Patents by Inventor Takatoshi Ikeuchi

Takatoshi Ikeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition and electronic component device
    Patent number: 11767449
    Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 26, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takatoshi Ikeuchi, Takashi Yamamoto
  • Epoxy resin composition and electronic component device
    Patent number: 10865332
    Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: December 15, 2020
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takatoshi Ikeuchi, Takashi Yamamoto
  • Epoxy Resin Composition and Electronic Component Device
    Publication number: 20200140728
    Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
    Type: Application
    Filed: December 31, 2019
    Publication date: May 7, 2020
    Inventors: Hirokuni OGIHARA, Fumio FURUSAWA, Shinya NAKAMURA, Takatoshi IKEUCHI, Takashi YAMAMOTO
  • Epoxy Resin Composition and Electronic Component Device
    Publication number: 20140234633
    Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
    Type: Application
    Filed: September 27, 2012
    Publication date: August 21, 2014
    Inventors: Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takatoshi Ikeuchi, Takashi Yamamoto
  • Sealant epoxy-resin molding material, and electronic component device
    Patent number: 7846998
    Abstract: Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: December 7, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa
  • Sealant Epoxy-Resin Molding Material, and Electronic Component Device
    Publication number: 20080234409
    Abstract: Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material.
    Type: Application
    Filed: March 3, 2005
    Publication date: September 25, 2008
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa