Abstract: A detection device includes: an acquisition unit configured to acquire a detection result of a plurality of targets present in a traveling direction of a vehicle from an imaging device attached to the vehicle; a calculation unit configured to determine whether the plurality of targets detected with movement of the vehicle are an identical target based on the detection result acquired by the acquisition unit and calculate a coordinate of each of the plurality of targets in chronological order; and a detection unit configured to detect a pitch angle and a roll angle of the imaging device with respect to a horizontal direction based on the coordinate calculated in chronological order by the calculation unit.

Abstract: A PLL frequency synthesizer 1 according to one embodiment of the present invention is provided with a frequency divider 30, a phase comparator 40, a charge pump 50, a loop filter 60, a voltage controlled oscillator 70, and a changeover switch (within the switching unit 80). The loop filter 60 has a reference potential on a semiconductor substrate as a ground potential, and the changeover switch is formed on the semiconductor substrate 2 and switches connection between an intermediate node of the loop filter 60 and the reference potential on the semiconductor substrate 2 to switch the time constant of the loop filter 60.

Abstract: A triaxial acceleration sensor module 100 includes: a hollow housing 30 provided with a partition plate 31 having a through-hole 32; a triaxial acceleration sensor 1 provided inside the housing 30; and a sensor driving IC 40 for driving the triaxial acceleration sensor 1. The triaxial acceleration sensor 1 includes: a frame 23; a weight member 22 provided inside the frame 23; a weight member supporting portion 15 for supporting the weight member 22 in a freely suspended manner; and a plurality of flexible beams each having piezo resistance elements 13 thereon. In the triaxial acceleration sensor module 100, the through-hole 32 has a size through which the triaxial acceleration sensor 1 can pass. Further, the triaxial acceleration sensor 1 is directly bonded to the sensor driving IC 40 via the through-hole 32, and the sensor driving IC 40 is bonded to the partition plate 31 of the housing 30.

Abstract: A semiconductor sensor 1 includes: a frame 21 having an opening; an actuation diaphragm 16 provided inside the frame 21 in a spaced-apart relationship with respect to the frame 21; a plurality of flexible beams 19a, 19b provided to interconnect the frame 21 and the actuation diaphragm 16, each of the flexible beams 19a, 19b having piezo resistance elements 30a, 30b, 30c thereon; metallic wiring lines 33 provided on one major surfaces of the respective flexible beams 19a, 19b for connecting each of the piezo resistance elements 30a, 30b, 30c to each other; and a plurality of thermal stress absorbing portions provided on the other major surfaces of the respective flexible beams 19a, 19b for absorbing thermal stresses developed in the beams 19a, 19b due to the difference of coefficients of thermal expansion between the respective beams 19a, 19b and the corresponding metallic wiring lines 33.

Abstract: A triaxial acceleration sensor module 100 includes: a hollow housing 30 provided with a partition plate 31 having a through-hole 32; a triaxial acceleration sensor 1 provided inside the housing 30; and a sensor driving IC 40 for driving the triaxial acceleration sensor 1. The triaxial acceleration sensor 1 includes: a frame 23; a weight member 22 provided inside the frame 23; a weight member supporting portion 15 for supporting the weight member 22 in a freely suspended manner; and a plurality of flexible beams each having piezo resistance elements 13 thereon. In the triaxial acceleration sensor module 100, the through-hole 32 has a size through which the triaxial acceleration sensor 1 can pass. Further, the triaxial acceleration sensor 1 is directly bonded to the sensor driving IC 40 via the through-hole 32, and the sensor driving IC 40 is bonded to the partition plate 31 of the housing 30.

Abstract: A DSRC car-mounted equipment which prevents, in advance, inconvenience caused by disorder in the antenna unit of the car-mounted equipment.

Abstract: A grooved magnetic substrate for thin film magnetic heads having grooves filled with glass having substantially no pores therein and an interdiffusion layer between substrate and glass of 5 microns or less. The substrate is produced by hot-filling the groove with glass at a viscosity of 10.sup.6 -10.sup.8 poise and subjecting the substrate to hot isostatic pressure at 10.sup.6 poise or higher to define a definite apex point to define the gap depth.