Abstract: A laminated glass 1 includes a resin plate 2 as a core material, a first glass sheet 4 disposed on one surface side of the resin plate 2 via a first adhesive layer 3, and a second glass sheet 6 disposed on the other surface side of the resin plate 2 via a second adhesive layer 5. A heat reflective film 7 is disposed in the first adhesive layer 3, and a heat absorbing film 8 is disposed in the second adhesive layer 5, the heat absorbing film 8 functioning as a light absorbing member capable of absorbing a portion of incident light. The heat reflective film 7 is disposed closer to the first glass sheet 4 than the heat absorbing film 8 is.

Abstract: Provided is a glass resin laminate (1), including: a resin layer (2); a glass sheet (3); an adhesive layer (4) configured to bond the glass sheet (3) and the resin layer (2); and a functional film (5) interposed in the adhesive layer (4). The adhesive layer (4) includes a first portion (4a) positioned between the resin layer (2) and the functional film (5), a second portion (4b) positioned between the glass sheet (3) and the functional film (5), and a fused portion (4c) obtained by fusing an end portion of the first portion (4a) and an end portion of the second portion (4b).

Abstract: Provided is a glass resin laminate (1), including: a resin layer (2); a glass sheet (3); an adhesive layer (4) configured to bond the glass sheet (3) and the resin layer (2); and a functional film (5) interposed in the adhesive layer (4). The adhesive layer (4) includes a first portion (4a) positioned between the resin layer (2) and the functional film (5), a second portion (4b) positioned between the glass sheet (3) and the functional film (5), and a fused portion (4c) obtained by fusing an end portion of the first portion (4a) and an end portion of the second portion (4b).

Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.