Patents by Inventor Takehiko Tokoro
Takehiko Tokoro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9570856Abstract: A connector is configured of a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: a first sidewall portion and a second sidewall portion that are in parallel with each other and a plurality of first connection terminals provided on the sidewall portions. The receptacle connector has an insertion concave portion to which the insertion convex portion is inserted and in which a plurality of second connection terminals that are contacted with the first connection terminals are provided. The respective inner side surfaces of the first sidewall portion and the second sidewall portion face each other across a space, and the plurality of first connection terminals are arranged on the respective outer side surfaces of the first sidewall portion and the second sidewall portion.Type: GrantFiled: February 17, 2015Date of Patent: February 14, 2017Assignee: Hitachi Metals, Ltd.Inventors: Masataka Sato, Takehiko Tokoro, Yoshinori Sunaga, Kinya Yamazaki, Yoshiaki Ishigami
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Publication number: 20150270645Abstract: A connector is configured of a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: a first sidewall portion and a second sidewall portion that are in parallel with each other and a plurality of first connection terminals provided on the sidewall portions. The receptacle connector has an insertion concave portion to which the insertion convex portion is inserted and in which a plurality of second connection terminals that are contacted with the first connection terminals are provided. The respective inner side surfaces of the first sidewall portion and the second sidewall portion face each other across a space, and the plurality of first connection terminals are arranged on the respective outer side surfaces of the first sidewall portion and the second sidewall portion.Type: ApplicationFiled: February 17, 2015Publication date: September 24, 2015Inventors: Masataka SATO, Takehiko TOKORO, Yoshinori SUNAGA, Kinya YAMAZAKI, Yoshiaki ISHIGAMI
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Patent number: 8395906Abstract: A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.Type: GrantFiled: June 1, 2010Date of Patent: March 12, 2013Assignee: Hitachi Cable, Ltd.Inventors: Masayuki Nikaido, Yoshiaki Ishigami, Kenichi Tamura, Takehiko Tokoro
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Publication number: 20100328920Abstract: A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.Type: ApplicationFiled: June 1, 2010Publication date: December 30, 2010Applicant: Hitachi Cable, Ltd.Inventors: Masayuki Nikaido, Yoshiaki Ishigami, Kenichi Tamura, Takehiko Tokoro
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Publication number: 20100215325Abstract: An optical transmission module, includes a case including a bottom plane, a circuit substrate including a first card edge provided at one end of the circuit substrate, the circuit substrate being provided in the case to be inclined with the bottom plane of the case, an optical element mounted on the circuit substrate, and a connector member including one end part provided toward a direction opposite to the circuit substrate and another end part provided toward the circuit substrate. The first card edge is electrically connected to another end of the connector member. The one end part of the connector member includes a second card edge, the second card edge is disposed to be parallel with the bottom plane of the case.Type: ApplicationFiled: April 29, 2010Publication date: August 26, 2010Applicant: Hitachi Cable, Ltd.Inventors: Kenichi Tamura, Yoshiaki Ishigami, Takehiko Tokoro
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Publication number: 20080247713Abstract: An optical transmission module includes a ferrule with a built-in optical fiber, an optical member for reflecting or transmitting plural different wavelength optical signals, a first optical element for emitting an optical signal into the optical fiber via the optical member, a second optical element for receiving an optical signal from the optical fiber via the optical member, a package accommodating the first and second optical elements, a circuit substrate for driving the first and second optical elements, the circuit substrate being electrically connected to the package, a case accommodating the package and the circuit substrate, and an inclined portion provided in an inner surface of the case, the circuit substrate being mounted on the inclined portion.Type: ApplicationFiled: March 19, 2008Publication date: October 9, 2008Applicant: HITACHI CABLE, LTD.Inventors: Kenichi Tamura, Yoshiaki Ishigami, Takehiko Tokoro
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Patent number: 4744193Abstract: A mixture consisting essentially of (1) an organic polyisocyanate compound and/or a prepolymer having terminal isocyanate residues, which is derived from the reaction of an organic polyisocyanate with a polyhydroxyl compound, and (2) 2-pyrrolidone, is injected for grouting into water-leaking cracks or openings of concrete structures such as water tanks, subway constructions and tunnels. The injected mixture diffuses into the cracks or openings and is cured in short time by reacting with water at the leaking sites. The resultant polyurethane foam securely seals the water leaking sites.Type: GrantFiled: November 6, 1986Date of Patent: May 17, 1988Assignees: Taisei Corporation, Nisshinboseki Kabushiki KaishaInventors: Toshio Hatsuzaki, Yoshihiko Ogawa, Toshio Hiramatsu, Hideo Senga, Takehiko Tokoro
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Patent number: 4449856Abstract: A grout injection method and apparatus, characterized in that a grout comprised of two liquids and curable when the two liquids are combined are supplied, in a grout injection operation, to an injection pump, introduced through separate passages formed concentrically in the pipe, respectively, into an annular chamber formed within the pipe, and uniformly combined, contacted and mixed with each other in the annular mixing chamber before injection into the soil. The passages of the liquids communicating with the annular mixing chamber are blocked when the grout injection is not carried out.Type: GrantFiled: February 3, 1982Date of Patent: May 22, 1984Assignees: Nihon Soil Engineering Co., Ltd., Nihon Sogo-Bosui Co., Ltd., Yamaguchi Kikai Kogyo Co., Ltd.Inventors: Takehiko Tokoro, Shoichi Kashima, Mineo Murata