Patents by Inventor Takeichi Tsugaka

Takeichi Tsugaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monolithic LCP polymer microelectronic wiring modules
    Patent number: 5719354
    Abstract: The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: February 17, 1998
    Assignees: Hoechst Celanese Corp., Kuraray Company Ltd.
    Inventors: Randy Douglas Jester, Edwin Charles Culbertson, Detlef M. Frank, Sherman Hall Rounsville, John Arthur Penoyer, Takeichi Tsugaka, Minoru Onodera, Toshiaki Sato, Toru Sanefuji