Abstract: A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.

Abstract: A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.

Abstract: A process for producing a printed circuit board which can mainly shield electromagnetic waves generated therefrom, a printed circuit board having printed thereon printed devices, a multilayered printed circuit board, or a printed circuit board for mounting chip devices, all of which have high reliability, using a printed circuit board obtained by preparing a semicured resin-based copper-clad laminate by continuous pressing by means of a double-belt pressing method or a batch-wise continuous pressing in which one laminate is produced by press molding between a pair of hot platens, the semicured resin-based copper-clad laminate having a copper foil peel strength of 0.2 kg/cm or more, preferably 0.