Abstract: A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.

Abstract: A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The material or structure of a lower layer in the via electrode and the material or structure of a lower layer in the wiring are different.

Abstract: A wiring body disposed above a substrate including a conductor including: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. A lower layer included in the via electrode and located above the insulating layer and a lower layer included in the wiring include the same material.

Abstract: A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The via electrode includes: a seed layer formed along an inner surface of the insulating layer from above the conductor in the via hole; a via electrode body layer formed to be located above the seed layer and fill the via hole; and an adhesion layer formed between the seed layer and the inner surface of the insulating layer in the via hole.

Abstract: A manufacturing method of the present disclosure is a method for manufacturing a wiring body. The manufacturing method includes a growth process, a transfer process, and a peeling process. In the growth process, a conductive layer of a wiring body is grown on a catalyst provided on a pattern plate. In the transfer process, the conductive layer on the pattern plate is transferred to an insulator. In the peeling process, the conductive layer is peeled off from the pattern plate together with the insulator. When the wiring body is manufactured a plurality of times, the growth process, the transfer process, and the peeling process are repeatedly executed using the same pattern plate.

Abstract: A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.

Abstract: A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.

Abstract: A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by electroless plating. The plating-pattern plate includes a transfer part having a transfer surface configured to have the transfer pattern be formed by electroless plating. The transfer surface of the transfer part contains iron and nickel. The plating-pattern plate provides a fine conductive pattern with stable quality.

Abstract: A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.

Abstract: A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.

Abstract: A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.

Abstract: A top-emission organic EL display device includes a substrate, pixel electrodes, auxiliary electrode, insulating layer formed between the pixel electrodes and includes an opening to expose the auxiliary electrode, organic EL layer formed on the pixel electrodes and includes organic layers, at least one formed on the auxiliary electrode, a contact portion being an opening of the organic layer formed on the auxiliary electrode, and transparent electrode layer formed on the organic EL layer and the contact portion. When an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the pixel electrode is regarded as “a” and an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the auxiliary electrode is regarded as “b”, at least one of “a” and “b” is equal to or greater than 2 ?m.

Abstract: To provide an element manufacturing method and element manufacturing apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product, which includes a substrate and a protrusion extending in a normal direction of the substrate, is formed. Next, the intermediate product is covered, at a side where the protrusion is provided, with a first surface of a lid member. After the covering of the intermediate product, a gas is injected into an enclosed space formed at a side of a second surface of the lid member that is present on an opposite side of the first surface. This enhances an internal pressure of the enclosed space, thus bringing the first surface of the lid member into close contact with the intermediate product.

Abstract: An element manufacturing method and apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product that includes a substrate and a protrusion extending in a normal direction of the substrate is provided. Next, in a stacking chamber conditioned to a vacuum environment, a stacked structure is formed by continuously stacking a lid member on the intermediate product at a side where the protrusion is provided. After this operation, the stacked structure is transported from the stacking chamber to a first pressure chamber coupled to the stacking chamber and conditioned to a first pressure higher than the pressure in the vacuum environment. Next, the stacked structure is further transported from the first pressure chamber to a separation chamber coupled to the first pressure chamber and conditioned to a vacuum environment, and then the stacked structure is separated into the intermediate product and the lid member.

Abstract: An element manufacturing method in which a section of a substrate that is irradiated with laser light can be covered efficiently. A plurality of protrusions of an intermediate product are lined up in a first direction on a substrate, and a sealing mechanism includes one pair of rollers that rotate around a rotational axis extending in a second direction orthogonal to the first direction. The paired rollers are lined up spacedly in the first direction. In a sealing step using the sealing mechanism, a section of a lid member that is being tensioned between the paired rollers is in close contact with a part of the intermediate product. In an irradiation step, light passes through the section of the lid member that is being tensioned between the paired rollers, and reaches the intermediate product.

Abstract: A method for producing top-emission organic EL display device, in which, using cover material having flexibility such as resin film, space between organic EL layer-side substrate and cover material is made into decompressed state, thereafter, adhesion properties between organic EL layer-side substrate and cover material is maintained by retaining decompressed state in the space between organic EL layer-side substrate and cover material when adhering organic EL layer-side substrate and cover material by adjusting pressure of space on opposite side to the organic EL layer-side substrate, in relation to cover material so that deterioration in display properties can be restrained by preventing organic layer on auxiliary electrode removed by laser light from being scattered on pixel area. In the method for producing top-emission organic EL display device described above, resin film including barrier property with oxygen permeability of 100 cc/m2·day or less is used as the cover material.

Abstract: A top-emission organic EL display device includes a substrate, pixel electrodes, auxiliary electrode, insulating layer formed between the pixel electrodes and includes an opening to expose the auxiliary electrode, organic EL layer formed on the pixel electrodes and includes organic layers, at least one formed on the auxiliary electrode, a contact portion being an opening of the organic layer formed on the auxiliary electrode, and transparent electrode layer formed on the organic EL layer and the contact portion. When an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the pixel electrode is regarded as “a” and an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the auxiliary electrode is regarded as “b”, at least one of “a” and “b” is equal to or greater than 2 ?m.

Abstract: An element manufacturing method in which a section of a substrate that is irradiated with laser light can be covered efficiently. A plurality of protrusions of an intermediate product are lined up in a first direction on a substrate, and a sealing mechanism includes one pair of rollers that rotate around a rotational axis extending in a second direction orthogonal to the first direction. The paired rollers are lined up spacedly in the first direction. In a sealing step using the sealing mechanism, a section of a lid member that is being tensioned between the paired rollers is in close contact with a part of the intermediate product. In an irradiation step, light passes through the section of the lid member that is being tensioned between the paired rollers, and reaches the intermediate product.

Abstract: A top-emission organic EL display device including a substrate, pixel electrodes, auxiliary electrode, insulating layer which is formed between pixel electrodes to cover edge portions of the adjacent pixel electrodes and includes an opening to expose the auxiliary electrode, an organic EL layer which is formed on the pixel electrode, includes plurality of organic layers, and includes at least a light-emitting layer, the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, a contact portion which is an opening of the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and a transparent electrode layer, wherein width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is equal to or greater than 6 ?m, and the transparent electrode layer is electrically connected to the auxiliary electrode in the contact portion.

Abstract: A method for producing top-emission organic EL display device, in which, using cover material having flexibility such as resin film, space between organic EL layer-side substrate and cover material is made into decompressed state, thereafter, adhesion properties between organic EL layer-side substrate and cover material is maintained by retaining decompressed state in the space between organic EL layer-side substrate and cover material when adhering organic EL layer-side substrate and cover material by adjusting pressure of space on opposite side to the organic EL layer-side substrate, in relation to cover material so that deterioration in display properties can be restrained by preventing organic layer on auxiliary electrode removed by laser light from being scattered on pixel area. In the method for producing top-emission organic EL display device described above, resin film including barrier property with oxygen permeability of 100 cc/m2·day or less is used as the cover material.