Patents by Inventor Takateru Yamada

Takateru Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150284590
    Abstract: A curable organopolysiloxane composition comprising: (A) at least one type of gum-like or liquid organopolysiloxane having a viscosity of not less than 20 mPa·s, a content of the vinyl(CH2?CH—) part of higher alkenyl groups being in a range of 2.0 to 5.0% by mass; (B) an organopolysiloxane resin formed essentially from R13SiO1/2 units and SiO4/2 units, a molar ratio of the R13SiO1/2 units to the SiO4/2 units being from 0.5 to 2.0 and a content of the vinyl(CH2?CH—) part of alkenyl groups being less than 1.0% by mass; (C) an organohydrogenpolysiloxane; (D) a hydrosilylation reaction catalyst; and, optionally, (E) an organic solvent. In such a composition, a mass ratio of the component (A) to the component (B) is in a range of 2/8 to 8/2.
    Type: Application
    Filed: October 9, 2013
    Publication date: October 8, 2015
    Inventors: Syuji Endo, Toshikazu Tani, Takateru Yamada
  • Publication number: 20150274971
    Abstract: A solvent-type curable organopolysiloxane composition comprising (A) at least one type of gum-like or liquid organopolysiloxane having a viscosity of not less than 20 mPA·s, a content of the vinyl(CH2?CH—) part of higher alkenyl groups being in a range of 2.0 to 5.0% by mass; (B) an organopolysiloxane having a viscosity of not less than 1,000,000 mPa·s, a content of the vinyl(CH2?CH—) part of alkenyl groups being less than 0.1% by mass; (C) an organohydrogenpolysiloxane; (D) a hydrosilylation reaction catalyst; and (E) an organic solvent. In such a composition, a mass ratio of the component (A) to the component (B) is in a range of 2/8 to 8/2.
    Type: Application
    Filed: October 9, 2013
    Publication date: October 1, 2015
    Inventors: Syuji Endo, Takateru Yamada
  • Publication number: 20150232706
    Abstract: A releasing laminate comprises a substrate; (A) a silicone release layer on the substrate; and (B) an adhesive layer on (A) the silicone release layer. (A) The silicone release layer is formed by curing a releasing cured film-forming organopolysiloxane composition. The releasing cured film-forming organopolysiloxane composition comprises: (a) an organopolysiloxane having at least two silicon-bonded alkenyl groups in the molecule; (b) an organohydrogenpolysiloxane; and (c) a hydrosilylation reaction catalyst. Component (a) has a tetra(4)mer to eicosa(20)mer cyclic siloxane content less than or equal to 1,000 ppm in terms of mass units. (B) The adhesive layer comprises an aqueous adhesive composition. A method for producing the releasing laminate is also disclosed.
    Type: Application
    Filed: October 9, 2013
    Publication date: August 20, 2015
    Inventors: Syuji Endo, Takateru Yamada
  • Publication number: 20150140330
    Abstract: To provide a laminate comprising a substrate and a cured silicone product, wherein the substrate and the cured silicone product are integrated well and the cured silicone product provides superior electrification preventing or reducing properties to the laminate. A laminate comprising: a substrate (L1), a primer layer (L2) formed on the substrate (L1), and a cured silicone layer (L3) including a lithium salt (a) and a polyether modified polysiloxane (b), which is formed on the primer layer (L2). The laminate can be used for a releasable or adhesive film.
    Type: Application
    Filed: January 30, 2012
    Publication date: May 21, 2015
    Inventors: Hidefumi Tanaka, Toshikazu Tani, Syuji Yamada, Takateru Yamada
  • Patent number: 8933177
    Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: January 13, 2015
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Seiji Hori, Takateru Yamada, Chung Mien Kuo
  • Publication number: 20140147665
    Abstract: Imparting superior electrification preventing or reducing properties to a cured silicone product without inhibiting adhesion between a substrate and the cured silicone product when integrating the substrate and the cured silicone product via a primer layer. A condensation reaction curable primer composition comprising a lithium salt (a) and a polyether modified polysiloxane (b); and a laminate obtained by integrating a substrate and a cured silicone product using an electrification preventing or reducing primer layer (cured product of the composition).
    Type: Application
    Filed: January 30, 2012
    Publication date: May 29, 2014
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Hidefumi Tanaka, Toshikazu Tani, Syuji Yamada, Takateru Yamada
  • Patent number: 8618234
    Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R22SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: December 31, 2013
    Assignees: Dow Corning Corporation, Dow Corning Toray Company, Ltd.
    Inventors: Haruna Mizuno, Robert Alan Ekeland, Seiji Hori, Takateru Yamada
  • Patent number: 8372936
    Abstract: A silicone-type pressure-sensitive adhesive composition comprising (A) 100 weight parts of organopolysiloxane condensation reaction product that has at least two alkenyl groups and that is yielded by a condensation reaction between (a) hydroxyl-functional diorganopolysiloxane and (b) organopolysiloxane resin, (B) organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in an amount sufficient to provide from 1 to 200 silicon-bonded hydrogen atoms with reference to all the alkenyl groups in the composition, (C) an organotitanium compound, at from 0.1 to 20 weight parts, and (D) a platinum catalyst in a catalytic quantity.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: February 12, 2013
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Patent number: 8178207
    Abstract: A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: May 15, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Publication number: 20110287267
    Abstract: A solventless cured release coating-forming organopolysiloxane composition having a viscosity at 25° C. of 50 to 2,000 mPa·s comprising (A) 100 weight parts of an alkenyl-functional diorganopolysiloxane that has a viscosity of 25 to 1,000 mPa·s; (B) 0.5 to 15 weight parts of a diorganopolysiloxane that has a viscosity of at least 10,000 mPa·s and that has an aliphatically unsaturated group content of no more than 0.1 mole %; (C) 0.5 to 5 weight parts of a branched organopolysiloxane that has more than one SiO4/2 unit and that is a polymer product provided by an equilibration polymerization between a branched organosiloxane oligomer represented by the average siloxane unit formula (1) (SiO4/2)(RaRb2SiO1/2)x(1) and a diorganosiloxane oligomer; (D) a specific amount of an organohydrogenpolysiloxane that has a viscosity of 1 to 1,000 mPa·s; and (E) a hydrosilylation reaction catalyst in a catalytic quantity.
    Type: Application
    Filed: November 26, 2009
    Publication date: November 24, 2011
    Inventors: Seiji Hori, Takateru Yamada, Robert Alan Ekeland
  • Publication number: 20110160376
    Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.
    Type: Application
    Filed: July 9, 2009
    Publication date: June 30, 2011
    Inventors: Seiji Hori, Takateru Yamada, Chung Mien Kuo
  • Publication number: 20110097579
    Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2,SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R2SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.
    Type: Application
    Filed: August 22, 2008
    Publication date: April 28, 2011
    Inventors: Haruna Mizuno, Robert Alan Ekeland, Seiji Hori, Takateru Yamada
  • Publication number: 20100285312
    Abstract: A silicone-type pressure-sensitive adhesive composition comprising (A) 100 weight parts of organopolysiloxane condensation reaction product that has at least two alkenyl groups and that is yielded by a condensation reaction between (a) hydroxyl-functional diorganopolysiloxane and (b) organopolysiloxane resin, (B) organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in an amount sufficient to provide from 1 to 200 silicon-bonded hydrogen atoms with reference to all the alkenyl groups in the composition, (C) an organotitanium compound, at from 0.1 to 20 weight parts, and (D) a platinum catalyst in a catalytic quantity.
    Type: Application
    Filed: December 25, 2008
    Publication date: November 11, 2010
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Publication number: 20100168313
    Abstract: A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 1, 2010
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Publication number: 20100104865
    Abstract: A peroxide-curable silicone-based pressure-sensitive adhesive composition comprising (A) a diorganopolysiloxane having silicon-bonded alkenyl groups at both molecular terminals used in amount of 100 parts by weight; (B) an organopolysiloxane resin having one or more silanol(OH) groups in one molecule and consisting of R32(OH) SiO1/2 units (where R3 independently stands for non-substituted or substituted monovalent hydrocarbon groups having 1 to 10 carbon atoms), R33SiO1/2 units (wherein R3 is the same as defined above), and SiO4/2 units, used in amount of 10 to 200 parts by weight; and (C) one or more types of organic peroxide compounds used in a catalytic quantity.
    Type: Application
    Filed: December 20, 2007
    Publication date: April 29, 2010
    Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
  • Patent number: 6545076
    Abstract: A solvent free silicone composition for forming a cured release coating comprising (A) 100 parts by weight of a diorganopolysiloxane having in each molecule at least two alkenyl groups and a viscosity of 50 to 5,000 mPa·s at 25° C.; (B) 3 to 50 parts by weight of an organohydrogenpolysiloxane mixture comprising constituent (b-1) and constituent (b-2) in a weight ratio of 1:0.01 to 1:1, where (b-1) is a diorganopolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having both molecular terminals capped with silicon-bonded hydrogen atoms and (b-2) is an organohydrogenpolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having at least three pendant silicon-bonded hydrogen atoms in each molecular chain; and (C) a catalytic amount of a platinum-type catalyst.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: April 8, 2003
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Nobuo Kaiya, Takateru Yamada, Shuji Yamada
  • Publication number: 20010056167
    Abstract: A solvent free silicone composition for forming a cured release coating comprising (A) 100 parts by weight of a diorganpolysiloxane having in each molecule at least two alkenyl groups and a visocisity of 50 to 5,000 mPa-s at 25 ° C.; (B) 3 to 50 parts by wight of an organohydrogenpolysilozane mixture comprising constituent (b-1) and consitiuent (b-2) in a weight ratio of 1:0.01 to 1:1, where (b-1) is a diorganopolysilozane having a visocsity of 1 to 1,000 mP-s at 25 ° and having both molecular terminals capped with silicon-bonded hydrogen atoms and (b-2) is an organhydrogenpolysilozane having a visocity of 1 to 1,000 mPa-s at 25 ° C. and having at least three pendant silicon-bonded hyhdrogen atoms in each molecular chain; and (C) a catalyic amount of a platinum-type catalyst.
    Type: Application
    Filed: May 3, 2001
    Publication date: December 27, 2001
    Inventors: Nobuo Kaiya, Takateru Yamada, Shuji Yamada
  • Patent number: 6300426
    Abstract: This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: October 9, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Taku Koyama, Atsushi Togashi, Takateru Yamada
  • Patent number: 6008310
    Abstract: This invention relates to a silicone release coating comprising (A) an organopolysiloxane having at least two crosslinkable carbon-carbon double bonds in each molecule, (B) an organopolysiloxane having at least two Si-bonded hydrogen atoms in each molecule, (C) a silylated polymethylsilsesquioxane and (D) platinum catalyst. The silicone release coating compositions of this invention can further comprise an inhibitor. The silicone release coating compositions of this invention do not decline in release resistance due to release paper aging or release liner aging.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: December 28, 1999
    Assignees: Dow Corning Asia, Ltd., Dow Corning Toray Silicone
    Inventors: Maki Itoh, Akihito Sakakibara-Saitoh, Michitaka Suto, Takateru Yamada
  • Patent number: 5945475
    Abstract: This invention relates to a silicone release coating composition comprising (A) a diorganopolysiloxane having at least two alkenyl groups in each molecule, (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in each molecule, (C) a mixture of an alkynyl alcohol and an organosiloxane having at least one aliphatic triple bond-containing alkoxy group, and (D) a platinum group metal catalyst. The silicone release coating compositions of this invention have superior curability and storage stability at room temperature, and produce a uniform coating when used in thin film form on applicator rolls.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: August 31, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Takateru Yamada, Taku Koyama, Koji Nakanishi