Patents by Inventor Takayoshi Morino

Takayoshi Morino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7680452
    Abstract: A booster capable of preventing itself from adversely influencing a base station. This booster comprises a plurality of downstream signal amplifying parts (111-1 to 111-4) and a plurality of upstream signal amplifying parts (112-1 to 112-4). A received signal analyzing part (116) analyzes the perch channel information of a signal received from a base station to generate analysis information. When the analysis information shows that the reception quality of the received signal is below a threshold value, halt control parts (118,124) halts the operations of those ones of the downstream signal amplifying parts (111-1 to 111-4) and upstream signal amplifying parts (112-1 to 112-4) that are related to that analysis information.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: March 16, 2010
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Oodachi, Keisho Fujiwara, Masashi Shiohara, Naoki Uchida, Takayoshi Morino, Fumitoshi Goto
  • Publication number: 20070243823
    Abstract: A booster capable of preventing itself from adversely influencing a base station. This booster comprises a plurality of downstream signal amplifying parts (111-1 to 111-4) and a plurality of upstream signal amplifying parts (112-1 to 112-4). A received signal analyzing part (116) analyzes the perch channel information of a signal received from a base station to generate analysis information. When the analysis information shows that the reception quality of the received signal is below a threshold value, halt control parts (118,124) halts the operations of those ones of the downstream signal amplifying parts (111-1 to 111-4) and upstream signal amplifying parts (112-1 to 112-4) that are related to that analysis information.
    Type: Application
    Filed: October 19, 2005
    Publication date: October 18, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Oodachi, Keisho Fujiwara, Masashi Shiohara, Naoki Uchida, Takayoshi Morino, Fumitoshi Goto
  • Patent number: 6690921
    Abstract: A gain of a receiving amplifier can be measured by inputting pilot signals each having a different frequency into an input side and an output side of the receiving amplifier respectively, then detecting these pilot signals respectively by a main apparatus having an abnormality detecting function, and then comparing their relative values.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: February 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiro Nagayama, Kazuhiko Ikeda, Kazuhiko Takeyama, Koji Ishii, Takayoshi Morino
  • Patent number: 5801590
    Abstract: An oscillator circuit including a metal plate secured to a dielectric substrate. A micro strip line is mounted on the dielectric substrate. One end of the micro strip line is connected to the gate terminal of a field effect transistor for microwave oscillation and the other end of the micro strip line is grounded to the metal plate via a terminal resistor. A dielectric resonator is secured with an ordinary adhesive to the inner wall of a shield case. Attaching the dielectric resonator to the shield case allows the degree of coupling, defined by the distance between the micro strip line and the dielectric resonator, to be freely set. A tuning screw is screwed through the metal plate and the dieletric substrate opposite to the dielectric resonator. The microwave oscillation circuit can be used with a down converter.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: September 1, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yukiro Kashima, Takayoshi Morino
  • Patent number: 5661441
    Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: August 26, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takayoshi Morino, Yukiro Kashima