Abstract: A bipolar transistor includes a collector layer, a base layer, and an emitter layer that are formed in this order on a compound semiconductor substrate. The emitter layer is disposed inside an edge of the base layer in plan view. A base electrode is disposed on partial regions of the emitter layer and the base layer so as to extend from an inside of the emitter layer to an outside of the base layer in plan view. An insulating film is disposed between the base electrode and a portion of the base layer, with the portion not overlapping the emitter layer. An alloy layer extends from the base electrode through the emitter layer in a thickness direction and reaches the base layer. The alloy layer contains at least one element constituting the base electrode and elements constituting the emitter layer and the base layer.

Abstract: The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

Abstract: An arm wearable device including a case, a module which has a brittle member and is provided in the case, and a plurality of holding portions which holds the module in the case such that flexural deformation of the module is restricted to deformation where a virtual straight line extending in a longitudinal direction of the brittle member serves as a center line.

Abstract: The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

Abstract: A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than ? of an average particle size of the insulating particles.

Abstract: A wiring board includes an insulating layer made of an insulating resin containing inorganic insulating particles, a groove positioned in a surface of the insulating layer and including a wall surface being perpendicular to the surface of the insulating layer, and a wiring conductor filled in the groove, wherein a cross-section of the insulating resin and cross-sections of the inorganic insulating particles are exposed at the wall surface in flush with each other.

Abstract: A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than ? of an average particle size of the insulating particles.

Abstract: A wiring board includes an insulating layer made of an insulating resin containing inorganic insulating particles, a groove positioned in a surface of the insulating layer and including a wall surface being perpendicular to the surface of the insulating layer, and a wiring conductor filled in the groove, wherein a cross-section of the insulating resin and cross-sections of the inorganic insulating particles are exposed at the wall surface in flush with each other.

Abstract: The wiring board of the present disclosure includes an insulating layer, and a wiring conductor existing so as to be adjacent to both main surfaces of the insulating layer; the insulating layer includes at least two particle-containing resin layers containing insulating particles in an insulating resin, and a particle-free resin layer formed of an insulating resin; and the particle-free resin layer is interposed between the particle-containing resin layers.

Abstract: The wiring board of the present disclosure includes an insulating layer, and a wiring conductor existing so as to be adjacent to both main surfaces of the insulating layer; the insulating layer includes at least two particle-containing resin layers containing insulating particles in an insulating resin, and a particle-free resin layer formed of an insulating resin; and the particle-free resin layer is interposed between the particle-containing resin layers.

Abstract: According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.

Abstract: According to one embodiment of the invention, a method for manufacturing a circuit board comprises forming a plurality of electroplated layers arranged apart from each other in a planer view on an underlying layer, wherein each of the electroplated layers comprises a first layer formed on the underlying layer by direct current electroplating, a second layer formed on the first layer by periodic reverse electroplating and a third layer, which is the outermost layer of the electroplated layer, formed on the second layer by direct current electroplating; etching a portion of the underlying layer between the electroplated layers in the planer view; forming an insulating layer on the third layer; forming a penetrating hole through the insulating layer to expose a part of the third layer at the bottom surface of the penetrating hole; forming a sputtered layer on an inner wall surface and the bottom surface of the penetrating hole.

Abstract: According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.

Abstract: A disk reproducing apparatus with improved quality is provided which has a clamper and a clamper plate. By providing the clamp plate with connection portions radially extending from a radially inner peripheral portion toward radially outer peripheral portion of the clamp plate, the axial displacement relative to a clamp holder can be increased as compared to that in the existing structure. Moreover, by disposing the clamper on the radially inner peripheral portion of the clamp plate so as to be elastically deformable, the spacing in clamping can be increased to a drive part.

Abstract: Embodiments in accordance with the present invention provide an auxiliary storage device that prevents performance degradation and collects data useful for buffer failure analysis. In one embodiment, a data set including user data and cyclic redundancy check (CRC) information is temporarily stored in a buffer. If a CRC error is detected in a data set that is read from the buffer during a data write or data read, the contents of the data set and the affected buffer address are recorded on a nonvolatile recording medium. Further, the buffer address is disabled. This makes it possible to store the data for reproducing a soft error that occurs in the buffer and prevent the performance of the auxiliary storage device from being degraded by a buffer error.

Abstract: A disk reproducing apparatus with improved quality is provided which has a clamper and a clamper plate. By providing the clamp plate with connection portions radially extending from a radially inner peripheral portion toward radially outer peripheral portion of the clamp plate, the axial displacement relative to a clamp holder can be increased as compared to that in the existing structure. Moreover, by disposing the clamper on the radially inner peripheral portion of the clamp plate so as to be elastically deformable, the spacing in clamping can be increased to a drive part.

Abstract: When a head passes over a track with a projected item in a seek operation, the CPU delays a seek start time to conduct the seek by changing a period of time from a seek start position to a position of the track with a projected item. Or, the CPU conducts seek control by changing a speed table. Or, the CPU changes a sequence of items of a tag queue to obtain a seek locus not passing the projected item. By the control operation, a seek error due to thermal asperity is prevented and the head is not damaged. This also prevents appearance of a new projected item produced by contact between the magneto-resistive head and the projected item on the recording medium.

Abstract: When a head passes over a track with a projected item in a seek operation, the CPU delays a seek start time to conduct the seek by changing a period of time from a seek start position to a position of the track with a projected item. Or, the CPU conducts seek control by changing a speed table. Or, the CPU changes a sequence of items of a tag queue to obtain a seek locus not passing the projected item. By the control operation, a seek error due to thermal asperity is prevented and the head is not damaged. This also prevents appearance of a new projected item produced by contact between the magneto-resistive head and the projected item on the recording medium.