Abstract: A mobile terminal includes: a plurality of antenna inputs; a selecting unit configured to select one of the plurality of antenna inputs; a metal chassis used for holding a panel for display and maintaining mechanical strength of the panel; and a PIFA type antenna having a resonance pattern and a coaxial cable in which a coating removed portion is provided in a part in a manner that an external conductor is exposed, the PIFA type antenna being configured to fix the coating removed portion in a vicinity of an upper end of the metal chassis.

Abstract: A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion.

Abstract: This method for manufacturing a silicon wafer includes: a first heat treatment step of performing RTP treatment on the silicon wafer in an oxidizing atmosphere; a step of removing a region in the silicon wafer in which an oxygen concentration increases in the first heat treatment step; a second heat treatment step of performing, after performing this removing step, RTP treatment on the silicon wafer in a nitriding atmosphere or an Ar atmosphere; and a step of removing, after performing the second heat treatment step, a region in the silicon wafer in which an oxygen concentration decreases in the second heat treatment step. This method enables the manufacture of a silicon wafer in which latent defects such as OSF nuclei and oxygen precipitate nuclei existing in a PV region are destroyed or reduced, and that has a gettering site.

Abstract: An image pickup module includes: a wiring board including a first main surface on which chip electrodes are disposed and a second main surface on which the cable electrodes connected respectively to the chip electrodes via respective through wirings are disposed; an image pickup device chip including external electrodes bonded respectively to the chip electrodes; and a cable including conductive wires bonded respectively to the cable electrodes, in which all of the cable electrodes are disposed in a region not facing a region where the chip electrodes are disposed.

Abstract: A semiconductor device includes a first semiconductor chip and a second semiconductor chip, and wherein the first semiconductor chip includes a plurality of first bonding pads, and the second semiconductor chip includes a plurality of second bonding pads for coupling respectively to the first bonding pads by wire-bonding coupling and at least one third bonding pad for enabling relay coupling of a corresponding second bonding pad to at least one predetermined first bonding pad which is arranged along the second bonding pads and included in the first bonding pads without crossing another wire in the wire-bonding coupling.

Abstract: Problem to be Solved To provide a waste gasification melting apparatus which, even if a fuel gas is used as an alternative to a part of the coke, the temperature of the coke bed can be sufficiently raised, and a method using the same. Solution A waste gasification melting apparatus including an oxygen rich air supply apparatus 14 for blowing oxygen rich air into a tuyere 5, and a fuel gas supply apparatus 15 for supplying a fuel gas to the tuyere 5, and a controller 16 for controlling the oxygen rich air supply apparatus 14; the oxygen rich air supply apparatus 14 mixing air and oxygen to prepare oxygen rich air and supply the oxygen rich air to the tuyere 5; and the controller 16 controlling the amount of air to be mixed and the amount of oxygen to be mixed in the oxygen rich air supply apparatus 14 so as to give an oxygen concentration of the oxygen rich air in accordance with the amount of fuel gas supplied to the tuyere 5 from the fuel gas supply apparatus 15.

Abstract: TASK An inexpensive drill with high processing accuracy is provided. MEANS FOR SOLVING THE PROBLEM A chisel edge 11 of a tip 12 is removed, and a pyramid 1 is formed in that part, in which an inclination angle ?1 of each edge 4 extending from an apex P relative to a center line of the drill CL is formed to be larger than an angle ?2 that is one-half of a drill tip angle ?0, and so chisel steps are resolved and stable cutting becomes possible, thereby improving hole accuracy. Also, it is possible to form the pyramid 1 by grinding a tip of an existing drill by a grinder, so that a drill can be realized at a low cost.

Abstract: A semiconductor device includes a first semiconductor and second semiconductor chips mounted over a package substrate. The first semiconductor chip includes a plurality of first bonding pads which are arranged along one side of the first semiconductor chip. The second semiconductor chip includes a plurality of second bonding pads and at least one third bonding pad. The second bonding pads are arranged along one side of the second semiconductor chip and for coupling respectively to the first bonding pads by wire-bonding coupling. The at least one third bonding pad is for enabling relay coupling of a corresponding second bonding pad to at least one predetermined first bonding pad which is arranged along the second bonding pads and included in the first bonding pads without crossing another wire in the wire-bonding coupling.

Abstract: Systems and methods for human hand gesture recognition through a training mode and a recognition mode are disclosed. In the training mode, a user can move a handheld device with a hand gesture intended to represent a command. Sensors within the handheld device can record raw data, which can be processed to obtain a set of values corresponding to a set of discrete features, which is stored in a database and associated with the intended command. The process is repeated for various hand gestures representing different commands. In the recognition mode, the user can move the handheld device with a hand gesture. A computer system can compare a set of values corresponding to a set of discrete features derived from the hand gesture with the sets of values stored in the database, select a command with the closest match and displays and/or executes the command.

Abstract: Systems and methods for human hand gesture recognition through a training mode and a recognition mode are disclosed. In the training mode, a user can move a handheld device with a hand gesture intended to represent a command. Sensors within the handheld device can record raw data, which can be processed to obtain a set of values corresponding to a set of discrete features, which is stored in a database and associated with the intended command. The process is repeated for various hand gestures representing different commands. In the recognition mode, the user can move the handheld device with a hand gesture. A computer system can compare a set of values corresponding to a set of discrete features derived from the hand gesture with the sets of values stored in the database, select a command with the closest match and displays and/or executes the command.

Abstract: A semiconductor device includes a first semiconductor and second semiconductor chips mounted over a package substrate. The first semiconductor chip includes a plurality of first bonding pads which are arranged along one side of the first semiconductor chip. The second semiconductor chip includes a plurality of second bonding pads and at least one third bonding pad. The second bonding pads are arranged along one side of the second semiconductor chip and for coupling respectively to the first bonding pads by wire-bonding coupling. The at least one third bonding pad is for enabling relay coupling of a corresponding second bonding pad to at least one predetermined first bonding pad which is arranged along the second bonding pads and included in the first bonding pads without crossing another wire in the wire-bonding coupling.

Abstract: An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip.

Abstract: An emulation processing method causing a computer including a first and a second processor to execute emulation processing, the emulation processing method includes: calculate a next instruction address next to a received instruction address, and transmit, to the second processor, the calculated instruction address and instruction information read out on the basis of the calculated instruction address, transmit, to the first processor, a first instruction address that is an instruction address included in an execution result of executed processing, and execute processing based on the instruction information received from the first processor, when a second instruction address that is the instruction address received from the first processor is identical to the first instruction address, and read out instruction information on the basis of the first instruction address and execute processing based on the instruction information read out, when the second instruction address is not identical to the first instruct

Abstract: Various methods for performing energy management via a sub-system are provided. One example method includes receiving a user input while a main processing system is in a power saving mode and buffering a representation of the user input. The example method further includes, in response to receiving the user input, triggering a wake up of a main processing system from the power saving mode, and causing transmission of the representation of the user input to the main processing system for processing. Similar and related example methods and example apparatuses are also provided.

Abstract: The present invention, aiming at providing an exhaust gas treating system capable of increasing the exhaust gas treating volume, through increase of the diameter of the reaction tube, stabilizing the state of generation of plasma without requiring any water membrane, and improving the harmful matters removing performance by extending the plasma length, comprises a reaction tube 1 for introducing exhaust gas G, an upper electrode 2 disposed in the air on the top side of the reaction tube 1, a lower electrode 3 disposed on the bottom side of the reaction tube 1, and a spray nozzle 4 for spraying an electrolytic solution D between the upper electrode 2 and the lower electrode 3, so as to form a path of electric current between the electrodes 2, 3 and generate plasma P in the reaction tube 1, by spraying an electrolytic solution D between the upper electrode 2 and the lower electrode 3.

Abstract: A rotary electric machine includes a plurality of lead end holding grooves defined in insulators at an outer circumferential surface of a stator core, for guiding respective ends of coil leads therein. The lead end holding grooves are defined by ledges of the insulators. The ledges have respective lands which are convex in widthwise directions of the lead end holding groove.

Abstract: An image pickup module includes: a wiring board including a first main surface on which chip electrodes are disposed and a second main surface on which the cable electrodes connected respectively to the chip electrodes via respective through wirings are disposed; an image pickup device chip including external electrodes bonded respectively to the chip electrodes; and a cable including conductive wires bonded respectively to the cable electrodes, in which all of the cable electrodes are disposed in a region not facing a region where the chip electrodes are disposed.

Abstract: A waste-melting method, in which waste is fed into a waste-melting furnace (1), and the waste is thermally decomposed and combusted, and then, thermal decomposition and combustion residues are melted, is characterized in that coal coke and a biomass-molded material obtained by press-molding a biomass starting material while heating the biomass starting material to a temperature lower than the carbonization temperature thereof are fed into the melting furnace, a high-temperature grate is formed with coal coke at the bottom of the melting furnace, and the coal coke and the biomass-molded material are combusted and used as heat sources for melting.

Abstract: An image pickup apparatus having an image pickup device chip, a wiring board placed within a projection plane of the image pickup device chip and a reinforcement member fixed in abutment with at least a part of the wiring board. An endoscope having the image pickup apparatus. A method for manufacturing the image pickup apparatus.

Abstract: A tray for film formation by a CVD method includes a tray main body (2) and a supporting member (3) mounted on the tray main body (2) for supporting a silicon wafer (5). The supporting member (3) has a holding portion (3c), on which the silicon wafer (5) is directly placed. The holding portion (3c) has its lower surface (3d) apart from a surface (2a) of the tray main body that is opposed to and apart from the supported silicon wafer (5), whereby the thickness distribution of an oxide film formed on the silicon wafer can be made uniform. The tray has a structure for reducing a contact area between the supporting member (3) and the tray main body (2), with the holding portion (3c) having a tilted surface with its inner circumferential side closer to the tray main body surface (2a) that is opposed to the silicon wafer.