Patents by Inventor Takashi Okagawa
Takashi Okagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11177314Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.Type: GrantFiled: July 6, 2020Date of Patent: November 16, 2021Assignee: CANON KABUSHIKI KAISHAInventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
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Publication number: 20200335547Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.Type: ApplicationFiled: July 6, 2020Publication date: October 22, 2020Inventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
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Patent number: 10763298Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.Type: GrantFiled: October 24, 2017Date of Patent: September 1, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
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Patent number: 10475829Abstract: A semiconductor apparatus includes a conductive member including a polycrystalline silicon layer having a first, second and third portions, an interlayer insulation film that covers the conductive member, a first silicon nitride layer arranged between the interlayer insulation film and the third portion, a second silicon nitride layer arranged between the interlayer insulation film and the first portion and between the interlayer insulation layer and the second portion, a first contact plug disposed above the first portion and penetrating the interlayer insulation film and the second silicon nitride layer to connect to the conductive member, and a second contact plug disposed above the second portion and penetrating the interlayer insulation film and the second silicon nitride layer to connect to the conductive member. The first silicon nitride layer is disposed between the first and second contact plugs, and apart from the first and second contact plugs.Type: GrantFiled: July 3, 2018Date of Patent: November 12, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Mitsuhiro Yomori, Takehito Okabe, Nobuaki Kakinuma, Takashi Okagawa
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Patent number: 10461119Abstract: A solid-state imaging device includes a light-shielding layer that is disposed in a pixel region containing a pixel including a photoelectric conversion element and a charge holding portion and a peripheral region in which a signal from the pixel is processed and that is electrically connected to a substrate at a contact portion in the peripheral region, a first insulating layer that has an end portion between the charge holding portion and the contact portion in plan view and that is disposed between the substrate and the light-shielding layer, and a first insulating member that is disposed on a side surface of the end portion of the first insulating layer and that buffers a step due to the end portion. A portion of the light-shielding layer overlapping the first insulating member in the plan view has an upper surface having a shape following a shape of the first insulating member.Type: GrantFiled: November 8, 2017Date of Patent: October 29, 2019Assignee: Canon Kabushiki KaishaInventors: Sho Suzuki, Kentaro Suzuki, Takashi Okagawa
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Patent number: 10431617Abstract: There is provided a photoelectric conversion device in which a distance from a main surface to an inner surface of a first part of a dielectric film is smaller than a distance from the main surface to a top surface of a light shielding member, a distance from the main surface to an outer surface of the first part is smaller than a distance from the main surface to an outer surface of a second part of the dielectric film, an outer surface of a third part inclines to the top surface, a surface of a dielectric member inclines to the top surface, between the dielectric film and the top surface in a normal direction, and the dielectric member has a refractive index lower than a refractive index of the dielectric film.Type: GrantFiled: February 26, 2018Date of Patent: October 1, 2019Assignee: Canon Kabushiki KaishaInventors: Akihiro Kawano, Yoshiyuki Nakagawa, Masao Ishioka, Takashi Okagawa
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Publication number: 20190267421Abstract: Image capturing device includes semiconductor substrate having photoelectric converters in light-receiving area and light-shielded area, insulating film arranged above principal face of the substrate and having holes arranged above the photoelectric converters, waveguide portions arranged in the holes, connecting portion connecting the waveguide portions above the insulating film, light-shielding film arranged on the connecting portion having opening in the light-receiving area, SiN film arranged on the light-shielding film so that the opening is arranged between the SiN film and the substrate in the light-receiving area, and insulator film having portion located in the opening and having portion located between the light-shielding film and the SiN film. Distance between upper face of the light-shielding film and the principal face is smaller than distance between lower face of the SiN film and the principal face.Type: ApplicationFiled: February 19, 2019Publication date: August 29, 2019Inventors: Sho Suzuki, Mitsuhiro Yomori, Takehito Okabe, Takashi Okagawa
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Publication number: 20190019825Abstract: A semiconductor apparatus includes a conductive member including a polycrystalline silicon layer having a first, second and third portions, an interlayer insulation film that covers the conductive member, a first silicon nitride layer arranged between the interlayer insulation film and the third portion, a second silicon nitride layer arranged between the interlayer insulation film and the first portion and between the interlayer insulation layer and the second portion, a first contact plug disposed above the first portion and penetrating the interlayer insulation film and the second silicon nitride layer to connect to the conductive member, and a second contact plug disposed above the second portion and penetrating the interlayer insulation film and the second silicon nitride layer to connect to the conductive member. The first silicon nitride layer is disposed between the first and second contact plugs, and apart from the first and second contact plugs.Type: ApplicationFiled: July 3, 2018Publication date: January 17, 2019Inventors: Mitsuhiro Yomori, Takehito Okabe, Nobuaki Kakinuma, Takashi Okagawa
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Publication number: 20180247967Abstract: There is provided a photoelectric conversion device in which a distance from a main surface to an inner surface of a first part of a dielectric film is smaller than a distance from the main surface to a top surface of a light shielding member, a distance from the main surface to an outer surface of the first part is smaller than a distance from the main surface to an outer surface of a second part of the dielectric film, an outer surface of a third part inclines to the top surface, a surface of a dielectric member inclines to the top surface, between the dielectric film and the top surface in a normal direction, and the dielectric member has a refractive index lower than a refractive index of the dielectric film.Type: ApplicationFiled: February 26, 2018Publication date: August 30, 2018Inventors: Akihiro Kawano, Yoshiyuki Nakagawa, Masao Ishioka, Takashi Okagawa
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Publication number: 20180138234Abstract: A solid-state imaging device includes a light-shielding layer that is disposed in a pixel region containing a pixel including a photoelectric conversion element and a charge holding portion and a peripheral region in which a signal from the pixel is processed and that is electrically connected to a substrate at a contact portion in the peripheral region, a first insulating layer that has an end portion between the charge holding portion and the contact portion in plan view and that is disposed between the substrate and the light-shielding layer, and a first insulating member that is disposed on a side surface of the end portion of the first insulating layer and that buffers a step due to the end portion. A portion of the light-shielding layer overlapping the first insulating member in the plan view has an upper surface having a shape following a shape of the first insulating member.Type: ApplicationFiled: November 8, 2017Publication date: May 17, 2018Inventors: Sho Suzuki, Kentaro Suzuki, Takashi Okagawa
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Publication number: 20180122852Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.Type: ApplicationFiled: October 24, 2017Publication date: May 3, 2018Inventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
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Patent number: 8716770Abstract: A solid-state imaging apparatus comprises: a plurality of photoelectric conversion elements for converting light into an electric charge, including a first photoelectric conversion element; a first semiconductor region from which the electric charge is transferred from a first photoelectric conversion element; an amplifying MOS transistor including a gate electrode connected to the first semiconductor region to amplify the potential of the first semiconductor region; an insulating film; a metal wiring layer above the insulating film; a local interconnect of a first conductor, formed in the insulating film, for connecting the gate electrode of the amplifying MOS transistor to the first semiconductor region not through the metal wiring layer; a second semiconductor region, different from the first semiconductor region; and a second conductor for connecting the second semiconductor region to at least a part of the metal wiring layer.Type: GrantFiled: May 7, 2010Date of Patent: May 6, 2014Assignee: Canon Kabushiki KaishaInventor: Takashi Okagawa
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Patent number: 8304278Abstract: A photoelectric conversion apparatus includes: a first interlayer insulation film disposed on a semiconductor substrate; a first plug disposed in a first hole in the first interlayer insulation film, and serving to electrically connect between a plurality of active regions disposed in the semiconductor substrate, between gate electrodes of a plurality of MOS transistors, or between the active region and the gate electrode of the MOS transistor, not through the wiring of the wiring layer; and a second plug disposed in a second hole in the first interlayer insulation film, the second plug being electrically connected to the active region, wherein a wiring arranged over the second plug and closest to the second plug is electrically connected to the second plug, and the wiring electrically connected to the second plug forms a portion of dual damascene structure. By such a structure, incidence efficiency of light onto a photoelectric conversion element can be improved.Type: GrantFiled: October 14, 2010Date of Patent: November 6, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroaki Naruse, Takashi Okagawa, Ryuichi Mishima, Nobuhiko Sato, Hiroshi Yuzurihara
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Publication number: 20110027934Abstract: A photoelectric conversion apparatus includes: a first interlayer insulation film disposed on a semiconductor substrate; a first plug disposed in a first hole in the first interlayer insulation film, and serving to electrically connect between a plurality of active regions disposed in the semiconductor substrate, between gate electrodes of a plurality of MOS transistors, or between the active region and the gate electrode of the MOS transistor, not through the wiring of the wiring layer; and a second plug disposed in a second hole in the first interlayer insulation film, the second plug being electrically connected to the active region, wherein a wiring arranged over the second plug and closest to the second plug is electrically connected to the second plug, and the wiring electrically connected to the second plug forms a portion of dual damascene structure. By such a structure, incidence efficiency of light onto a photoelectric conversion element can be improved.Type: ApplicationFiled: October 14, 2010Publication date: February 3, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Hiroaki Naruse, Takashi Okagawa, Ryuichi Mishima, Nobuhiko Sato, Hiroshi Yuzurihara
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Publication number: 20100320517Abstract: A solid-state imaging apparatus comprises: a plurality of photoelectric conversion elements for converting light into an electric charge, including a first photoelectric conversion element; a first semiconductor region from which the electric charge is transferred from a first photoelectric conversion element; an amplifying MOS transistor including a gate electrode connected to the first semiconductor region to amplify the potential of the first semiconductor region; an insulating film; a metal wiring layer above the insulating film; a local interconnect of a first conductor, formed in the insulating film, for connecting the gate electrode of the amplifying MOS transistor to the first semiconductor region not through the metal wiring layer; a second semiconductor region, different from the first semiconductor region; and a second conductor for connecting the second semiconductor region to at least a part of the metal wiring layer.Type: ApplicationFiled: May 7, 2010Publication date: December 23, 2010Applicant: CANON KABUSHIKI KAISHAInventor: Takashi Okagawa
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Patent number: 7842988Abstract: A noise generated by a constitution of widening an incident aperture of light of a photoelectric conversion element is reduced. In a manufacturing method of a photoelectric conversion device, first electroconductor arranged in a first hole arranged in the first interlayer insulation layer electrically connects a first semiconductor region to a gate electrode of an amplifying MOS transistor not through wirings included in a wiring layer. Moreover, a second electroconductor electrically connects a second semiconductor region different from the first semiconductor region to a wiring. In a constitution of that second electroconductor, a third electroconductor arranged in a second hole arranged in the first interlayer insulation layer and a fourth electroconductor arranged in a third hole arranged in the second interlayer insulation layer are stacked and electrically connected to each other.Type: GrantFiled: May 21, 2010Date of Patent: November 30, 2010Assignee: Canon Kabushiki KaishaInventors: Takashi Okagawa, Hiroaki Naruse, Hiroshi Yuzurihara, Shigeru Nishimura, Takeshi Aoki, Yuya Fujino
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Patent number: 7838918Abstract: A photoelectric conversion apparatus includes: a first interlayer insulation film disposed on a semiconductor substrate; a first plug disposed in a first hole in the first interlayer insulation film, and serving to electrically connect between a plurality of active regions disposed in the semiconductor substrate, between gate electrodes of a plurality of MOS transistors, or between the active region and the gate electrode of the MOS transistor, not through the wiring of the wiring layer; and a second plug disposed in a second hole in the first interlayer insulation film, the second plug being electrically connected to the active region, wherein a wiring arranged over the second plug and closest to the second plug is electrically connected to the second plug, and the wiring electrically connected to the second plug forms a portion of dual damascene structure. By such a structure, incidence efficiency of light onto a photoelectric conversion element can be improved.Type: GrantFiled: February 6, 2008Date of Patent: November 23, 2010Assignee: Canon Kabushiki KaishaInventors: Hiroaki Naruse, Takashi Okagawa, Ryuichi Mishima, Nobuhiko Sato, Hiroshi Yuzurihara
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Publication number: 20100230728Abstract: A noise generated by a constitution of widening an incident aperture of light of a photoelectric conversion element is reduced. In a manufacturing method of a photoelectric conversion device, first electroconductor arranged in a first hole arranged in the first interlayer insulation layer electrically connects a first semiconductor region to a gate electrode of an amplifying MOS transistor not through wirings included in a wiring layer. Moreover, a second electroconductor electrically connects a second semiconductor region different from the first semiconductor region to a wiring. In a constitution of that second electroconductor, a third electroconductor arranged in a second hole arranged in the first interlayer insulation layer and a fourth electroconductor arranged in a third hole arranged in the second interlayer insulation layer are stacked and electrically connected to each other.Type: ApplicationFiled: May 21, 2010Publication date: September 16, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Takashi Okagawa, Hiroaki Naruse, Hiroshi Yuzurihara, Shigeru Nishimura, Takeshi Aoki, Yuya Fujino
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Patent number: 7749788Abstract: A noise generated by a constitution of widening an incident aperture of light of a photoelectric conversion element is reduced. In a manufacturing method of a photoelectric conversion device, first electroconductor arranged in a first hole arranged in the first interlayer insulation layer electrically connects a first semiconductor region to a gate electrode of an amplifying MOS transistor not through wirings included in a wiring layer. Moreover, a second electroconductor electrically connects a second semiconductor region different from the first semiconductor region to a wiring. In a constitution of that second electroconductor, a third electroconductor arranged in a second hole arranged in the first interlayer insulation layer and a fourth electroconductor arranged in a third hole arranged in the second interlayer insulation layer are stacked and electrically connected to each other.Type: GrantFiled: August 17, 2007Date of Patent: July 6, 2010Assignee: Canon Kabushiki KaishaInventors: Takashi Okagawa, Hiroaki Naruse, Hiroshi Yuzurihara, Shigeru Nishimura, Takeshi Aoki, Yuya Fujino
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Publication number: 20090135481Abstract: The directions of amplitude of polarized light passing through a polarizer are concentric around a position. The polarizer is disposed on the surface of a pupil such that the position lies exactly on the center of the surface of the pupil. Rays of luminous flux of illumination light converted into polarized light by the polarizer are converged onto a wafer with concentric planes of polarization with respect to an optical axis. The illumination light is therefore incident on a photoresist as s-polarized light. Thus, the amount of light entering the photoresist is less likely to depend upon the angle of incidence. Consequently, the contrast of an optical image formed in the photoresist is improved, and hence, resolution characteristics are improved.Type: ApplicationFiled: January 26, 2009Publication date: May 28, 2009Applicant: RENESAS TECHNOLOGY CORP.Inventors: Tetsuya Yamada, Atsushi Ueno, Takashi Okagawa