Patents by Inventor Takenobu KATO

Takenobu KATO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder supply device and solder supply method
    Patent number: 10399169
    Abstract: A solder supply device is provided with solder cup housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, a supply nozzle for dispensing solder from the solder cup, and a solder cutting device that cuts solder supplied from the supply nozzle by ejecting compressed air. Solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device. When stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using the positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: September 3, 2019
    Assignee: FUJI CORPORATION
    Inventors: Ritsuo Hirukawa, Takenobu Kato, Kento Asaoka
  • SOLDER SUPPLY DEVICE AND SOLDER SUPPLY METHOD
    Publication number: 20170014931
    Abstract: A solder supply device is provided with solder cup housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, a supply nozzle for dispensing solder from the solder cup, and a solder cutting device that cuts solder supplied from the supply nozzle by ejecting compressed air. Solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device. When stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using the positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing.
    Type: Application
    Filed: February 27, 2014
    Publication date: January 19, 2017
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Ritsuo HIRUKAWA, Takenobu KATO, Kento ASAOKA