Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20° C. higher than a flow point of the glass composition.

Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber, and the oxide glass is softened and fluidized by heating at or lower than a heat decomposition temperature of the resin or the rubber.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10?7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Abstract: The present invention provides a heat dissipation film having high mechanical strength and flexibility, which is obtained by laminating a heat emission layer excellent in heat dissipation by infrared radiation, electrical insulation, and heat resistance on a metal film having excellent heat transfer efficiency. The present invention also provides a dispersion for heat emission layers for use in the production of the heat dissipation film, a method for producing a heat dissipation film using the dispersion for heat emission layers, and a solar cell including the heat dissipation film.

Abstract: Disclosed is an Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from Y2O3, La2O3, CeO2, Er2O3, and Yb2O3 in a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of Y2O3 and La2O3 in a total content of 0.1 to 1.0 mole percent.

Abstract: Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.

Abstract: A metal matrix composite having high corrosion resistance even if the coating film deposit amount is low is obtained. A metal matrix composite includes a metal or alloy substrate coated with a molten transition metal oxide glass, wherein the transition metal oxide glass has an n-type polarity. Further, a method for producing a metal matrix composite includes a step of applying a paste containing a transition metal oxide glass, an organic binder, and an organic solvent onto the surface of a metal or alloy substrate, and a step of forming a glass coating film on the substrate by heating to and maintaining a temperature equal to or higher than the softening point of the transition metal oxide glass after the application step, wherein the transition metal oxide glass has an n-type polarity.

Abstract: There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V2O5+BaO+P2O5+WO3?90 and V2O5>BaO>P2O5>WO3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.

Abstract: A structure includes a housing made of a dielectric substance, an electrically conductive member embedded in the housing so as to penetrate the housing, and an electrically conductive pattern which is provided on at least one of surfaces, in which the electrically conductive member lies by penetrating the housing, so that the electrically conductive pattern is electrically connected with the electrically conductive member. The electrically conductive pattern is made up of an electrically conductive film which has no self-shape retention property.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: The paste composition for an electrode are constituted with copper-containing particles having a peak temperature of an exothermic peak showing a maximum area in the simultaneous ThermoGravimetry/Differential Thermal Analysis of 280° C. or higher, glass particles, a solvent, and a resin. Further, the photovoltaic cell has an electrode formed by using the paste composition for a photovoltaic cell electrode.

Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

Abstract: Neutron-absorbing glass that can be input into water, wherein gadolinium oxide, boron oxide, and zinc oxide are contained and B2O3 is contained 42 to 65 mol % in terms of oxide above.

Abstract: The purpose of the present invention is to prevent the discoloration of an ink even when the ink is printed on a base to be printed and then exposed to a high-temperature environment. An ink including a glass composite, resin and a conducting agent, wherein the glass composite includes Ag2O in the range of 10 mass % to 60 mass %, V2O5 in the range of 5 mass % to 65 mass %, and TeO2 in the range of 15 mass % to 50 mass %, and the total content ratio of the Ag2O, V2O5, and TeO2 is at least 75 mass %.

Abstract: Disclosed is an Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from Y2O3, La2O3, CeO2, Er2O3, and Yb2O3 in a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of Y2O3 and La2O3 in a total content of 0.1 to 1.0 mole percent.

Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.