Patents by Inventor Takeo Hayashi

Takeo Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9243635
    Abstract: A compressor includes a compression mechanism and a resin layer including a stack of three or more layers formed on a whole area or a portion of at least one surface of at least one part of the compression mechanism. A hardness of a layer most distant from a base in the resin layer is smaller than a hardness of a layer closest to the base in the resin layer. A difference in hardness between two adjacent layers in the resin layer is smaller than a difference in hardness between the layer most distant from the base and the layer closest to the base.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: January 26, 2016
    Assignee: Daikin Industries, Ltd.
    Inventors: Takeo Hayashi, Yuuichi Yamamoto, Masahide Higuchi, Chihiro Endou
  • Publication number: 20150207675
    Abstract: A path control system, includes: a forwarding network in which each forwarding node belongs to a group and forwards a packet based on a sub-label corresponding to the group; an edge node that adds a label including a plurality of sub-labels based on information contained in a received packet; and a control apparatus that performs path control of the forwarding network by controlling a combination of sub-labels added by the edge node and by controlling forwarding processing performed based on the sub-labels by the forwarding node(s). When a failure has occurred in a communication path, the control apparatus causes the edge node to change a sub-label corresponding to a failure section of the communication path in which a failure has occurred out of sub-labels added to a packet received after the failure, and causes the forwarding node(s) to forward a packet along a path that does not go through the failure section.
    Type: Application
    Filed: August 27, 2013
    Publication date: July 23, 2015
    Applicant: NEC CORPORATION
    Inventor: Takeo Hayashi
  • Publication number: 20130280116
    Abstract: A compressor includes sliding members arranged to slide relative to each other when compressing a refrigerant. At least one of the sliding members has a resin layer that is formed on the whole area or a portion of at least one sliding surface. The resin layer has an arithmetic mean surface roughness (Ra) of 0.3 or more, or the whole area or a portion of an area opposed to the resin layer is entirely or partially harder than the resin layer and has an arithmetic mean surface roughness (Ra) of 0.3 or more.
    Type: Application
    Filed: December 19, 2011
    Publication date: October 24, 2013
    Inventors: Takeo Hayashi, Yuuichi Yamamoto, Masahide Higuchi, Chihiro Endou
  • Publication number: 20130280117
    Abstract: A compressor includes a compression mechanism and a resin layer including a stack of three or more layers formed on a whole area or a portion of at least one surface of at least one part of the compression mechanism. A hardness of a layer most distant from a base in the resin layer is smaller than a hardness of a layer closest to the base in the resin layer. A difference in hardness between two adjacent layers in the resin layer is smaller than a difference in hardness between the layer most distant from the base and the layer closest to the base.
    Type: Application
    Filed: December 19, 2011
    Publication date: October 24, 2013
    Inventors: Takeo Hayashi, Yuuichi Yamamoto, Masahide Higuchi, Chihiro Endou
  • Patent number: 8357742
    Abstract: A resin composition for a vibration damping material, comprising a polyester resin mainly formed of a dicarboxylic acid constitutional unit and a diol constitutional unit; and a filler, in which the polyester resin contains: a dicarboxylic acid constitutional unit (A) mainly derived from an aromatic dicarboxylic acid, in particular, isophthalic acid; a diol constitutional unit (B) mainly derived from ethylene glycol; and a constitutional unit (C) formed of an aliphatic dicarboxylic acid, an aliphatic diol, and/or an aliphatic hydroxycarboxylic acid each having 5 or more carbon atoms, and the resin composition contains, as the filler, a flake-like or plate-like filler (D) and a filler (E) made of a particulate metal oxide.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: January 22, 2013
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takuya Minezaki, Takeo Hayashi, Satoshi Yoshinaka, Kazuaki Mukasa
  • Patent number: 8198362
    Abstract: Provided is a vibration damping material comprising: a polyester resin containing dicarboxylic acid constitutional units and diol constitutional units; and mica being dispersed in the polyester resin, wherein: (1) a ratio [(A1+B1)/(A0+B0)] of a total of (A1) a number of the dicarboxylic acid constitutional units having an odd number of carbon atoms in a polyester main chain and (B1) a number of the diol constitutional units having an odd number of carbon atoms in the polyester main chain with respect to a total of (A0) a number of total dicarboxylic acid constitutional units and (B0) a number of total diol constitutional units in the polyester resin is in the range of 0.5 to 1; and (2) an average particle diameter calculated from a volume-based particle diameter frequency distribution of the mica in the vibration damping material is 25 to 500 ?m. The damping material has a high versatility, is lightweight, shows an excellent vibration damping property and can be produced easily with a batch mixer.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: June 12, 2012
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Satoshi Yoshinaka, Takeo Hayashi, Kazuaki Mukasa, Takuya Minezaki, Takao Ota
  • Publication number: 20120063463
    Abstract: A packet aligning apparatus includes a packet analyzing section configured to receive a reception packet, and extract a sequence number contained in the reception packet; a packet storage section; a write control section configured to determine whether the reception packet is stored in the packet storage section based on the extraction sequence number or transferred to a subsequent block; an expectation managing section configured to generate expectation data which indicates the sequence number of the packet which should be transferred next to the subsequent block, as the expectation; and a read control section configured to read a group of storage packets stored in the packet storage section, to transfer to the subsequent block. The write control section compares the extraction sequence number and the expectation, stores the reception packet in the packet storage section when the extraction sequence number is larger than the expectation.
    Type: Application
    Filed: October 17, 2011
    Publication date: March 15, 2012
    Applicant: NEC Corporation
    Inventor: Takeo Hayashi
  • Publication number: 20120054079
    Abstract: A charging system includes a communication network, a charging server which performs charge calculation to a communication in the communication network, and a management server which determines a network route for the communication and sets route information to network switches. The charging server stores charge class data every user. The management server sets the charge class data and the route information to a charging network switch optionally selected from network switches on the network route. The charging network switch performs the charge calculation by using the charge class data every time transferring a packet and generates the charged fee data. When the communication ends, the management server acquires the charged fee data from the charging network switch to transmit to the charging server.
    Type: Application
    Filed: October 26, 2011
    Publication date: March 1, 2012
    Applicant: NEC Corporation
    Inventor: Takeo Hayashi
  • Patent number: 8030388
    Abstract: Provided is a vibration damping material, which includes a resin composition obtained by dispersing titanium dioxide (Y) and a mica flake (Z) in a polyester resin (X) containing dicarboxylic acid constitutional units an diol constitutional units, in which: (1) in the polyester resin (X), a ratio of a total of a number of the dicarboxylic acid constitutional units (A1) having an odd number of carbon atoms in a main chain and a number of the diol constitutional units (B1) having an odd number of carbon atoms in a main chain with respect to a total of a number of total dicarboxylic acid constitutional units (A0) and a number of total diol constitutional units (B0), i.e., [(A1+B1)/(A0+B0)] is in a range of 0.5 to 1; and (2) a mass ratio (X:Y:Z) of the polyester resin (X), the titanium dioxide (Y), and the mica flake (Z) is in a range of 15 to 40:5 to 30:30 to 80.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: October 4, 2011
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazuaki Mukasa, Takeo Hayashi, Satoshi Yoshinaka, Takuya Minezaki
  • Patent number: 7822945
    Abstract: A semiconductor device including a multi-layer interconnection substrate having a signal distribution interconnection and a power supply line and semiconductor circuit blocks installed on the multi-layer interconnection substrate for performing required operations. The multi-layer substrate includes a third interconnection layer having interconnections extending in a first direction, a second interconnection layer having interconnections extending in a second direction which is different to the first direction, and a first interconnection layer having interconnections extends in a direction orthogonal to the first direction.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: October 26, 2010
    Assignee: NEC Corporation
    Inventor: Takeo Hayashi
  • Publication number: 20100234509
    Abstract: Provided are a resin composition for a vibration damping material, including: a polyester resin mainly formed of a dicarboxylic acid constitutional unit and a diol constitutional unit; and a filler, in which the polyester resin contains: a dicarboxylic acid constitutional unit (A) mainly derived from an aromatic dicarboxylic acid, in particular, isophthalic acid; a diol constitutional unit (B) mainly derived from ethylene glycol; a constitutional unit (C) formed of an aliphatic dicarboxylic acid, an aliphatic diol, and/or an aliphatic hydroxycarboxylic acid each having 5 or more carbon atoms; and a flake-like or plate-like filler (D) and a filler (E) made of a particulate metal oxide as the filler; and a vibration damping material. Thus, there can be provided a vibration damping material exerting high vibration damping performance in a wide temperature region and being excellent in toughness and processability.
    Type: Application
    Filed: November 11, 2008
    Publication date: September 16, 2010
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takuya Minezaki, Takeo Hayashi, Satoshi Yoshinaka, Kazuaki Mukasa
  • Patent number: 7774591
    Abstract: A data processing device includes a memory, a processing unit, a logic element, a first database and a management unit. The memory stores a plurality of software modules which processes input data. The processing unit enables to execute the plurality of software module. The logic element enables to configure a plurality of hardware modules, which can perform processings equivalent to those performed by the plurality of software module, using a dynamic reconfiguration. The first database stores configuration information indicating a configuration of the plurality of hardware modules when the plurality of hardware modules is set to the logic element.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: August 10, 2010
    Assignee: Nec Corporation
    Inventors: Satoshi Kamiya, Hiroshi Ueno, Akihiro Motoki, Takeo Hayashi
  • Patent number: 7773345
    Abstract: A carriage for a disc device, which has a top arm, bottom arm, and mid arm, has a main mode, end arm mode, and mid arm mode as a frequency response obtained when subjected to a vertical shake. In the main mode, all of the top, bottom, and mid arms swing at a first frequency within the same phase in a primary bending mode. In an end arm mode, the top and bottom arms swing at a second frequency higher than the first frequency within opposite phases and with an amplitude larger than that of the mid arm. In the mid arm mode, the mid arm swings at a third frequency having a difference of 50 Hz or less from the second frequency within the same phase as in the main mode, and the top and bottom arms swing within the phase opposite from that in the main mode.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: August 10, 2010
    Assignees: Toshiba Storage Device Corporation, NHK Spring Co., Ltd.
    Inventors: Takeo Hayashi, Masao Hanya, Tatsuhiko Nishida
  • Publication number: 20100179267
    Abstract: Provided is a vibration damping material, which includes a resin composition obtained by dispersing titanium dioxide (Y) and a mica flake (Z) in a polyester resin (X) containing dicarboxylic acid constitutional units and diol constitutional units, in which: (1) in the polyester resin (X), a ratio of a total of a number of the dicarboxylic acid constitutional units (A1) having an odd number of carbon atoms in a main chain and a number of the diol constitutional units (B1) having an odd number of carbon atoms in a main chain with respect to a total of a number of total dicarboxylic acid constitutional units (A0) and a number of total diol constitutional units (B0), i.e., [(A1+B1)/(A0+B0)] is in a range of 0.5, to 1; and (2) a mass ratio (X:Y:Z) of the polyester resin (X), the titanium dioxide (Y), and the mica flake (Z) is in a range of 15 to 40:5 to 30:30 to 80.
    Type: Application
    Filed: August 7, 2007
    Publication date: July 15, 2010
    Inventors: Kazuaki Mukasa, Takeo Hayashi, Satoshi Yoshinaka, Takuya Minezaki
  • Publication number: 20090278293
    Abstract: Provided is a vibration damping material comprising: a polyester resin containing dicarboxylic acid constitutional units and diol constitutional units; and mica being dispersed in the polyester resin, wherein: (1) a ratio [(A1+B1)/(A0+B0)] of a total of (A1) a number of the dicarboxylic acid constitutional units having an odd number of carbon atoms in a polyester main chain and (B1) a number of the diol constitutional units having an odd number of carbon atoms in the polyester main chain with respect to a total of (A0) a number of total dicarboxylic acid constitutional units and (B0) a number of total diol constitutional units in the polyester resin is in the range of 0.5 to 1; and (2) an average particle diameter calculated from a volume-based particle diameter frequency distribution of the mica in the vibration damping material is 25 to 500 ?m. The damping material has a high versatility, is lightweight, shows an excellent vibration damping property and can be produced easily with a batch mixer.
    Type: Application
    Filed: August 28, 2006
    Publication date: November 12, 2009
    Inventors: Satoshi Yoshinaka, Takeo Hayashi, Kazuaki Mukasa, Takuya Minezaki, Takao Ota
  • Patent number: 7349445
    Abstract: An MFI synchronization manager determines the continuity of MFI values to manage the synchronization of the MFI values. A phase adjuster detects a reference VC-3 channel of VC-3 channels which make up a virtual concatenation based on detected MFI values. A write controller writes frame data into a phase adjustment memory based on a write permission signal from the phase adjuster and data valid/invalid information. A write frame manager manages the frame data written in the phase adjustment memory with respect to each of the VC-3 channels and generates a read permission signal for the frame data whose all VC-3 channels of the concatenation have been written. A read controller reads the frame data from phase adjustment memory according to the read permission signal.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: March 25, 2008
    Assignee: NEC Corporation
    Inventor: Takeo Hayashi
  • Patent number: 7324022
    Abstract: A data encoding apparatus extracts valid data to be encoded from received data and encodes the data, and realigns the encoded data in units of a predetermined data width and outputs the data having each unit of the predetermined data width. A data decoding apparatus extracts valid data to be decoded from received data and realigns the decoded data in units of a predetermined data width and outputs the data having each unit of the predetermined data width.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: January 29, 2008
    Assignee: NEC Corporation
    Inventor: Takeo Hayashi
  • Publication number: 20070291416
    Abstract: A carriage for a disc device, which has a top arm, bottom arm, and mid arm, has a main mode, end arm mode, and mid arm mode as a frequency response obtained when subjected to a vertical shake. In the main mode, all of the top, bottom, and mid arms swing at a first frequency within the same phase in a primary bending mode. In an end arm mode, the top and bottom arms swing at a second frequency higher than the first frequency within opposite phases and with an amplitude larger than that of the mid arm. In the mid arm mode, the mid arm swings at a third frequency having a difference of 50 Hz or less from the second frequency within the same phase as in the main mode, and the top and bottom arms swing within the phase opposite from that in the main mode.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 20, 2007
    Applicants: FUJITSU LIMITED, NHK Spring Co., Ltd.
    Inventors: Takeo Hayashi, Masao Hanya, Tatsuhiko Nishida
  • Publication number: 20070186218
    Abstract: A semiconductor device includes: multi-layer interconnection substrate having signal distribution interconnection and power supply line; and semiconductor circuit blocks installed on the multi-layer interconnection substrate for performing required operations. The multi-layer substrate includes: a third interconnection layer having interconnections extending in a first direction; a second interconnection layer having interconnections extending in a second direction which is different to the first direction; and a first interconnection layer having interconnections extends in a direction orthogonal to the first direction.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 9, 2007
    Applicant: NEC CORPORATION
    Inventor: Takeo Hayashi
  • Publication number: 20070174605
    Abstract: A data processing device includes a memory, a processing unit, a logic element, a first database and a management unit. The memory stores a plurality of software modules which processes input data. The processing unit enables to execute the plurality of software module. The logic element enables to configure a plurality of hardware modules, which can perform processings equivalent to those performed by the plurality of software module, using a dynamic reconfiguration. The first database stores configuration information indicating a configuration of the plurality of hardware modules when the plurality of hardware modules is set to the logic element.
    Type: Application
    Filed: January 5, 2007
    Publication date: July 26, 2007
    Applicant: NEC CORPORATION
    Inventors: Satoshi KAMIYA, Hiroshi UENO, Akihiro MOTOKI, Takeo HAYASHI