Abstract: An electromagnetic valve including a solenoid to generate an electromagnetic force; a cylindrical member at least partially disposed in the solenoid and made from a non-magnetic material; a movable member configured to be moved in the cylindrical member in an axial direction of the valve based on the solenoid, the movable member including a restriction portion on one end side of the movable member; a plunger including one end portion located on the one end side and an opposite end portion located on an opposite end side of the movable member, the plunger being restricted in a movement thereof in a radial direction due to the opposite end portion disposed at the restriction portion. A movable amount of the movable member in the radial direction in the cylindrical member is less than a movable amount of the plunger in the radial direction relative to the restriction portion.

Abstract: Provided is an electromagnetic valve and a brake apparatus capable of reducing friction between a plunger and a valve seat.

Abstract: A method for manufacturing a semiconductor device or a semiconductor wafer using a chucking unit is provided to remove a slurry that adheres to the back surface of the semiconductor wafer. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit. The polished semiconductor wafer is then dechucked from the chucking unit of the first polishing unit. Next, a gap is formed above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged from the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and the semiconductor wafer is polished.

Abstract: A method for manufacturing a semiconductor device or a semiconductor wafer is provided, in which a removal of slurry that is adherently remained on the back surface of the semiconductor wafer can be ensured without a need for employing an increased dimension of apparatus. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit, and then, the polished semiconductor wafer is dechucked from the chucking unit of the first polishing unit. Next, a predetermined gap is formed in a location above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged form the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and then the semiconductor wafer is polished.

Abstract: A method and an apparatus for obtaining radioactivity, radioactivity concentration and radioactivity surface density without using an actual calibration radiation source but utilizing a &ggr; ray, including: a virtual modeling step (21) for arranging virtual three-dimensional models of a measurement subject and a radiation detector in a virtual three-dimensional space with the same positional relationship as an actual geometric positional relationship; a conversion factor setting step which is a step for associating the number of times of generation of a virtual radiation ray emitted from a virtual three-dimensional model of the measurement subject with the number of times of incidence of the virtual radiation ray upon a virtual three-dimensional model of the radiation detector to obtain a conversion factor, and has a virtual count calculating step (22) and a conversion factor calculating step (23); an actual counting rate calculating step (24) for actually counting the incidence of the radiation ray emitted

Abstract: The floor of a motor vehicle which is assembled in a floor assembly station is transported to a subsequent station using at least two welding robots on each lateral side of the floor assembly station. These welding robots are constituted into dual-purpose welding robots for performing both welding work and transporting work. After the assembling of the floor has been finished, the floor is supported at four lateral and longitudinal jack-up points through the workpiece receiving member by the cooperation of these dual-purpose welding robots, and is transported from the floor assembly station to the subsequent station.

Abstract: A method of inserting coils into the slots of a stator iron core by moving a pressing piece and a blade supporter which are formed as separate bodies comprises a step of holding said coils by first blades fixed to said pressing piece and second blades fixed to said blade supporter, a step of moving forward said pressing piece and said blade supporter together to insert said coils into the slots of said iron core by means of said first and second blades, and a step of moving backward only said blade supporter for a predetermined distance followed by causing said pressing piece to move backward together with said blade supporter whereby said second blades are firstly retracted while keeping said first blades momentarily at a position.

Abstract: A coil inserter including a plurality of tooling devices for inserting a coil and a plurality of wedges into each slot of an iron core, an actuator for driving the tooling devices and which is detachably connected to said tooling device, a tool stocker for selectively movably receiving the tooling devices depending upon the shape of said iron core, and a tooling device supporter having one end supported by a shaft mounted on the tool stocker so as to move are of the tooling devices to the tool stocker and to remove the another of the tooling devices from the tool stocker to engage the former with the actuator.