Patents by Inventor Takehide Okami

Takehide Okami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6074963
    Abstract: Thermally conductive composite sheets which comprise a silicone rubber layer which contains thermally conductive fillers and has an Asker C hardness from 5 to 50, and a porous reinforcing material layer which has pores of at least 0.3 mm in diameter and is incorporated within the silicone rubber layer. The thermally conductive composite sheets of the present invention are superior in thermal conductivity and flexibility (for contact towards the electronic parts and so on) and are suitable for mass production and for the assembly process of electronic instruments. Therefore, utilization of the thermally conductive composite sheets enables the effective production of electronic instruments wherein performance degradation caused by heat hardly occurs.
    Type: Grant
    Filed: July 29, 1996
    Date of Patent: June 13, 2000
    Assignee: Shin-Etsu Chemical, Co., Ltd.
    Inventors: Takehide Okami, Tokio Sekiya, Takeshi Hashimoto
  • Patent number: 6054520
    Abstract: A heat conductive BN filler having a cohesive factor of 3-50% is provided. An electrically insulating/heat dissipating sheet is obtained by mixing the BN filler with an organopolysiloxane and a crosslinking agent, shaping the resulting silicone rubber composition into a sheet form, followed by vulcanization. Without special orienting means, the BN particles are oriented in the sheeting step such that their a-axis is perpendicular to the sheet surface.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: April 25, 2000
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomokazu Washio, Tokio Sekiya, Takehide Okami
  • Patent number: 5942565
    Abstract: An adhesive sheet is obtained by sheeting a claylike silicone composition comprising an organopolysiloxane, a filler, and an adhesive aid to a gage of 0.1 to 5 mm. The adhesive sheet is easy to handle and bondable to such adherends as metals and plastics to exert a high bond strength.
    Type: Grant
    Filed: July 3, 1997
    Date of Patent: August 24, 1999
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Yuuki Sakurai
  • Patent number: 5705258
    Abstract: The composite silicone rubber sheet comprises a thermal conductive silicone rubber layer, both surfaces of which are tacky, containing a thermal conductive filler such as aluminum oxide and having a Asker C hardness of 5 to 50 and a thickness of 0.4 mm or less; at least one reinforcing sheet such as glass cloth arranged within said silicone rubber layer; and a releasable protective sheet such as a release paper covered on at least one tacky surface of said silicone rubber layer. Since the composite silicone rubber sheet is superior in thermal conductivity and has a good flexibility and tackiness, when used as a heat dissipating insulation sheet, the composite silicone rubber sheet has the advantages of being superior in adherence, free of oil-bleeding, suitable for mass-production, and capable of not lowering workability in assembling electronic parts and the like.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: January 6, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Tokio Sekiya
  • Patent number: 5654071
    Abstract: An anti-dust gel sheet characterized in being formed from layers of a silicone gel, having a penetration of 20-130 after curing, coated on both sides of a sheet like reinforcing material is disclosed. Since the sheet has a suitable penetration, damage of the sheet does not easily occur and it can therefore be used repeatedly.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 5, 1997
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Tokio Sekiya, Takeshi Hashimoto
  • Patent number: 5569684
    Abstract: Disclosed is a heat conductive silicone rubber composition comprising a cross-linkable organopolysiloxane composition and a filler, with the filler being magnesium oxide treated so as to have a hydrophobic surface and having a content of from 30 to 70% by volume in the composition.
    Type: Grant
    Filed: March 3, 1995
    Date of Patent: October 29, 1996
    Assignee: Takita Patent & Engineering
    Inventors: Takehide Okami, Tokio Sekiya
  • Patent number: 5547742
    Abstract: A fuser roll having a metal core shaft has a resilient layer placed around the metal core shaft with at least the surface layer of the resilient layer comprising a fluorosilicone rubber layer containing 5 to 50 wt. % polytetrafluoroethylene. Since this fuser roll is excellent in releasability and silicone oil resistance, the durability is excellent, and the image obtained by a copying machine wherein the roll is used becomes sharp.
    Type: Grant
    Filed: July 5, 1994
    Date of Patent: August 20, 1996
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Makoto Satoh, Takehide Okami, Noboru Shimamoto
  • Patent number: 5432280
    Abstract: A gel-forming silicone composition comprising, compounded in a gel-forming base composition, a silane compound having the following general formula (1) or (2): ##STR1## wherein R.sup.1 is an alkyl or aryl group, R.sup.2 is an alkyl or alkoxyalkyl group, R.sup.3 and R.sup.4 are each a hydrogen atom, a methyl group or an ethyl group, R.sup.5 is an alkyl group or an ester linkage-containing group, and a, b and n are each an integer from 0 to 2. The composition is capable of forming, under mild conditions, a silicone gel which exhibits good adherence to a variety of substrates.
    Type: Grant
    Filed: July 2, 1993
    Date of Patent: July 11, 1995
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroyasu Hara, Masayuki Ikeno, Takehide Okami
  • Patent number: 5424374
    Abstract: Heat curable organopolysiloxane compositions of this invention comprise (A) organopolysiloxanes with at least two alkenyl groups within the molecule, (B) capsules containing organo hydrogen polysiloxanes which comprise (B-1) organo hydrogen polysiloxanes with at least two hydrogen atoms which are bound to silicon atoms within the molecule and (B-2) a thermoplastic resin having a softening point or glass transition temperature in the range from 40.degree. to 200.degree. C., wherein the component (B-1) forms a single nucleus or multiple nuclei and the component (B-2) is a wall material, and (C) platinum group metallic catalysts. The said compositions contain a crosslinking agent which is encapsulated with thermoplastic resins, therefore they possess a superior stability during room temperature storage for a long time period, and the heating of the compositions forms a rapid and uniform crosslinking to prepare the cured products.
    Type: Grant
    Filed: September 6, 1994
    Date of Patent: June 13, 1995
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Takehide Okami
  • Patent number: 5384075
    Abstract: An addition-curable type organopolysiloxane composition having a volume resistivity of 10.sup.7 .OMEGA.cm or below, comprising (A) an organopolysiloxane having at least two alkenyl group in its molecule and a viscosity at 25.degree. C. of from 100 to 200,000 cSt, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in its molecule, (C) a platinum group metal catalyst, (D) an organosilicon compound which has at least one silicon-bonded hydrogen atom in its molecule and in which at least one member selected from the group consisting of epoxy group-containing organic groups and alkoxy groups is attached to a silicon atom, and (E) an electrically conductive filler. This composition can be cured by an ultra high frequency heating system to form an adhesive cured product. It is therefore possible to obtain cured products with stable physical properties under constantly fixed conditions irrespective of the heat capacity of adherends.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: January 24, 1995
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Takehide Okami
  • Patent number: 5352724
    Abstract: An addition-curable type silicone rubber composition comprising (A) an organopolysiloxane having an alkenyl group such as vinyl in its molecule, (B) an organohydrogenpolysiloxane having at least two SiH groups in its molecule, (C) a platinum catalyst such as platinum, chloroplatinic acid, etc., (D) an inorganic filler, (E) an organic titanium compound such as tetraethyl titanate, and (F) water. The composition exhibits good fluidity, and behaves like a Newtonian fluid, even where carbon black or a silica or alumina having an average particle diameter of 1 .mu.m or above is incorporated in the composition as an inorganic filler for improving such characteristics as heat resistance, thermal conductivity, etc.
    Type: Grant
    Filed: July 15, 1993
    Date of Patent: October 4, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Masayuki Ikeno, Masaya Arakawa, Kaoru Michimata, Masanobu Miyakoshi, Takehide Okami
  • Patent number: 5349037
    Abstract: An adhesion composition comprising:(A) a high molecular weight fluorosilicone polymer containing the unit having the formula (1):RfCH.sub.2 CH.sub.2 (CH.sub.3)SiO-- (1)wherein Rf is a perfluoroalkyl group containing 1 to 8 carbon atoms, in an amount of 30 mol % or more in the molecule, and blocked with the vinyl group at the both ends,(B) a low molecular fluorosilicone polymer containing the unit having the formula (1) in an amount of 30 mol % or more in the molecule, and containing an average of 3 or more units having the following formula (2):CH.sub.2 .dbd.CH(CH.sub.3)SiO-- (2),(C) an organohydrogenpolysiloxane,(D) an organosilane or organopolysiloxane having at least one hydrogen atom or alkenyl group bonded to a silicon atom and having at least one of the oxirane group, dialkoxysilyl groups or trialkoxysilyl groups, and(E) a platinum catalyst. The cured product of the composition has good resistance to gasoline, and therefore useful for automobile parts.
    Type: Grant
    Filed: March 3, 1993
    Date of Patent: September 20, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Kaoru Michimata, Takehide Okami
  • Patent number: 5312855
    Abstract: The adhesive organopolysiloxane composition contains a compound having two or more allyl ester groups in combination with an adhesion imparting agent of a silicon compound having at least one group selected from the group consisting of an alkoxy group and an epoxy containing hydrocarbon group and also having at least one silicon-bonded hydrogen atom. This composition is markedly improved in adhesion to various substrates and durability of the adhesion.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: May 17, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Takehide Okami
  • Patent number: 5216104
    Abstract: An addition-type silicone rubber composition comprising (a) an organopolysiloxane containing at least two alkenyl groups bonded to the silicon atoms in one molecule, (b) an organopolysiloxane containing one alkenyl group bonded to the silicon atom in one molecule on an average, (c) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to the silicon atoms, (d) a platinum catalyst; and a product of curing the composition. This silicone rubber composition can give a low-modulus silicone rubber by curing which neither contaminates the material in contact therewith nor deforms owing to shrinkage, without hindering the adhesion of the composition during its curing stage.
    Type: Grant
    Filed: July 17, 1990
    Date of Patent: June 1, 1993
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Hironao Fujiki
  • Patent number: 5104919
    Abstract: A curable silicon composition comprising:(A) an organopolysiloxane containing at least two silicon-bonded unsaturated aliphatic hydrocarbon groups and having a viscosity of from 100 to 200,000 cSt at 25.degree. C.,(B) a vinyl group-containing organocyclopolysiloxane having the general formula (I): ##STR1## wherein R represents a hydrocarbon group having from 1 to 6 carbon atoms excluding unsaturated aliphatic hydrocarbon groups, and n represents an integer of from 3 to 8,(C) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms in the molecule,(D) a platinum family metal catalyst, and(E) a triazole compound.This curable silicone composition has good curing properties and can produce cured products having a markedly small permanent compression set.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: April 14, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takehide Okami, Masanobu Miyakoshi, Hajime Kiriki
  • Patent number: 4900362
    Abstract: A primer composition, comprising:(A) an organosilicon compound having in its molecule i) at least one hydrogen atom bonded to a silicon atom and ii) at least one group selected from silicon-bonded alkoxy groups and silicon-bonded and epoxy group-containing organic groups; and (B) an organic titanium compound. This composition can achieve a durable adhesion even under severe conditions as in high-temperature air, high-temperature water vapor, and high-temperature oil.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: February 13, 1990
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Takehide Okami, Yuji Hinoto
  • Patent number: 4623693
    Abstract: The room temperature-curable organopolysiloxane composition of the invention is characteristic in the remarkably increased adhesive bonding strength of the rubber of the composition to the surface of a substrate of metals, plastics and others on which the composition has been cured. The composition is also advantageous in the improved thixotropy despite the admixture of an adhesion improver mentioned below. Thus, the composition comprises, in addition to conventional components in a deacidification type room temperature curable organopolysiloxane composition, a specific organic silicon compound represented by the general formula(R.sup.3 O).sub.b (MeCOO).sub.3-b Si--O--R.sup.4 --O--Si(OCOMe).sub.3-b (OR.sup.3).sub.b,in which R.sup.3 is a monovalent hydrocarbon group, R.sup.4 is a divalent hydrocarbon group or a polyoxyalkylene group of the formula --C.sub.x H.sub.2x --O).sub.n C.sub.x H.sub.2x --, x being 2 to 4 and n being a positive integer, and b is 1 or 2.
    Type: Grant
    Filed: August 5, 1985
    Date of Patent: November 18, 1986
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshio Inoue, Takehide Okami, Koji Yokoo, Hitoshi Kinami
  • Patent number: 4579636
    Abstract: The silicone rubber composition of the invention essentially comprises (a) a silanolic hydroxy-terminated diorganopolysiloxane, (b) a hydrolyzable vinyl silane compound such as a vinyl trialkoxysilane and (c) an organopolysiloxane having at least two mercapto groups in the form of, for example, 3-mercaptopropyl groups, in a molecule. The composition can be cured by two different mechanisms of crosslink formation one by the condensation reaction between the silanol groups in (a) and the hydrolyzable groups in (b) in the presence of atmospheric moisture and the other between the vinyl groups in (b) and mercapto groups in (c) under irradiation with ultraviolet light. The two-way cruability of the composition greatly expands the application fields of the silicone rubber composition.
    Type: Grant
    Filed: April 29, 1985
    Date of Patent: April 1, 1986
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshio Inoue, Takehide Okami
  • Patent number: 4485206
    Abstract: The invention provides a room temperature-curable organopolysiloxane composition comprising (a) a diorganopolysiloxane terminated at both molecular chain ends with silanolic hydroxy groups, (b) a methylpolysiloxane composed of monofunctional siloxy units Me.sub.3 SiO.sub.1/2 tetrafunctional siloxane units SiO.sub.2 in a specified molar ratio, (c) an organosilane or organopolysiloxane having at least three hydrolyzable groups bonded to the silicon atom(s) per molecule, (d) oxide, carbonate or hydroxycarbonate of zinc, and (e) a thiazole, thiuram or dithiocarbamate compound. The composition is curable by standing in air into a rubbery elastomer which is highly resistant against oils, e.g. engine oils and gear oils in automobiles, even at elevated temperatures.
    Type: Grant
    Filed: October 27, 1983
    Date of Patent: November 27, 1984
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshio Inoue, Takehide Okami
  • Patent number: 4059473
    Abstract: The primer compositions consist essentially of a mercapto-containing organosilane or organopolysiloxane as one component and a titanic acid ester as the other. They are suitable for adhesively bonding a room-temperature-curing silicone rubber elastomer irrespective of its crosslinking mechanism to various substrates. The bond obtained by use of the primer composition is very strong and highly resistant to water or sea water even on prolonged immersion at high temperatures.
    Type: Grant
    Filed: May 25, 1976
    Date of Patent: November 22, 1977
    Assignee: Shin-Etsu Chemical Company Limited
    Inventor: Takehide Okami