Patents by Inventor Takatoshi Koyakumaru

Takatoshi Koyakumaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5489399
    Abstract: 1. A carbon dioxide gas generating composition characterize in that:(a) the composition comprises the combination of at least one component acid greater than carbonic acid in dissociation constant, at least 0.5 g/100 g water in solubility at 30.degree. C. and solid (at least 40.degree. C. in melting point) at room temperature and at least one component alkali carbonate up to 50 g/100 g water in solubility at 3O.degree. C.,(b) at least one of the component acid and the component alkali carbonate of the combination is an acid having a solubility of up to 90 g/100 g water at 30.degree. C. or an alkali carbonate having a solubility of up to 2 g/100 g water at 30.degree. C.,(c) the component acid is an acid or a salt convertible into an acid on decomposition, and the component alkali carbonate is an alkali metal carbonate or hydrogencarbonate, or alkaline earth metal carbonate, and,(d) the ratio of the component acid to the component alkali carbonate to be mixed therewith is 1:5 to 5:1 in equivalent ratio.
    Type: Grant
    Filed: November 18, 1994
    Date of Patent: February 6, 1996
    Assignee: Rengo Co., Ltd.
    Inventors: Takatoshi Koyakumaru, Yoshinori Ono
  • Patent number: 4906679
    Abstract: A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that(a) a polyvinyl alcohol concentration in the solution excluding solid other than polyvinyl alcohol from adhesive being in the region bounded by the following formulas:Y.gtoreq.-0.0014 X+9.4 (i)Y.ltoreq.-0.0061 X+26.3 (ii)200.ltoreq.X.ltoreq.3500 (iii)wherein Y is defined by the following formula: ##EQU1## and X is degree of polymerization of polyvinyl alcohol, (b) the viscosity of the adhesive measured by a Brookfield viscometer being from 200 to 6000 centipoises at 85.degree. C.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: March 6, 1990
    Assignees: Kuraray Co., Ltd., Rengo Co., Ltd.
    Inventors: Masateru Tokuno, Kinichi Shirakawa, Takatoshi Koyakumaru, Takuji Okaya, Hiroji Kohno, Hiroyuki Onishi
  • Patent number: 4824696
    Abstract: A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that(a) a polyvinyl alcohol concentration in the solution excluding solid other than polyvinyl alcohol from adhesive being in the region bounded by the following formulas:Y.gtoreq.-0.0014 X+9.4 (i)Y.ltoreq.-0.0061 X+26.3 (II)200.ltoreq.X.ltoreq.
    Type: Grant
    Filed: October 30, 1985
    Date of Patent: April 25, 1989
    Assignees: Kuraray Co., Ldt., Rengo Co., Ltd.
    Inventors: Masateru Tokumo, Kinichi Shirakawa, Takatoshi Koyakumaru, Takuji Okaya, Hiroyuki Onishi, Hiroji Kohno