Abstract: A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness in the second re-grinding processing.

Abstract: A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

Abstract: A cleaning method that peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed, the cleaning method comprising: removing the protectant by supplying a solvent of the protectant from a solvent supply part to the bonding surface of the substrate to be processed; and removing the peeling agent by absorbing the peeling agent, which has been peeled from the bonding surface of the substrate to be processed, using a peeling agent absorption part.

Abstract: A cleaning device peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed. The cleaning device includes: a support part that supports the substrate to be processed; a solvent supply part that supplies a solvent of the protectant to the bonding surface of the substrate to be processed supported by the support part; and a peeling agent absorption part that absorbs and removes the peeling agent which has been peeled from the bonding surface of the substrate to be processed.

Abstract: Provided is a bonding system, which includes: a processing station in which specified processes are performed on a first substrate and a second substrate; and a carry-in/carry-out station in which the first substrate, the second substrate or a laminated substrate obtained by bonding the first substrate and the second substrate is carried into and out of the processing station. The processing station includes: a first processing apparatus configured to coat the first substrate with the bonding agent using a bonding agent injecting part; a second processing apparatus provided with a bevel cleaning unit for cleaning a bevel portion of the first substrate coated with the bonding agent; and a bonding apparatus configured to bond the first substrate and the second substrate through the bonding agent and a release agent. The first processing apparatus or the second processing apparatus further includes a release agent injection part for injecting the release agent.

Abstract: A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

Abstract: A peeling device according to the present disclosure includes a holding unit, a plurality of suction moving units, a state detection unit and a control unit. The holding unit is configured to hold a first substrate of a superposed substrate having the first substrate and a second substrate joined. The suction moving units are configured to suction-hold the second substrate of the superposed substrate and move the second substrate in a direction away from a surface of the first substrate. The state detection unit is configured to detect a peeled-off state of the second substrate from the first substrate. The control unit is configured to control operation timings of the suction moving units so that the second substrate is peeled off from the first substrate gradually from one end of the second substrate toward the other end thereof, based on the peeled-off state detected by the state detection unit.

Abstract: An electronic learning aid includes a circuit for automatically developing problems, a display for displaying the problems, an input for introducing a calculated answer, and a determination circuit for detecting whether the introduced answer is correct. The display includes a first display unit of plural digits for displaying the problems, and a second display unit of plural digits for displaying the problem number, the score, the correct answer number, and the exercise number.

Abstract: An electronic learning aid is disclosed, which automatically develops and displays problems, and functions to compare an answer introduced by a student with a correct answer stored in the electronic learning aid. A mode selection switch is provided for selectively placing the electronic learning aid in an exercise mode and in an examination (test) mode. In the exercise mode, a symbol display is energized for displaying information as to whether the introduced answer is correct or not upon every introduction of the answer by the student. In the examination (test) mode, the symbol display is not conducted, and a percentage score is displayed after completion of a series of problems.