Abstract: A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n?1), {11m} (m is an integer, m?1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.

Abstract: A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Abstract: A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.

Abstract: A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]?3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by ?-scanning at ?=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

Abstract: A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n?1), {11m} (m is an integer, m?1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.

Abstract: A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]?3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by ?-scanning at ?=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

Abstract: A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits four-fold symmetry in results obtained by X-ray diffraction (XRD) pole figure measurement with respect to a rolled surface. In the XRD pole figure measurement, at least four peaks of a {220}Cu plane diffraction of a copper crystal due to the group of crystal grains exhibiting the four-fold symmetry, which is obtained during ? axis scanning with an ? angle set to 45°, appear at intervals of 90°±5° along the ? angle.

Abstract: A copper foil according to the present invention has a B/A ratio within a range of 1.2 to 3.0, where B is an inclination value of a straight line in a straight portion of a rising area near the origin of a stress-strain curve of the copper foil which is measured before the copper foil is heated to 300° C.; and A is an inclination value of a straight line in a straight portion of a rising area near the origin of a stress-strain curve of the copper foil that is measured after the copper foil is heated to 300° C.

Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]?3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by ?-scanning at ?=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

Abstract: There is provided is a method of manufacturing a superconductor layer, including preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent, coating a main surface of a substrate with the coating solution to form a coating film, subjecting the coating film to a calcining process in an atmosphere containing oxygen, and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process. The calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.

Abstract: There is provided is a method of manufacturing a superconductor layer, including preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent, coating a main surface of a substrate with the coating solution to form a coating film, subjecting the coating film to a calcining process in an atmosphere containing oxygen, and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process. The calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.

Abstract: There is provided is a method of manufacturing a superconductor layer, including preparing a coating solution by dissolving trifluoroacetates of at least one metal selected from the group consisting of yttrium and lanthanoids, barium, and copper in a solvent, coating a main surface of a substrate with the coating solution to form a coating film, subjecting the coating film to a calcining process in an atmosphere containing oxygen, and subjecting the coating film after the calcining process to a firing process in an atmosphere containing water vapor at a temperature higher than that at the calcining process. The calcining process is carried out such that the coating film after the calcining process and before the firing process have an average CuO particle diameter equal to or less than 25 nm.

Abstract: An oxide superconducting wire composed of a metal substrate, an intermediate layer vapor-deposited by an ion beam assisted deposition method (IBAD method) on the metal substrate, a CeO2 cap layer vapor-deposited on the intermediate layer by the PLD method or another such method, and an oxide superconducting film formed on the cap layer, wherein the thickness of the intermediate layer is no more than 2000 nm, and the thickness of the cap layer is at least 50 nm. The time it takes to form a film by the IBAD method can be shortened, and the orientation of the resulting superconducting film can be improved, by reducing the thickness of the intermediate layer manufactured by the IBAD method as above and increasing the thickness of the cap layer. The oxide superconducting wire can be obtained at low cost and with high critical current density.