Patents by Inventor Takashi Takekoshi
Takashi Takekoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11928064Abstract: A hydrogen sensor includes a communication terminal, a plurality of identification terminals, and an ID setting section. The communication terminal is connected to a first communication bus or a second communication bus, and communicate with a vehicle ECU. Each of the plurality of identification terminals is set to either an open state (OPEN) in which the identification terminal is not connected to any potential or a grounded state (GND) in which the identification terminal is connected to a ground potential. The ID setting section sets an identifier in either a standard format or an extended format, according to a difference in the communication bus to which the communication terminal is connected.Type: GrantFiled: February 27, 2022Date of Patent: March 12, 2024Assignee: Honda Motor Co., Ltd.Inventors: Tomonari Hattori, Jin Nishio, Akihiro Suzuki, Takashi Kawaura, Sena Takekoshi
-
Publication number: 20230418424Abstract: One aspect of the present invention provides a sensor 10 including: a base material 11; a first electroconductive part 12 provided on a first face 11A side of the base material 11; and a second electroconductive part 13 provided on the first face 11A side of the base material 11, and disposed apart from the first electroconductive part 12; wherein the first electroconductive part 12 has a plurality of first electrode portions 12A and a wiring portion 12B electrically connecting the first electrode portions 12A adjacent to each other; wherein the second electroconductive part 13 has a plurality of second electrode portions 13A, and a bridge wiring portion 13B straddling the wiring portion 12B and electrically connecting the second electrode portions 13A adjacent to each other; and wherein the bridge wiring portion 13B contains a resin portion 17B and an electroconductive fiber 18B disposed in the resin portion 17BType: ApplicationFiled: September 29, 2021Publication date: December 28, 2023Inventors: Yuji SHIMIZU, Takashi TAKEKOSHI, Hiroaki MUTOU
-
Patent number: 11776710Abstract: An electroconductive film which is capable of inhibiting milkiness; and a touch panel and image display device that include the electroconductive film are provided. According to one aspect of the present invention, an electroconductive film 10 including at least an electroconductive part 12, wherein the electroconductive part 12 includes a light-transmitting resin 14 and a plurality of electroconductive fibers 15 placed in the light-transmitting resin 14, and the diffused light reflectance (SCE) in a region of the electroconductive film 10 where the electroconductive part 12 is present is 0.5% or less, is provided.Type: GrantFiled: March 8, 2019Date of Patent: October 3, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Eiji Ooishi, Shoichiro Ogumi, Yukimitsu Iwata, Takashi Takekoshi, Seiichi Isojima
-
Patent number: 11511301Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: November 18, 2020Date of Patent: November 29, 2022Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20210118589Abstract: An electroconductive film which is capable of inhibiting milkiness; and a touch panel and image display device that include the electroconductive film are provided. According to one aspect of the present invention, an electroconductive film 10 including at least an electroconductive part 12, wherein the electroconductive part 12 includes a light-transmitting resin 14 and a plurality of electroconductive fibers 15 placed in the light-transmitting resin 14, and the diffused light reflectance (SCE) in a region of the electroconductive film 10 where the electroconductive part 12 is present is 0.5% or less, is provided.Type: ApplicationFiled: March 8, 2019Publication date: April 22, 2021Inventors: Eiji OOISHI, Shoichiro OGUMI, Yukimitsu IWATA, Takashi TAKEKOSHI, Seiichi ISOJIMA
-
Publication number: 20210069739Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: November 18, 2020Publication date: March 11, 2021Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Patent number: 10894267Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: July 9, 2019Date of Patent: January 19, 2021Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20190329277Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: July 9, 2019Publication date: October 31, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Patent number: 10391511Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: November 8, 2018Date of Patent: August 27, 2019Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20190070625Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: November 8, 2018Publication date: March 7, 2019Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Patent number: 10189042Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: June 22, 2018Date of Patent: January 29, 2019Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Patent number: 10160000Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: July 20, 2016Date of Patent: December 25, 2018Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20180318864Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: June 22, 2018Publication date: November 8, 2018Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Patent number: 9527098Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.Type: GrantFiled: May 22, 2015Date of Patent: December 27, 2016Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20160325300Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: July 20, 2016Publication date: November 10, 2016Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Publication number: 20150251205Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.Type: ApplicationFiled: May 22, 2015Publication date: September 10, 2015Inventors: Yoshinori HIROBE, Yutaka MATSUMOTO, Masato USHIKUSA, Toshihiko TAKEDA, Hiroyuki NISHIMURA, Katsunari OBATA, Takashi TAKEKOSHI
-
Patent number: 9108216Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: GrantFiled: January 11, 2013Date of Patent: August 18, 2015Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
-
Publication number: 20150037928Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.Type: ApplicationFiled: January 11, 2013Publication date: February 5, 2015Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi