusion sheet member. The thermal diffusion sheet member is that having thermal conductivity where thermal conductivity in the surface direction is greater than that in the thickness direction. Specifically, the thermal diffusion sheet member is graphite, for example, and has a thermal conductivity of 300 W/m·K or greater in the surface direction.

Abstract: An improved optical module mounted body is disclosed. The optical module mounted body comprising: a mounting board having a mounting surface with a plurality of holes formed thereon; an optical module placed on the mounting surface; and a securing member configured to secure the optical module, the securing member including an upper portion, a plurality of legs extending from the upper portion and a plurality of engagement portions formed at ends of the plurality of legs, wherein the optical module is held between the mounting board and the securing member such that the upper portion of the securing member abuts on an upper surface of the optical module, and wherein the plurality of legs are inserted in the plurality of holes, the plurality of engagement portion engaging with the mounting board.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Abstract: A package accommodates an LD device for emitting laser light with the center wavelength of which is in a range of 1300 to 1440 nm and airtight seals a light path extending from the LD device to an incident end of an optical fiber. The package is filled with a nitrogen gas at a standard atmospheric pressure with the amount of moisture limited to a value lower than 100000 ppm by volume or less. Therefore, the amount of moisture in the light path for laser light within the package is limited to 100000 ppm by volume or less.

Abstract: A semiconductor laser module is packaged on a mounting substrate through a thermal diffusion sheet member. The thermal diffusion sheet member is that having thermal conductivity where thermal conductivity in the surface direction is greater than that in the thickness direction. Specifically, the thermal diffusion sheet member is graphite, for example, and has a thermal conductivity of 300 W/m.K or greater in the surface direction.

Abstract: The invention provides a semiconductor laser module which can suppress overcurrent flowing into a thermo-module, wherein the thermo-module (5) carries out a heating action when a reverse current flows from lead pin (16f) through lead pin (16a), and contrarily carries out a cooling action when a current flows from the lead pin (16a) through the lead pin (16f). An overcurrent limiting means (20) is provided, which can suppress overcurrent flowing into the thermo-module (5) in its heating direction. The overcurrent limiting circuit (20) is provided with a bypass line (21), a resistor (22), and a diode (23). When a current flows in the heating direction, the diode (23) is turned on, whereby the current is shunted to the thermo-module (5) and bypass line (21) for flow, and accordingly, the overcurrent flowing into the thermo-module (5) can be effectively suppressed.