Patents by Inventor Takashi Sugihara
Takashi Sugihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11927458Abstract: A map information correction apparatus includes a feature point priority determination unit that determines a priority for a feature point of own mobile object surrounding information. A feature pair priority determination unit gives, when there is one or more feature pairs, a priority to the feature pair, based on an own mobile object surrounding information priority of the feature pair and a map information priority of the feature pair. The feature pair is a pair of an own mobile object surrounding information feature point and a received map information feature point that correspond to each other. An error calculation unit calculates an error in the map information, based on a high-priority own mobile object surrounding information feature point and a high-priority map information feature point. A correction unit corrects the map information using the error.Type: GrantFiled: July 23, 2021Date of Patent: March 12, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kyoko Hosoi, Takashi Sugihara
-
Patent number: 11884299Abstract: A vehicle traveling control device includes: a communicator periodically receiving a dynamic map; a sensor management circuit collecting, from one or more sensors measuring a state of objects around a vehicle, a result of measurement representing the state of objects around the vehicle; a surrounding information comparator comparing object data represented by the dynamic map with object data represented by the result of measurement, and in response to finding mismatching object data, detecting, from the mismatching object data, data of the dynamic map representing an object within a specified range from the vehicle; and a proximity information processor setting, from the data of the dynamic map detected by the surrounding information comparator, data representing the vehicle as an avoidance non-target object in traveling control, and setting data representing an object other than the vehicle as an avoidance target object in traveling control or the avoidance non-target object.Type: GrantFiled: December 4, 2020Date of Patent: January 30, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kyoko Hosoi, Kenichi Nakura, Takeshi Suehiro, Takashi Sugihara
-
Patent number: 11736127Abstract: Provided is an optical transmission device including: a symbol demapping unit; a likelihood generation circuit configured to generate likelihoods relating to the reception signal; and an error correction decoding unit configured to execute soft decision decoding. The likelihood generation circuit includes: a first one-dimensional-modulation lookup table configured to input the signal of the I-axis component as an argument to output a first likelihood; a second one-dimensional-modulation lookup table configured to input the signal of the Q-axis component as an argument to output a second likelihood; and a two-dimensional-modulation lookup table configured to input, as an argument, the signal being the concatenation of the signal of the I-axis component and the signal of the Q-axis component, to generate a third likelihood. The error correction decoding unit is configured to execute the soft decision decoding based on the first likelihood, the second likelihood, and the third likelihood.Type: GrantFiled: August 18, 2021Date of Patent: August 22, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoshiaki Konishi, Kenji Ishii, Hideo Yoshida, Takashi Sugihara, Tsuyoshi Yoshida
-
Patent number: 11522562Abstract: Provided is an error correction decoding device including an inner code iterative decoding circuit, a parameter generation circuit, and a first control circuit. The first control circuit is configured to: receive, as parameters, a threshold and a maximum iteration count which are generated by the parameter generation circuit; and compare, when an iteration count does not reach the maximum iteration count, a non-zero-value count sequentially output from the inner code iterative decoding circuit and the threshold set for each iteration count, and stop an iterative operation by the inner code iterative decoding circuit when a result of the comparison satisfies a stopping condition set in advance.Type: GrantFiled: July 1, 2021Date of Patent: December 6, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hideo Yoshida, Yoshiaki Konishi, Kenji Ishii, Takashi Sugihara
-
Publication number: 20210384921Abstract: Provided is an optical transmission device including: a symbol demapping unit; a likelihood generation circuit configured to generate likelihoods relating to the reception signal; and an error correction decoding unit configured to execute soft decision decoding. The likelihood generation circuit includes: a first one-dimensional-modulation lookup table configured to input the signal of the I-axis component as an argument to output a first likelihood; a second one-dimensional-modulation lookup table configured to input the signal of the Q-axis component as an argument to output a second likelihood; and a two-dimensional-modulation lookup table configured to input, as an argument, the signal being the concatenation of the signal of the I-axis component and the signal of the Q-axis component, to generate a third likelihood. The error correction decoding unit is configured to execute the soft decision decoding based on the first likelihood, the second likelihood, and the third likelihood.Type: ApplicationFiled: August 18, 2021Publication date: December 9, 2021Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoshiaki KONISHI, Kenji ISHII, Hideo YOSHIDA, Takashi SUGIHARA, Tsuyoshi YOSHIDA
-
Publication number: 20210348943Abstract: A map information correction apparatus includes: a feature point priority determination unit that determines, based on a priority table, a priority for a feature point of own mobile object surrounding information; a feature pair priority determination unit that gives, when there is one or more feature pairs, a priority to the feature pair, based on an own mobile object surrounding information priority of the feature pair and a map information priority of the feature pair, the feature pair being a pair of an own mobile object surrounding information feature point and a received map information feature point that correspond to each other; an error calculation unit that calculates an error in the map information, based on a high-priority own mobile object surrounding information feature point and a high-priority map information feature point, the high-priority own mobile object surrounding information feature point being the own mobile object surrounding information feature point, the high-priority map informatiType: ApplicationFiled: July 23, 2021Publication date: November 11, 2021Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kyoko HOSOI, Takashi SUGIHARA
-
Patent number: 11167364Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.Type: GrantFiled: August 1, 2018Date of Patent: November 9, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
-
Publication number: 20210328602Abstract: Provided is an error correction decoding device including an inner code iterative decoding circuit, a parameter generation circuit, and a first control circuit. The first control circuit is configured to: receive, as parameters, a threshold and a maximum iteration count which are generated by the parameter generation circuit; and compare, when an iteration count does not reach the maximum iteration count, a non-zero-value count sequentially output from the inner code iterative decoding circuit and the threshold set for each iteration count, and stop an iterative operation by the inner code iterative decoding circuit when a result of the comparison satisfies a stopping condition set in advance.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hideo YOSHIDA, Yoshiaki KONISHI, Kenji ISHII, Takashi SUGIHARA
-
Patent number: 11130188Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.Type: GrantFiled: December 10, 2018Date of Patent: September 28, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Takashi Sugihara, Kaname Nagata
-
Publication number: 20210245282Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.Type: ApplicationFiled: December 10, 2018Publication date: August 12, 2021Inventors: Takashi Sugihara, Kaname Nagata
-
Patent number: 11004787Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.Type: GrantFiled: September 3, 2019Date of Patent: May 11, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Masaya Ichikawa, Takashi Sugihara, Kaito Shirai, Satoshi Kotomari
-
Publication number: 20210086791Abstract: A vehicle traveling control device includes: a communicator periodically receiving a dynamic map; a sensor management circuit collecting, from one or more sensors measuring a state of objects around a vehicle, a result of measurement representing the state of objects around the vehicle; a surrounding information comparator comparing object data represented by the dynamic map with object data represented by the result of measurement, and in response to finding mismatching object data, detecting, from the mismatching object data, data of the dynamic map representing an object within a specified range from the vehicle; and a proximity information processor setting, from the data of the dynamic map detected by the surrounding information comparator, data representing the vehicle as an avoidance non-target object in traveling control, and setting data representing an object other than the vehicle as an avoidance target object in traveling control or the avoidance non-target object.Type: ApplicationFiled: December 4, 2020Publication date: March 25, 2021Applicant: Mitsubishi Electric CorporationInventors: Kyoko HOSOI, Kenichi NAKURA, Takeshi SUEHIRO, Takashi SUGIHARA
-
Patent number: 10917116Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.Type: GrantFiled: March 9, 2017Date of Patent: February 9, 2021Assignee: Mitsubishi Electric CorporationInventors: Hideo Yoshida, Kazuo Kubo, Kenji Ishii, Kenya Sugihara, Takashi Sugihara
-
Patent number: 10894294Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.Type: GrantFiled: November 27, 2018Date of Patent: January 19, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
-
Publication number: 20200290143Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.Type: ApplicationFiled: November 27, 2018Publication date: September 17, 2020Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
-
Publication number: 20200266144Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.Type: ApplicationFiled: September 3, 2019Publication date: August 20, 2020Inventors: Masaya ICHIKAWA, Takashi SUGIHARA, Kaito SHIRAI, Satoshi KOTOMARI
-
Publication number: 20200021311Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.Type: ApplicationFiled: March 9, 2017Publication date: January 16, 2020Applicant: Mitsubishi Electric CorporationInventors: Hideo YOSHIDA, Kazuo KUBO, Kenji ISHII, Kenya SUGIHARA, Takashi SUGIHARA
-
Patent number: 10293439Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.Type: GrantFiled: February 17, 2016Date of Patent: May 21, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Takashi Sugihara, Hiroshi Taguchi, Tsutomu Hiyama
-
Publication number: 20190039159Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
-
Patent number: 10128940Abstract: An optical transmission method wavelength-multiplexing and transmitting multiple channels including data. The data are composed of data areas independent between the channels and data areas non-independent between the channels. Data patterns of the data areas non-independent between the channels are variable. The data patterns of the data areas non-independent between the channels are set so that in time periods of the non-independent data areas on an optical transmission section, a time period during which polarization states of the multiple channels are correlated in the optical transmission section has a length such that an error rate is less than or equal to a threshold value, the error rate being determined from a temporal distribution of bit errors obtained from a result of error decision after demodulation in an optical receiver.Type: GrantFiled: April 16, 2015Date of Patent: November 13, 2018Assignee: Mitsubishi Electric CorporationInventors: Hiroki Goto, Tsuyoshi Yoshida, Kiyoshi Onohara, Takashi Sugihara, Kazuo Kubo, Tatsuya Kobayashi, Keisuke Matsuda, Masashi Binkai