Patents by Inventor Takeshi Asagi
Takeshi Asagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10189119Abstract: An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding which contains 0.05% by mass to 3.0% by mass of antimony and the remainder consisting of bismuth and inevitable impurities, and a solder alloy for die bonding which contains 0.01% by mass to 2.0% by mass of germanium and the remainder consisting of bismuth and inevitable impurities.Type: GrantFiled: January 21, 2014Date of Patent: January 29, 2019Assignees: Nihon Handa Co., Ltd., Fuji Electric Co., Ltd.Inventors: Takeshi Asagi, Susumu Mitani, Hirohiko Watanabe, Masayoshi Shimoda
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Patent number: 9301403Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.Type: GrantFiled: January 27, 2015Date of Patent: March 29, 2016Assignees: FUJI ELECTRIC CO., LTD., NIHON HANDA CO., LTD.Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
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Publication number: 20150258637Abstract: An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding which contains 0.05% by mass to 3.0% by mass of antimony and the remainder consisting of bismuth and inevitable impurities, and a solder alloy for die bonding which contains 0.01% by mass to 2.0% by mass of germanium and the remainder consisting of bismuth and inevitable impurities.Type: ApplicationFiled: January 21, 2014Publication date: September 17, 2015Applicants: Nihon Handa Co., Ltd., Fuji Electric Co., Ltd.Inventors: Takeshi Asagi, Susumu Mitani, Hirohiko Watanabe, Masayoshi Shimoda
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Publication number: 20150208516Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.Type: ApplicationFiled: January 27, 2015Publication date: July 23, 2015Inventors: Mitsuo YAMASHITA, Tomoaki GOTO, Takeshi ASAGI
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Patent number: 8968488Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.Type: GrantFiled: July 3, 2007Date of Patent: March 3, 2015Assignees: Fuji Electric Co., Ltd., Nihon Handa Co., Ltd.Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
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Publication number: 20120111924Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.Type: ApplicationFiled: January 18, 2012Publication date: May 10, 2012Applicant: FUJI ELECTRIC SYSTEMS CO., LTD.Inventors: Kazuyuki MAKITA, Masaki ICHINOSE, Taketo WATASHIMA, Masayuki SOUTOME, Mitsuo YAMASHITA, Takeshi ASAGI, Masatoshi HIRAI, Toru MURATA
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Publication number: 20120018048Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.Type: ApplicationFiled: July 3, 2007Publication date: January 26, 2012Applicants: Nihon Handa Co., Ltd., Fuji Electric Holdings Co., Ltd.Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
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Publication number: 20090286093Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.Type: ApplicationFiled: July 2, 2009Publication date: November 19, 2009Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.Inventors: Kazuyuki MAKITA, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
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Publication number: 20070029678Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.Type: ApplicationFiled: August 4, 2006Publication date: February 8, 2007Inventors: Kazuyuki Makita, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata