Patents by Inventor Takeshi Amaike
Takeshi Amaike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6724617Abstract: An object of the invention is to provide a server unit, which is so structured as to enable efficient cooling and which can be installed in great numbers in a server unit cabinet, and which comprises a cartridge type server unit 3 comprising (a) a printed circuit board 31 for a server unit, which is equipped with a central processing unit (CPU) and main memory and which serves as a computer with the supply of external electric power at constant voltage, (b) a heat sink 33 supported by the printed circuit board 31 for the server unit, and (c) a front panel 35 which supports the printed circuit board 31 for the server unit; wherein the front panel 35 supports the printed circuit board 31 so that a flat surface of the printed circuit board 31 is positioned vertically when the server unit 3 is accommodated, wherein a part of a heat sink 33 makes contact with highly heat-generating components mounted on the printed circuit board 31 via heat conduction means, and wherein a heat pipe 331 is provided to transmit heatType: GrantFiled: June 11, 2003Date of Patent: April 20, 2004Assignees: Internet Research Institute, Inc., Trustguard Co., Ltd.Inventors: Takeshi Amaike, Seon Meyong Heo, Makoto Watanabe, Takayuki Yasaku, Shinya Izumi, Naoya Shikamura
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Publication number: 20030235025Abstract: An object of the invention is to provide a server unit, which is so structured as to enable efficient cooling and which can be installed in great numbers in a server unit cabinet, and which comprises a cartridge type server unit 3 comprising (a) a printed circuit board 31 for a server unit, which is equipped with a central processing unit (CPU) and main memory and which serves as a computer with the supply of external electric power at constant voltage, (b) a heat sink 33 supported by the printed circuit board 31 for the server unit, and (c) a front panel 35 which supports the printed circuit board 31 for the server unit; wherein the front panel 35 supports the printed circuit board 31 so that a flat surface of the printed circuit board 31 is positioned vertically when the server unit 3 is accommodated, wherein a part of a heat sink 33 makes contact with highly heat-generating components mounted on the printed circuit board 31 via heat conduction means, and wherein a heat pipe 331 is provided to transmit heatType: ApplicationFiled: June 11, 2003Publication date: December 25, 2003Applicants: Internet Research Institute, Inc., Seon Meyong Heo, Trustguard Co., Ltd.Inventors: Takeshi Amaike, Seon Meyong Heo, Makoto Watanabe, Takayuki Yasaku, Shinya Izumi, Naoya Shikamura
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Patent number: 6621713Abstract: An object of the invention is to provide a server unit, which is so structured as to enable efficient cooling and which can be installed in great numbers in a server unit cabinet, and which comprises a cartridge type server unit 3 comprising (a) a printed circuit board 31 for a server unit, which is equipped with a central processing unit (CPU) and main memory and which serves as a computer with the supply of external electric power at constant voltage, (b) a heat sink 33 supported by the printed circuit board 31 for the server unit, and (c) a front panel 35 which supports the printed circuit board 31 for the server unit; wherein the front panel 35 supports the printed circuit board 31 so that a flat surface of the printed circuit board 31 is positioned vertically when the server unit 3 is accommodated, wherein a part of a heat sink 33 makes contact with highly heat-generating components mounted on the printed circuit board 31 via heat conduction means, and wherein a heat pipe 331 is provided to transmit heatType: GrantFiled: July 18, 2001Date of Patent: September 16, 2003Assignees: Internet Research Institute, Inc., Trustguard Co., Ltd.Inventors: Takeshi Amaike, Seon Meyong Heo, Makoto Watanabe, Takayuki Yasaku, Shinya Izumi, Naoya Shikamura
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Publication number: 20020008961Abstract: An object of the invention is to provide a server unit, which is so structured as to enable efficient cooling and which can be installed in great numbers in a server unit cabinet, and which comprises a cartridge type server unit 3 comprising (a) a printed circuit board 31 for a server unit, which is equipped with a central processing unit (CPU) and main memory and which serves as a computer with the supply of external electric power at constant voltage, (b) a heat sink 33 supported by the printed circuit board 31 for the server unit, and (c) a front panel 35 which supports the printed circuit board 31 for the server unit; wherein the front panel 35 supports the printed circuit board 31 so that a flat surface of the printed circuit board 31 is positioned vertically when the server unit 3 is accommodated, wherein a part of a heat sink 33 makes contact with highly heat-generating components mounted on the printed circuit board 31 via heat conduction means, and wherein a heat pipe 331 is provided to transmit heatType: ApplicationFiled: July 18, 2001Publication date: January 24, 2002Applicant: INTERNET RESEARCH INSTITUTE, INC.Inventors: Takeshi Amaike, Seon Meyong Heo, Makoto Watanabe, Takayuki Yasaku, Shinya Izumi, Naoya Shikamura
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Patent number: 5783129Abstract: Apparatus and methods are provided for producing a long fiber-reinforced thermoplastic resin compositions by initially loosening a continuous fiber bundle by a fiber loosening device so as to form a moving web-like continuous fiber bundle. At least one side of the moving web-like continuous fiber bundle which passes through the die is coated with a thermoplastic resin melt extruded through a slit disposed in the die by an extruder. The slit has substantially the same width as that of the web-like continuous fiber bundle to provide an even supply of the resin melt in the width direction of the web-like continuous fiber bundle. A thermoplastic resin melt is supplied to the slit via a plurality of resin supply paths which are branched successively on the same plane. The resin supply paths are positioned so as to be symmetrically planar with respect to the central axis of the root paths thereof.Type: GrantFiled: February 16, 1996Date of Patent: July 21, 1998Assignee: Polyplastics Co., Ltd.Inventors: Yoshimitsu Shirai, Toshikatsu Nitoh, Takeshi Amaike, Haruji Murakami
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Patent number: 5718858Abstract: Apparatus and methods are provided for producing a long fiber-reinforced thermoplastic resin compositions by initially loosening a continuous fiber bundle by a fiber loosening device so as to form a moving web-like continuous fiber bundle. At least one side of the moving web-like continuous fiber bundle which passes through the die is coated with a thermoplastic resin melt extruded through a slit disposed in the die by an extruder. The slit has substantially the same width as that of the web-like continuous fiber bundle to provide an even supply of the resin melt in the width direction of the web-like continuous fiber bundle. However, the slit has a spacing which changes at a point in the widthwise direction of the web-like continuous fiber bundle so as to be increased as the point is more remote from a feed port and have a constant spacing in the flowing direction of the thermoplastic resin melt.Type: GrantFiled: February 16, 1996Date of Patent: February 17, 1998Assignee: Polyplastics Co., Inc.Inventors: Yoshimitsu Shirai, Motohito Hiragohri, Takeshi Amaike, Haruji Murakami
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Patent number: 5658513Abstract: A cross-head die for the manufacture of long fiber-reinforced resin structures enhances fiber loosening and resin melt impregnation of fiber bundle near its inlet. A passageway along which the fiber bundle travels is defined between the die inlet and outlet and is in communication with a resin port to allow a resin melt to be introduced thereinto so as to impregnate the traveling fiber bundle. The passageway meanders relative to the common plane so as to establish a plurality of alternating successive peak and valley portions each having a substantially constant pitch dimension as measured at adjacent crossing points of the passageway with the common plane. A first peak or valley portion adjacent to the inlet has a greater height dimension as measured from the common plane as compared to a last peak or valley portion adjacent the outlet.Type: GrantFiled: October 16, 1995Date of Patent: August 19, 1997Assignee: Polyplastics Co., Ltd.Inventors: Takeshi Amaike, Yoshimitsu Shirai
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Patent number: 5639410Abstract: Apparatus and method for manufacturing a resin structure reinforced with long fibers. A continuous fiber bundle is impregnated with a resin melt while the fiber bundle is being drawn continuously. Thereafter, the continuous resin-impregnated fiber bundle is shaped so as to have a cross-section of the intended final product. The shaped resin-impregnated fiber bundle is then cut at a downstream location. Shaping of the resin-impregnated fiber bundle is accomplished by a plurality of rolls, each having grooves formed on the outer periphery thereof which receive the continuous resin-impregnated fiber bundle. The grooves and the rolls are arranged such that the rolls are placed, in an alternating manner, at upper and lower positions with respect to the fiber bundle which is being drawn and such that the grooves of the rolls on the elevation plane perpendicular to the running direction of the fiber bundle forms a shape of the cross-section of the intended final product.Type: GrantFiled: September 11, 1995Date of Patent: June 17, 1997Assignee: Polyplastics Co., Inc.Inventors: Takeshi Amaike, Yoshimitsu Shirai
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Patent number: 5637270Abstract: Apparatus and method for manufacturing a resin structure reinforced with long fibers by impregnating a continuous fiber bundle with a molten resin, shaping the resin-impregnated continuous fiber bundle so as to have a cross section of an intended final product; and then taking up the resin-impregnated and shaped continuous fiber bundle shaped with upper and lower endless belts or rolls. A comb-shaped structure is positioned at a location on an upstream side of the endless belts or rolls so as to hold the resin-impregnated continuous fiber bundle between two adjacent teeth thereof. The comb-shaped structure is oscillated in a widthwise direction of the endless belts or rolls with the resin-impregnated continuous fiber bundle held between the two adjacent teeth thereof so as to responsively oscillate the resin-impregnated continuous fiber bundle in the widthwise direction of the endless belts or rolls.Type: GrantFiled: September 20, 1995Date of Patent: June 10, 1997Assignee: Polyplastics Co., Ltd.Inventors: Takeshi Amaike, Yoshimitsu Shirai
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Patent number: 5534210Abstract: A method of continuously taking out a twist-free fiber bundle from the inner side of a plurality of fiber bundle packages each having a hollow cylindrical shape is disclosed. The trailing end of a fiber bundle package and the leading end of another fiber bundle package are spliced to each other in advance. The plurality of fiber bundle packages thus spliced are attached to a body of revolution, and a fiber bundle is then taken out at a speed which is determined based on the taking-out speed of the fiber bundle in a direction so as to eliminate twist of the fiber bundle thus taken out while the rotary member is rotated. Also disclosed is a method of manufacturing a resin structure reinforced with long fibers using the thus prepared twist-free fiber bundle by impregnating it with a resin while drawing.Type: GrantFiled: January 23, 1995Date of Patent: July 9, 1996Assignee: Polyplastics Co., Ltd.Inventors: Yoshimitsu Shirai, Haruji Murakami, Takeshi Amaike
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Patent number: 5520867Abstract: A method of manufacturing a resin structure reinforced with long fibers in which a continuous fiber bundle is loosened in a fiber-loosening step and the loosened continuous fiber bundle is impregnated with a resin melt in an impregnation step. The fiber-loosening index S of the loosened continuous fiber bundle represented by equation (I) is within the range of 2.0 to 18.0:S=5.times.10.sup.-2.T/L.1/D (I)in which T is the Tex number of the continuous fiber bundle, D is a diameter (micrometer) of the continuous fibers contained in the fiber bundle, and L is a width (cm) of the continuous fiber bundle. Mechanical properties of the resin structure of the invention and the appearance of the final products are improved. Moreover, further improvements are obtained with respect to the prevention of dropping-off of fiber filaments from the product, smooth operation in the impregnation step, and the production efficiency.Type: GrantFiled: January 23, 1995Date of Patent: May 28, 1996Assignee: Polyplastics Co., Ltd.Inventors: Yoshimitsu Shirai, Haruji Murakami, Takeshi Amaike