Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.

Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, the multilayered film is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, a laser beam is irradiated onto the multilayered film to produce a tin-zinc alloy film through the inter-diffusion between the tin elements of the tin layer and the zinc elements of the zinc layer.

Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.

Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, laser beams are irradiated onto the multilayered film to form a tin-nickel alloy film, having stable phases composed of equilibrium phases such as Ni3Sn phase through the diffusion of the tin elements of the tin layer into the nickel layer.

Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, a laser beam is irradiated onto the multilayered film to produce a tin-zinc alloy film through the inter-diffusion between the tin elements of the tin layer and the zinc elements of the zinc layer.

Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, the multilayered film is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.

Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, laser beams are irradiated onto the multilayered film to form a tin-nickel alloy film, having stable phases composed of equilibrium phases such as Ni3Sn phase through the diffusion of the tin elements of the tin layer into the nickel layer.

Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.

Abstract: Coated abrasive grains and a manufacturing method for them are disclosed. The abrasive grains are coated using an immersion method with a coating comprising at least one substance selected from carbides, borides, and nitrides of a metal, comprising: preparing an immersion bath comprising a molten salt bath containing said metal; and immersing abrasive grains to be treated in said immersion bath for a suitable length of time.

Abstract: Coated abrasive grains and a manufacturing method for them are disclosed. The abrasive grains are coated using an immersion method with a coating comprising at least one substance selected from carbides, borides, and nitrides of a metal, comprising:preparing an immersion bath comprising a molten salt bath containing said metal; andimmersing abrasive grains to be treated in said immersion bath for a suitable length of time.

Abstract: A method for measuring the surface area of an electrically surface-conductive body comprises applying an a.c. voltage between the body and a corrosion-resistant opposite electrode, both being immersed in an electrically conductive solution having no corrosive influence upon the surface of the body. An electric capacity value for the body is obtained. The measured value is inserted in the function of a surface area and a similar measurement or value obtained using another body having a known surface area in a similar manner. If the body to be treated does not exhibit surface conductivity, the body may be coated on the surface with a conductive material.

Abstract: A retractable fountain pen employs a cover plate rotatable about a supporting tube by means of a spring to sealingly contact the tapered front end of a cylindrical head portion to close off a central passageway therein. The tube prevents excess deformation of the resilient tapered front end portion.

Abstract: A method of electrolytically collecting lead from ashes containing lead compounds, comprising the steps of adding the ashes to an aqueous solution of caustic soda, and subjecting the mixture to electrolysis in two stages, i.e., preliminary electrolysis and stationary electrolysis.