Patents by Inventor Takashi Sampei
Takashi Sampei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10532430Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb?ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.Type: GrantFiled: January 20, 2016Date of Patent: January 14, 2020Assignee: DISCO CORPORATIONInventor: Takashi Sampei
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Patent number: 10406631Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.Type: GrantFiled: May 24, 2018Date of Patent: September 10, 2019Assignee: Disco CorporationInventors: Takashi Sampei, Yukiyasu Masuda
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Publication number: 20180339365Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.Type: ApplicationFiled: May 24, 2018Publication date: November 29, 2018Inventors: Takashi Sampei, Yukiyasu Masuda
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Patent number: 9724783Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.Type: GrantFiled: November 30, 2015Date of Patent: August 8, 2017Assignee: Disco CorporationInventors: Wataru Odagiri, Kouichi Nehashi, Joel Koerwer, Hironari Ohkubo, Shuichiro Tsukiji, Ryugo Oba, Kentaro Odanaka, Takashi Sampei
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Patent number: 9685378Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.Type: GrantFiled: September 13, 2016Date of Patent: June 20, 2017Assignee: Disco CorporationInventors: Toshiyuki Yoshikawa, Takashi Sampei
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Publication number: 20170076985Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.Type: ApplicationFiled: September 13, 2016Publication date: March 16, 2017Inventors: Toshiyuki Yoshikawa, Takashi Sampei
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Publication number: 20160207145Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb?ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.Type: ApplicationFiled: January 20, 2016Publication date: July 21, 2016Inventor: Takashi Sampei
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Publication number: 20160151857Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.Type: ApplicationFiled: November 30, 2015Publication date: June 2, 2016Inventors: Wataru Odagiri, Kouichi Nehashi, Joel Koerwer, Hironari Ohkubo, Shuichiro Tsukiji, Ryugo Oba, Kentaro Odanaka, Takashi Sampei
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Patent number: 8403220Abstract: In an optical code detection system and method, infrared pulses are utilized to detect the presence of an object within the range of an optical imaging device, but the image of an infrared pulse reflected from the object is also analyzed to determine the distance between the object and the imaging device. An illumination pulse is then produced to illuminate the optical code on the object, and the characteristic of that pulse, such as duration, are controlled to provide appropriate exposure for an object at the detected distance.Type: GrantFiled: October 27, 2008Date of Patent: March 26, 2013Assignees: Optoelectronics Co., Ltd., Opticon, Inc.Inventors: Ken Fukuba, Satoshi Komi, Takashi Sampei, Tokuma Yamazaki
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Publication number: 20110210174Abstract: In an optical code detection system and method, infrared pulses are utilized to detect the presence of an object within the range of an optical imaging device, but the image of an infrared pulse reflected from the object is also analyzed to determine the distance between the object and the imaging device. An illumination pulse is then produced to illuminate the optical code on the object, and the characteristic of that pulse, such as duration, are controlled to provide appropriate exposure for an object at the detected distance.Type: ApplicationFiled: October 27, 2008Publication date: September 1, 2011Applicant: Optoelectronics Co., Ltd.Inventors: Ken Fukuba, Satoshi Komi, Takashi Sampei, Tokuma Yamazaki
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Publication number: 20100329657Abstract: A relatively rapidly moving object is imaged with a sensor incorporating a rolling electronic shutter, while using flash illumination which is comparable to or dimmer than ambient light. This is achieved by utilizing a physical shutter between the object and sensor which is synchronized to the flash. Preferably, the physical shutter is also operated so as to be open for a time interval which is coextensive with the presence of the flash. Preferably, an optical mechanism is provided between the object and sensor which causes the image to be focused when the light is flashed and blurred otherwise. Preferably, an optical filter is positioned between the object and sensor, and this filter is constructed to transmit to the CMOS sensor light at the wavelength of the flashing light source but to attenuate ambient light.Type: ApplicationFiled: April 18, 2007Publication date: December 30, 2010Applicants: Optoelectronics Co., Ltd., Opticon, Inc.Inventors: Kazukuni Hosoi, Tohru Takahashi, Ken Fukuba, Tokuma Yamazaki, Takashi Sampei, Satoshi Komi, Nobuhiro Ebara
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Patent number: 7799700Abstract: A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer.Type: GrantFiled: September 5, 2006Date of Patent: September 21, 2010Assignee: Disco CorporationInventors: Kentaro Iizuka, Takashi Sampei, Nobuyasu Kitahara, Yohei Yamashita
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Publication number: 20070054498Abstract: A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer.Type: ApplicationFiled: September 5, 2006Publication date: March 8, 2007Inventors: Kentaro Iizuka, Takashi Sampei, Nobuyasu Kitahara, Yohei Yamashita