Abstract: An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

Abstract: There is disclosed an electronic apparatus having a water-cooling structure suited for a compact, thin design in which structure is brought about a liquid-circulating flow rate necessary and sufficient for an increased amount of heat occurring in a heat-generating element due to an improved processing performance of the electronic apparatus. In the electronic apparatus, a water-cooling jacket 8 is thermally connected to a heat-generating element 7, a heat-dissipating pipe 9 being thermally connected to a heat-dissipating metal sheet 9 provided at a rear panel of a display case 2, a cooling medium liquid being circulated between the water-cooling jacket 8 and the heat-dissipating pipe 9 by a liquid-moving device 11. The necessary and sufficient circulating flow rate and the necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element 7 and the limit amount of heat dissipation from the surface of the housing.

Abstract: An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.

Abstract: A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, used in an electronic apparatus being small and thin in sizes, or a personal computer equipped with such the structure therein, comprising a ump of reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another, wherein those are disposed to form a closed loop and are filled up with cooling liquid therein, and &Dgr;Vs is equal to or greater than &Dgr;Vp, defining that inner volume change when the pump emits pulsation therefrom is the &Dgr;Vp, that pressure caused accompanying with the volume change is P, and that volume change due to the pressure P in flow passage of the cooling liquid &Dgr;Vp other than portion of the pump.

Abstract: A liquid cooling system and a personal computer equipped with it, being suitable for a semiconductor device, etc, generating high heat therefrom and suppressing influences following corrosion upon an apparatus, thereby ensuring healthiness of the system as a whole, wherein it comprises: a pump for supplying cooling liquid; a heat receiving jacket being supplied with the cooling liquid, and for receiving heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump, and the heat radiation pipe is made of material having corrosion resistance being higher than that of the heat receiving jacket.

Abstract: An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

Abstract: A method of relieving residual stress in a metal pipe comprises the steps of applying, by using a pressure medium, a low pressure to an interior of the metal pipe placed in dies, and applying, while preventing the buckling, an axial compression load to the pipe so as to effect a uniform plastic deformation of the entire metal pipe while maintaining the desired shape of the pipe, thereby relieving the residual stress in the metal pipe.