Abstract: A method for producing a polytetrafluoroethylene particle, which includes subjecting tetrafluoroethylene to suspension polymerization in an aqueous medium to prepare a suspension-polymerized particle of polytetrafluoroethylene, washing and then crushing the suspension-polymerized particle or crushing the suspension-polymerized particle with washing to prepare a crushed particle, dehydrating the crushed particle to prepare a crushed particle having a water content of 40% by mass or less, and subjecting the dehydrated crushed particle to heat treatment to produce a polytetrafluoroethylene particle.

Abstract: A building entrance device (10B) of an intercom device includes a touch operable aerial display (100) for displaying an aerial image (G1, G2) toward a visitor (W1, W2), and a control unit (110). The touch operable aerial display (100) includes: a display device (101) for emitting light; an optical member (102) for reflecting and transmitting light so as to form the aerial image (G1, G2) in a predetermined space; and a detection unit (103) for detecting an operation input of the visitor (W1, W2) to the aerial image (G1, G2). The control unit (110) changes at least one from among a display position, a display angle of the aerial images (G1, G2), and a display mode of a call operation acceptance unit included in the aerial images (G1, G2).

Abstract: A method for producing a polytetrafluoroethylene powder, which includes subjecting tetrafluoroethylene to suspension polymerization in an aqueous medium to prepare a suspension-polymerized particle of non melt-processible polytetrafluoroethylene, drying the suspension-polymerized particle to prepare a dry particle, subjecting the dry particle to fluorine radical treatment to prepare a fluorine radical-treated particle, and crushing the fluorine radical-treated particle to produce a polytetrafluoroethylene powder. Also disclosed is a polytetrafluoroethylene formed article obtained by forming the polytetrafluoroethylene powder, as well as a polytetrafluoroethylene compression-molded article obtained by compression molding the polytetrafluoroethylene powder.

Abstract: An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the formula (1), a ratio of a total mole of epoxy groups in the multi-functional epoxy resin to a mole of the saturated acid anhydride is 1.30 to 3.00, and a mole of the bifunctional epoxy resin relative to a total mole of the multi-functional epoxy resin is 0.001 to 0.15. This provides a highly reliable epoxy-resin-based adhesive composition and film-shaped sealing material having a low viscosity, curability at low temperature, and high adhesiveness, and retaining power generation performance of a perovskite solar cell before and after sealing.

Abstract: A multifunctional display apparatus with high resolution is provided. The display apparatus includes a first pixel; the first pixel includes a first light-emitting device, a second light-emitting device, and a first light-receiving device; the first light-emitting device includes a first light-emitting layer; the second light-emitting device includes a second light-emitting layer; the second light-emitting device has a function of emitting white light; the first light-emitting device has a function of emitting visible light of a color different from that of the second light-emitting device; the first light-receiving device has a function of sensing light emitted from the first light-emitting device; a side surface of the first light-emitting layer faces a side surface of the second light-emitting layer; and the distance between the side surface of the first light-emitting layer and the side surface of the second light-emitting layer is less than or equal to 8 ?m.

Abstract: Addition-curable silicone composition providing cured product having good performance at low temperature and excellent resistance to a temperature change. Also, semiconductor device having high reliability, whose semiconductor element is encapsulated with a cured addition-curable silicone resin composition comprising (A) a branched organopolysiloxane of formula (1): wherein a is an integer of 2-100, b is an integer of 5-100, c is an integer of 5-100, 0.03?a/(a+b)<1.0, and a ratio of (R12R2SiO1/2) units to (R2SiO3/2) units is ?2; (B) an organopolysiloxane of formula (2): (R23SiO1/2)r(R22SiO2/2)s(R2SiO3/2)t(SiO4/2)u??(2) in an amount of 5-900 parts by mass, relative to 100 parts by mass of (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in (C) to the number of the alkenyl groups in (A) and (B) is 0.4-4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

Abstract: One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance.

Abstract: One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount.

Abstract: The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f ??(2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: An addition curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule cures into a product having both a satisfactory hardness and crack resistance.

Abstract: The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e?; (1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f (2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A).

Abstract: One of the purposes of the present invention is to provide an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with a product obtained by curing the addition-curable silicone composition. Thus, an addition-curable silicone resin composition comprising (A) a branched organopolysiloxane represented by the following formula (1): wherein a is an integer of from 2 to 100, b is an integer of from 5 to 100, c is an integer of from 5 to 100, 0.03?a/(a+b)<1.

Abstract: Addition-curable silicone composition providing cured product having good performance at low temperature and excellent resistance to a temperature change. Also, semiconductor device having high reliability, whose semiconductor element is encapsulated with a cured addition-curable silicone resin composition comprising (A) a branched organopolysiloxane of formula (1): wherein a is an integer of 2-100, b is an integer of 5-100, c is an integer of 5-100, 0.03?a/(a+b)<1.0, and a ratio of (R12R2SiO1/2) units to (R2SiO3/2) units is ?2; (B) an organopolysiloxane of formula (2): (R23SiO1/2)r(R22SiO2/2)s(R2SiO3/2)t(SiO4/2)u??(2) in an amount of 5-900 parts by mass, relative to 100 parts by mass of (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in (C) to the number of the alkenyl groups in (A) and (B) is 0.4-4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

Abstract: A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

Abstract: The present invention provides a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f??(2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount.

Abstract: A curable silicone resin composition including: (A) an organopolysiloxane having at least two alkenyl groups per molecule, each bonded to a silicone atom and showing a viscosity of 10 to 1,000,000 mPa·s at 25 degrees C., and (B) an organopolysiloxane having a resin structure composed of 10 to 80 mol % of SiO4/2 unit, 0.1 to 80 mol % of (R1)2SiO2/2 unit and 1 to 60 mol % of (R2)3SiO1/2 unit and having a weight average molecular weight of 1,000 to 10,000. R1 represents an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, and R2 represents, independently of each other, an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, provided that at least one among all of R2 is an alkenyl group.

Abstract: A condensation-curable silicone composition provides a cured product having good performance at a low temperature, excellent resistance to a temperature change, and a crack resistance, and a semiconductor device has a high reliability, whose semiconductor element is encapsulated with the cured product. A condensation-curable silicone composition has (A) a branched organopolysiloxane represented by formula (1-1) or (1-2) with a short branch made of 1 to 4 siloxane units and (C) a condensation catalyst in a catalytic amount. Further, a condensation-curable silicone composition also has (B) an organopolysiloxane having a network structure and represented by formula (2). Further, a semiconductor device is provided with a cured product obtained by curing the condensation-curable silicone composition.

Abstract: The present invention provides a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)e?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1) ; together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f (2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.