Abstract: [Object of the Invention] An object of the present invention is to provide a method for integrating multi-layer sheet fabric pieces for use in a chemical protective suit, wherein fewer fabrication man-hours are required than in the conventional method.

Abstract: A projector includes: an image projection unit that projects an image; a trapezoidal correction unit that performs trapezoidal correction on the image projected by the image projection unit; a nonvolatile storage unit that stores the amount of previous trapezoidal correction and a predetermined acceptable value associated with the amount of previous trapezoidal correction, the amount of previous trapezoidal correction being used immediately before at least one of when the projector is turned off and when signal processing is changed; and an adjustment unit that sets, if the amount of previous trapezoidal correction is greater than the predetermined acceptable value, the amount of trapezoidal correction to be performed by the trapezoidal correction unit at a predetermined standard value or zero after the projector is activated or after the signal processing is changed.

Abstract: A projection system includes: a screen having screen specific authentication information; and a projector having a function of acquiring the screen specific authentication information and, based on the acquired authentication information, carrying out an authentication process for setting the projector to a usable condition.

Abstract: A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening portion formed therein to expose the conductor portion. The opening portion is formed in such a manner that the edge thereof is positioned along and outside the outer shape of the chip except for a specific corner portion, and that the edge in the specific corner portion is positioned on a side of or inside the outer shape of the chip.

Abstract: A projector can be connected in cascade to another projector. Either a first mode for the projector to operate as a leading projector in the cascade connection or a second mode for the projector to operate as a second or subsequent projector in the cascade connection is set. The projector is made available for use on authentication by an authentication unit or on reception of use permission information of the projector by a receiving unit.

Abstract: A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.

Abstract: A projector includes: a light source; a light modulation device which forms an image by modulating light emitted from the light source according to inputted image information; a projection optical system which projects the image formed by the light modulation device; a projection position controlling unit which controls the projection position of the image by shifting the projection optical system in the left-right direction with respect to the projection direction; a pair of left and right speakers which output sounds corresponding to audio information inputted with the image information; and a sound volume adjusting unit which separately adjusts sound volume levels of the sounds outputted from the pair of the speakers based on the control condition of the projection position provided by the projection position controlling unit.

Abstract: A wiring substrate of the present invention includes such a structure that a plurality of connection pads and leading wiring portions connected to the plurality of connection pads respectively are arranged to an insulating layer of a surface layer side, and the leading wiring portions are arranged to be bended from the connection pads, and a solder layer to protrude upward is provided on the connection pads respectively. A solder on the leading wiring portions moves to the bend portion side, and thus the solder layer to protrude upward is formed on the connection pads.

Abstract: According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough.

Abstract: A glass composition comprising: (A) TeO2 (50-95 mol %); (B) B2O3 (1-33 mol %); (C) ZnO (1-37 mol %); (D) Bi2O3 (1-18 mol %); (E) P2O5 (0-15 mol %); (F) R2O (0-13 mol %), where R represents at least one element selected from the group consisting of Li, Na, and K; (G) MO (0-13 mol %), where M represents at least one element selected from the group consisting of Mg, Ca, Sr, and Ba; (H) TiO2 (0-13 mol %); (I) Nb2O5 (0-10 mol %); (J) Ta2O5 (0-13 mol %); (K) L2O3 (0-11 mol %), where L represents at least one element selected from the group consisting of yttrium and lanthanoids; and (L) the total amount of P2O5, R2O, MO, TiO2, Nb2O5, Ta2O5, and L2O3 described in (E) to (K), respectively, is 0-15 mol %.

Abstract: A semiconductor package includes a first board, a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being mounted on the first board with the first face facing the first board, an insulating film provided on the second face of the semiconductor chip, and a second board stacked on the first board. A bump provided on a face of the second board facing the first board is connected to a pad provided on a face of the first board facing the second board and a gap is formed between the first board and the second board. The semiconductor chip and the insulating film are provided in the gap.

Abstract: A semiconductor package includes a board, an under fill resin layer provided on the board, and a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being flip-chip mounted on the board via the under fill resin layer with the first face facing the board. The semiconductor chip is covered with the under fill resin layer over the first face and from the first face to an edge part of the second face.

Abstract: In a projector, if an image signal other than the currently selected image signal is input, the image signal is switched to the other image signal according to the position of a shutter.

Abstract: A projector includes: an image projection unit that projects an image; a trapezoidal correction unit that performs trapezoidal correction on the image projected by the image projection unit; a nonvolatile storage unit that stores the amount of previous trapezoidal correction and a predetermined acceptable value associated with the amount of previous trapezoidal correction, the amount of previous trapezoidal correction being used immediately before at least one of when the projector is turned off and when signal processing is changed; and an adjustment unit that sets, if the amount of previous trapezoidal correction is greater than the predetermined acceptable value, the amount of trapezoidal correction to be performed by the trapezoidal correction unit at a predetermined standard value or zero after the projector is activated or after the signal processing is changed.

Abstract: A projector includes: an image projection unit that projects a projection image generated based on input image data onto a projection surface; a projection distance measurement unit that measures a projection distance from the projector to the projection surface; and an adjusting unit that adjusts the project ion image in accordance with the projection distance so that the projection image is projected onto the projection surface under a predetermined projection condition.

Abstract: A projector includes: an image projecting section that projects an image; a ruled line storage section that stores ruled line data of a ruled line; a ruled line reading unit that reads the ruled line data of the ruled line from the ruled line storage section so as to make the image projecting section project the ruled line corresponding to the ruled line data; a ruled line editing unit that performs editing for changing the structure of the projected ruled line; and a storage processing unit that makes the ruled line storage section store the edited ruled line data corresponding to the ruled line changed by the ruled line editing unit.

Abstract: A semiconductor memory maintains securely the stored contents in the memory cells, and it is written with data reliably even in a case where a relatively low supply voltage is applied. A memory cell M00 comprises a pair of inverters cross-coupled with each other, a first switching unit provided between bit line BL and the output terminal of one of the inverters, and a second switching unit provided between bit line XBL and the output terminal of the other inverter. The first switching unit and the second switching unit are controlled to be conductive such that the conductance of the switches be larger for the writing operation than for the reading operation.

Abstract: An ink composition having a suitably-adjusted hue and causing no decomposition of dyes during storage is provided. The ink composition contains a compound (a) represented by the following formula (1), an ingredient (c) and moisture-retentive agents, characterized by being from 0.1 mass % to lower than 7.0 mass % in content of the compound represented by the formula (1), 10.0 mass % or lower in content of a moisture-retentive agent having 3 or more hydroxyl groups (b) and lower than 30.0 in molar ratio of the moisture-retentive agent having 3 or more hydroxyl groups to the compound represented by the formula (1): wherein each of Ar1 and Ar2 preferably represents an aromatic heterocyclic group, each of A1 and A2 represents a hydrogen atom or a substituent, Y represents —OM or —NR1R2, M represents a hydrogen atom or a metal ion and each of R1 and R2 represents a hydrogen atom, an alkyl group, an aryl group, a heterocyclic group or the like. The ingredient (c) is at least one compound selected from C.I.

Abstract: An ink composition is provided which does not undergo decomposition or fading of colorants even when stored under high-temperature environment. An ink composition which contains a compound represented by the following general formula (1) and a humectant, wherein the content of the compound represented by the general formula (1) is from 0.1% by mass to less than 7.0% by mass, the content of the humectant having 3 or more hydroxyl groups is 8.0% by mass or less, and the molar ratio of the humectant having 3 or more hydroxyl groups/the compound represented by the general formula (1) being less than 15.

Abstract: A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.