Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.

Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.

Abstract: A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 ?m, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.

Abstract: In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film.

Abstract: In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.

Abstract: A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 ?m, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.