Patents by Inventor Takayuki Matsumoto
Takayuki Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11282771Abstract: An electronic component includes a metal member, an inductor, and a encapsulating resin. The metal member has an outer lead, an inner lead provided at a position opposed to the outer lead, and a post connecting the outer lead with the inner lead. The inductor is provided between the outer lead and the inner lead and connected to the outer lead or the inner lead. The encapsulating resin encapsulates the metal member and the inductor.Type: GrantFiled: November 1, 2019Date of Patent: March 22, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Tadaaki Katsuyama
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Patent number: 11227813Abstract: An electronic apparatus includes: a first metal layer; an electronic component that is provided on the first metal layer; a second metal layer that is provided on the first metal layer and on the electronic component; and an insulating resin that fills a space between the first metal layer and the second metal layer so as to cover the electronic component. The second metal layer includes: a sheet-like electrode pad portion; and a connection portion that is disposed along a peripheral edge of the electrode pad portion, and that protrudes from the electrode pad portion toward the first metal layer so as to electrically connect the second metal layer to the first metal layer.Type: GrantFiled: July 7, 2020Date of Patent: January 18, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Tadaaki Katsuyama
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Patent number: 11215639Abstract: A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.Type: GrantFiled: November 16, 2017Date of Patent: January 4, 2022Assignee: Mitsubishi Electric CorporationInventors: Hiroto Matsubayashi, Takayuki Matsumoto, Tomoaki Nakamura
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Patent number: 11207966Abstract: A power transmission device outputting torque from a first power source and a second power source to axles, is provided with: a first shaft coupled with the first power source; a differential configured to differentially distribute the torque to the axles; a first gear set configured to drivingly couple the first shaft with the differential; a second shaft coupled with the second power source; a second gear set drivingly coupled with the second shaft; a clutch configured to receive fluid pressure to drivingly and releasably couple the second gear set with the first gear set; and a pump driven by a third power source at least independent of the first power source and the clutch to generate the fluid pressure, the pump being disposed separate from the clutch and in fluid connection with the clutch to supply the fluid pressure.Type: GrantFiled: September 24, 2020Date of Patent: December 28, 2021Assignee: GKN Automotive LimitedInventors: Masashi Aikawa, Takayuki Matsumoto, Atsushi Kawano, Son Duy Nguyen
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Publication number: 20210335695Abstract: A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.Type: ApplicationFiled: April 19, 2021Publication date: October 28, 2021Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Patent number: 11136344Abstract: A purification agent which includes a compound having a betaine structure, and which is for a sugar chain having a length equal to or longer than that of a monosaccharide or for a glycopeptide having a sugar chain having a length equal to or longer than that of a monosaccharide.Type: GrantFiled: October 31, 2018Date of Patent: October 5, 2021Assignee: SUMITOMO BAKELITE CO., LTD.Inventors: Masaaki Toyoda, Takayuki Matsumoto, Midori Sakaguchi, Takahiro Katayama
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Patent number: 11081286Abstract: A method for manufacturing an electrolytic capacitor includes a first step, a second step, and a third step. In the first step, a capacitor element is formed. The capacitor element includes an anode body, a cathode body, and a separator. The anode body includes a dielectric layer formed on a surface of the anode body. And the separator is disposed between the anode body and the cathode body. In the second step, the capacitor element is impregnated with a treatment solution containing an acid component and a base component. In the third step, the capacitor element is, after the second step, impregnated with a conductive polymer dispersion in a state that a part of the treatment solution remains in the capacitor element. The conductive polymer dispersion is obtained by dispersing, in a solvent, conductive polymer particles each including polyanion. A pH of the treatment solution is higher than a pH of the conductive polymer dispersion.Type: GrantFiled: September 5, 2019Date of Patent: August 3, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shumpei Matsushita, Tomoyuki Tashiro, Takayuki Matsumoto, Tatsuji Aoyama
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Patent number: 11073216Abstract: The present invention provides a flow channel switching valve with a reduced number of components as well as a reduced weight, and a method for assembling the same. A valve shaft adapted to be coupled to a valve element so as to transmit torque of a rotary drive portion to the valve element is inserted through a vertical through-hole, which penetrates through the valve element in the direction of the rotation axis O (i.e., vertical direction), and through a fit-insertion hole provided in a valve body. Then, a drive gear that forms the rotary drive portion is fixed to the upper coupling portion of the valve shaft protruding from the fit-insertion hole so that the valve shaft is rotatably supported with respect to the valve body.Type: GrantFiled: January 17, 2017Date of Patent: July 27, 2021Assignee: FUJIKOKI CORPORATIONInventors: Daisuke Kondo, Kenichi Mochizuki, Masashi Yamashita, Seiichi Hara, Takayuki Matsumoto
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Patent number: 11049803Abstract: A semiconductor module includes: an insulating substrate; a metal pattern provided on the insulating substrate; a solder resist provided on the metal pattern; a semiconductor chip mounted on the metal pattern at an opening portion of the solder resist; and a sealing material sealing the metal pattern, the solder resist and the semiconductor chip, wherein a suction area surrounded by a groove is provided in a portion of the solder resist.Type: GrantFiled: November 17, 2017Date of Patent: June 29, 2021Assignee: Mitsubishi Electric CorporationInventors: Takayuki Matsumoto, Yukimasa Hayashida
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Publication number: 20210153355Abstract: An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.Type: ApplicationFiled: November 10, 2020Publication date: May 20, 2021Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Publication number: 20210140998Abstract: A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.Type: ApplicationFiled: November 16, 2017Publication date: May 13, 2021Applicant: Mitsubishi Electric CorporationInventors: Hiroto MATSUBAYASHI, Takayuki MATSUMOTO, Tomoaki NAKAMURA
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Patent number: 10986732Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.Type: GrantFiled: October 7, 2019Date of Patent: April 20, 2021Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
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Publication number: 20210013129Abstract: An electronic apparatus includes: a first metal layer; an electronic component that is provided on the first metal layer; a second metal layer that is provided on the first metal layer and on the electronic component; and an insulating resin that fills a space between the first metal layer and the second metal layer so as to cover the electronic component. The second metal layer includes: a sheet-like electrode pad portion; and a connection portion that is disposed along a peripheral edge of the electrode pad portion, and that protrudes from the electrode pad portion toward the first metal layer so as to electrically connect the second metal layer to the first metal layer.Type: ApplicationFiled: July 7, 2020Publication date: January 14, 2021Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Tadaaki Katsuyama
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Publication number: 20210001708Abstract: A power transmission device outputting torque from a first power source and a second power source to axles, is provided with: a first shaft coupled with the first power source; a differential configured to differentially distribute the torque to the axles; a first gear set configured to drivingly couple the first shaft with the differential; a second shaft coupled with the second power source; a second gear set drivingly coupled with the second shaft; a clutch configured to receive fluid pressure to drivingly and releasably couple the second gear set with the first gear set; and a pump driven by a third power source at least independent of the first power source and the clutch to generate the fluid pressure, the pump being disposed separate from the clutch and in fluid connection with the clutch to supply the fluid pressure.Type: ApplicationFiled: September 24, 2020Publication date: January 7, 2021Inventors: Masashi Aikawa, Takayuki Matsumoto, Atsushi Kawano, Son Duy Nguyen
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Publication number: 20200411232Abstract: An inductor includes: a first conductor layer including: a pair of first metal pieces; and a first conductor, wherein the first conductor is wound in a spiral shape in the same plane; a second conductor layer including: a pair of second metal pieces, wherein each of the pair of second metal pieces is bonded to a corresponding one of the pair of first metal pieces; and a second conductor, wherein the second conductor is wound in a spiral shape in the same plane, and the second conductor includes an inner circumferential side end portion bonded to an inner circumferential side end portion of the first conductor; a pair of electrodes each of which is bonded to a corresponding one of the pair of second metal pieces; and a sealing resin that covers the first conductor layer, the second conductor layer and the pair of electrodes.Type: ApplicationFiled: June 19, 2020Publication date: December 31, 2020Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
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Patent number: 10870328Abstract: The sealing member includes a first sealing part and a second sealing part and a joining part connecting together the first sealing part and the second sealing part. The first sealing part extends to surround a peripheral edge of the first opening hole on the main body inner peripheral surface side. The second sealing part extends to surround a peripheral edge of the second opening hole on the main body inner peripheral surface side. The joining part is placed at a position where a mutual interval between the first sealing part and the second sealing part is the smallest in the circumferential direction. Each of the first joining end portion and the second joining end portion of the joining part is pressed outward in the valve radial direction by the valve body outer peripheral surface to be resiliently deformed.Type: GrantFiled: April 13, 2017Date of Patent: December 22, 2020Assignees: DENSO CORPORATION, FUJIKOKI CORPORATIONInventors: Takamitsu Mano, Yasumitsu Omi, Kenichi Mochizuki, Takayuki Matsumoto
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Publication number: 20200365331Abstract: An electrolytic capacitor module includes a plurality of capacitor elements, an electrode lead, a sealing member, and a heat dissipation member. The electrode lead is electrically connected to each of the plurality of capacitor elements, and penetrates through the sealing member. The heat dissipation member has a plurality of housing portions that respectively house the plurality of capacitor elements. Further, the heat dissipation member has a first surface and a second surface opposite to the first surface. Each of the plurality of housing portions has an insertion opening opened in the first surface. The sealing member seals the insertion opening. The electrode lead is led out from the insertion opening.Type: ApplicationFiled: August 4, 2020Publication date: November 19, 2020Inventors: HISAO NAGARA, TAKAYUKI MATSUMOTO
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Patent number: 10828977Abstract: A power transmission device outputting torque from a first power source and a second power source to axles, is provided with: a first shaft coupled with the first power source; a differential configured to differentially distribute the torque to the axles; a first gear set configured to drivingly couple the first shaft with the differential; a second shaft coupled with the second power source; a second gear set drivingly coupled with the second shaft; a clutch configured to receive fluid pressure to drivingly and releasably couple the second gear set with the first gear set; and a pump driven by a third power source at least independent of the first power source and the clutch to generate the fluid pressure, the pump being disposed separate from the clutch and in fluid connection with the clutch to supply the fluid pressure.Type: GrantFiled: October 30, 2018Date of Patent: November 10, 2020Assignee: GKN Automotive Ltd.Inventors: Masashi Aikawa, Takayuki Matsumoto, Atsushi Kawano, Son Duy Nguyen
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Publication number: 20200339739Abstract: A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.Type: ApplicationFiled: November 13, 2018Publication date: October 29, 2020Applicant: JXTG Nippon Oil & Energy CorporationInventors: Masaki MINAMI, Takayuki MATSUMOTO, Ayumu KOMATA
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Patent number: 10748830Abstract: A wiring board (2) is provided on a heat radiation plate (1). A semiconductor chip (8) is provided on the wiring board (2). A case housing (10) is provided on the heat radiation plate (1) and surrounds the wiring board (2) and the semiconductor chip (8). Adhesive agent (11) bonds a lower surface of the case housing (10) and an upper surface peripheral portion of the heat radiation plate (1). A sealing material (13) is filled in the case housing (10) and covers the wiring board (2) and the semiconductor chip (8). A step portion (16,17) is provided to at least one of the lower surface of the case housing (10) and the upper surface peripheral portion of the heat radiation plate (1). A side surface of the heat radiation plate (1) and an outer side surface of the case housing (10) are flush with each other.Type: GrantFiled: September 20, 2016Date of Patent: August 18, 2020Assignee: Mitsubishi Electric CorporationInventors: Yukimasa Hayashida, Daisuke Oya, Takayuki Matsumoto, Ryutaro Date