Abstract: A sealant composition of the present invention includes a rubber component (A), a tackifier (B), and a plasticizer (C), in which the tackifier (B) has a softening point of 50° C. or higher, the plasticizer (C) has a dynamic viscosity at 40° C. of 2500 mm2/s or less, and a mass ratio of (C)/(B) of the plasticizer (C) to the tackifier (B) is 0.35 or more. Thus, the sealant composition can provide improved sealability, viscosity temperature dependency, and fluidity during storage of a tire.

Abstract: A photocurable resin of the present technology contains: a main backbone chain having repeating units represented by Formulas (Ia) and (Ib), and a (meth)acryloyl group and a non-photoreactive group at terminals; the non-photoreactive group being at least one type selected from the group consisting of saturated hydrocarbon groups and aromatic hydrocarbon groups which optionally have a heteroatom; a hydroxy group, an amino group, —CH?NH, a carboxy group, or a mercapto group being not bonded to an end of the non-photoreactive group; a content of the repeating unit represented by Formula (Ia) being greater than 15 mol % of an amount of the main backbone chain; and contents of the (meth)acryloyl group and the non-photoreactive group each being 5 mol % or greater of an amount of the ends.

Abstract: A photocurable resin of the present technology contains: a main backbone chain having repeating units represented by Formulas (Ia) and (Ib), and a (meth)acryloyl group and a non-photoreactive group at terminals; the non-photoreactive group being at least one type selected from the group consisting of saturated hydrocarbon groups and aromatic hydrocarbon groups which optionally have a heteroatom; a hydroxy group, an amino group, —CH?NH, a carboxy group, or a mercapto group being not bonded to an end of the non-photoreactive group; a content of the repeating unit represented by Formula (Ia) being greater than 15 mol % of an amount of the main backbone chain; and contents of the (meth)acryloyl group and the non-photoreactive group each being 5 mol % or greater of an amount of the ends.

Abstract: The present technology provides an electrically conductive composition comprising: electrically conductive particles; an epoxy resin A that is solid at 25° C. with an epoxy equivalent weight of 400 g/eq to 1500 g/eq, or an epoxy resin D that is solid at 25° C. with an epoxy equivalent weight of 1500 g/eq to 3500 g/eq; an epoxy resin B that is liquid at 25° C. with an epoxy equivalent weight of less than 400 g/eq; a curing agent C; and a solvent. A total amount of A, B, and C is 3-10 parts by mass per 100 parts by mass of the electrically conductive particles, or a total amount of D, B, and C is 3-6 parts by mass per 100 parts by mass of the electrically conductive particles. A mass ratio [(A or D)/B] is from 20/80 to 80/20, and a mass ratio [C/{(A or D)+B}] is from 2/98 to 10/90.

Abstract: An adhesion-imparting agent of the present technology is an organopolysiloxane represented by (R11R12SiO2/2)a(R2SiO3/2)b(R3SiO3/2)c(R4O1/2)d. R11 and R12 each independently represent an aryl group having from 6 to 20 carbons or an alkyl group having from 1 to 20 carbons, R2 represents an alkenyl group, R3 represents an epoxy group-containing group or an oxetanyl group-containing group, and R4 represents a hydrogen atom or an alkyl group having from 1 to 10 carbons; and a, b, c, and d are each a positive number and satisfy relationship formulas of 0.80?a+b+c+d?1.00, c/(a+b+c)>0.01, d/(a+b+c)>0.02, and d/(2a+b+c+d)<0.05.

Abstract: The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).

Abstract: The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).

Abstract: Provided is a curable resin composition that contains a silicon-containing compound (A) having a silanol group and an aryl group, a silicon-containing compound (B) having at least two silicon atom-bonded hydrogen atoms and at least one aryl group in one molecule, a branched-chain organopolysiloxane (C) having an alkenyl group and an aryl group, and a hydrosilylation reaction catalyst (D).

Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons. A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.

Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons. A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.

Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.

Abstract: A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e??(1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.

Abstract: A bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide, i.e., a polysulfide that contains bonded hydroxypolyalkyleneoxy groups instead of alkoxy groups in the bis(trialkoxysilylalkyl) polysulfide; a method of manufacturing of the aforementioned polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and a polyalkyleneglycol; a tire rubber additive to a tire rubber composition that comprises a bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide alone or a mixture of bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide and a polyalkyleneglycol; and a tire rubber composition that contains the aforementioned additive.

Abstract: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.

Abstract: A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.

Abstract: A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e??(1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.

Abstract: A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.

Abstract: A method for manufacturing a bis(silatranylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting all Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a method for the preparation of a mixture of a bis(silatranylalkyl) polysulfide and a (silatranyalkyl)(trialkoxysilyl) disulfide or a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting a part of Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a mixture of a bis(silatranylalkyl) polysulfide and a (silatranylalkyl)(trialkoxysilyl) disulfide; a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(tri

Abstract: To provide a highly efficient and stable method for the preparation of a silicon-containing polysulfide-type polymer, in particular, a polysulfide-type polymer with organosilyl groups, the method being carried out without generation of by-products that could have high impact on the environment. A method for the preparation of a silicon-containing polysulfide-type polymer characterized by mixing (A) a silicon-containing compound having a silicon atom-bonded monovalent organic group having an aliphatic unsaturated bond; (B) a polysulfide polymer with at least two mercapto groups in one molecule; and (C) an organic base or ammonia; the mixing being carried out in the presence of (D) sulfur.

Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.