Abstract: According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.

Abstract: According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.

Abstract: An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.

Abstract: A wafer containing cassette inspection device that expresses external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device and a processing unit which processes an image signal from the imaging device. The processing unit includes: reference image generation means; image-to-be-inspected information generation means which generates image-to-be-inspected information; image correction means which performs a process for obtaining a predetermined image from the reference image information on the image-to-be inspected information; and means which generates external view attribute information expressing external view attributes of the inspection object portions according to the corrected image information.

Abstract: [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.

Abstract: To provide a wafer containing cassette inspection device capable of expressing external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device (61) and a processing unit (50) which processes an image signal from the imaging device (61).