Abstract: A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.

Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.

Abstract: A hydraulic control device for a forklift includes: a plurality of hydraulic mechanisms including a lifting/lowering hydraulic cylinder and a tilting hydraulic cylinder; a hydraulic pump; an electric motor; a discharge control mechanism; a proportional valve; a flow rate control valve; and a controller. When the lifting/lowering hydraulic cylinder performs a lowering operation of the fork and a hydraulic mechanism other than the lifting/lowering hydraulic cylinder simultaneously performs a further operation, the controller controls an open degree of the proportional valve in accordance with a rotation speed difference of a required lowering operation rotation speed for the hydraulic pump, which is required to perform the lowering operation at an instructed speed that is in accordance with an operation amount of the lifting/lowering control member, and a required further operation rotation speed for the hydraulic pump, which is required to perform the further operation.

Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.

Abstract: A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the treatment liquid; a circulation line through which the treatment liquid discharged from the storage tank into the circulation line is returned to the storage tank; a branch supply line that is branched from the circulation line to supply the treatment liquid to the processing unit; a recovery line that returns to the storage tank the treatment liquid having been supplied to the substrate in the processing unit; a distribution line connecting the circulation line and the recovery line; and a shutoff valve, provided on the distribution line, that is opened when cleaning of the recovery line is performed.

Abstract: A filter frame includes a first frame portion that includes a filter installation surface for installing a filter, a second frame portion that retains the filter by holding the filter between the first frame portion, and a hinge portion that connects the first frame portion and the second frame portion. The first frame portion has a plurality of fitting projections and an arm provided on a filter installation surface of the first frame portion so as to extend between a plurality of fitting projections. The second frame portion has a plurality of fitting portions for receiving the plurality of fitting projections, and a cutout provided in a side of the frame facing the side in which the second frame portion is connected to the first frame portion by the hinge portion.

Abstract: A one-way clutch includes: an inner ring provided with an inserting opening for permitting insertion of a rotation shaft and rotatable integrally with the rotation shaft by being engaged with the rotation shaft; an outer ring engaged with an outer peripheral surface of the inner ring and rotatable in one direction relative to the inner ring and non-rotatable in a direction opposite to the one direction; and an elastic metal plate member, engaged with the inner ring, for limiting movement of the inner ring relative to the outer ring in a rotational axis direction of the outer ring. When the rotation shaft is mounted in the inner ring, the elastic metal plate member includes a leaf spring portion positioned and elastically deformable in a gap between the rotation shaft and the inner ring.

Abstract: A semiconductor device is provided that is inexpensively manufactured with variation in high-frequency characteristics suppressed. Internal matching circuit boards are disposed on at least one signal transmission path of an input-side signal transmission path between an input terminal and a semiconductor element and an output-side signal transmission path between the semiconductor element and an output terminal and is provided for matching at least between output impedance of an external circuit connected to the input terminal and input impedance of the semiconductor device or between input impedance of an external circuit connected to the output terminal and output impedance of the semiconductor device, and components are electrically connected by at least one wire causing a change exceeding an allowable value in high-frequency characteristics of the semiconductor device due to a change in wire length and are disposed in contact with each other inside a package.

Abstract: A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.

Abstract: A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees.

Abstract: A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

Abstract: A filter frame for holding a filter provided with a plurality of folds so as to alternately form ridges and troughs includes: a first frame portion including a first holding portion, having a side corresponding to a first side of the filter, for holding the filter; a positioning portion, provided on the first holding portion, for determining a position of the filter; and a second frame portion including a second holding portion for holding the filter by sandwiching the filter between the first and second holding portions. The second holding portion is provided so as to be capable of opposing the first holding portion via the filter and has a side corresponding to a second side of the filter.

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.

Abstract: A hydraulic drive device for cargo handling vehicle has: a tank; a pump for drawing in a hydraulic oil from the tank and supplying the hydraulic oil to hydraulic cylinders; an electric motor for driving the pump; a solenoid-controlled proportional valve disposed between an inlet port of the pump and a bottom chamber of an up-and-down hydraulic cylinder and configured to open with a valve travel depending upon a control input of a descent control of an up-and-down control member; a pressure compensation valve disposed between a branch portion located between the pump and the solenoid-controlled proportional valve and the tank and configured to open with a valve travel depending upon a pressure difference between pressures upstream and downstream of the solenoid-controlled proportional valve; and a valve disposed between the pressure compensation valve and the tank and configured to be switched between an open position and a close position.

Abstract: There is provided a substrate processing apparatus including: a cleaning tank configured to clean a target substrate; a drying chamber configured to communicate with an upper area of the cleaning tank and dry the target substrate picked up from the cleaning tank; a first drying gas supply unit configured to supply a first drying gas containing vapor of a solvent for removing a liquid; a second drying gas supply unit configured to supply a second drying gas not containing the vapor of the solvent for removing the liquid; a substrate holder configured to pick up the target substrate from the cleaning tank and transfer the target substrate to the drying chamber; and a controller configured to output a control signal to alternately supply the first drying gas and the second drying gas.

Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.

Abstract: There is provided a substrate processing method including cleaning a substrate by immersing the substrate in a cleaning solution in a longitudinal direction while the cleaning solution is supplied to a cleaning tank; transferring the substrate picked up from the cleaning tank to a drying chamber while holding the substrate in a longitudinal direction; and drying the substrate in the drying chamber communicating with an upper area of the cleaning tank by alternately supplying a first drying gas containing vapor of a solvent for removing a liquid and a second drying gas without containing the vapor of the solvent for removing the liquid to an area where the substrate is exposed between the upper area of the cleaning tank and the drying chamber after an upper end of the cleaned substrate is picked up from a liquid surface of the cleaning solution.

Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.

Abstract: A sheet feeding apparatus includes a sheet stacking unit, a suction conveyance unit configured to convey an uppermost sheet stacked on the sheet stacking unit, a suction unit configured to adsorb the sheets onto the suction conveyance unit, and an adsorption completion detection unit. In the sheet feeding apparatus, when the tab-attached sheets are stacked on the sheet stacking unit and fed such that their tab portions are on the downstream side in a sheet feeding direction, the suction unit starts to adsorb the sheet and the suction conveyance unit starts to convey the sheet immediately after the adsorption completion detection unit detects the completion of the adsorption. When the sheets other than the tab-attached sheets are fed, the suction unit previously adsorbs the sheet onto the suction conveyance unit, and the suction conveyance unit starts to convey the sheet in response to the sheet feeding signal.

Abstract: A radio frequency amplifier circuit includes: low-output transistors, each of which includes an input terminal, an output terminal, and a ground terminal, and amplifies a radio frequency signal; a harmonic processing circuit provided for each of the low-output transistors to be connected to the output terminal of the low-output transistor, and processing a secondary harmonic included in an amplified radio frequency signal, and a resistor connected to the output terminal of each of the low-output transistors. The input terminal of each of the low-output transistors is connected to an input terminal of the radio frequency amplifier circuit via an inductor, and the output terminal of each of the low-output transistors is connected to the other output terminal via the resistance and is further connected to an output terminal of the radio frequency amplifier circuit via an inductor.