Patents by Inventor Takeshi Endo
Takeshi Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127327Abstract: A method of leasing a power storage includes obtaining, for a vehicle including a power storage, a value of the power storage based on a capacity retention rate of the power storage, determining an insurance fee for a user of the vehicle to receive an insurance service relating to replacement of the power storage based on an accident risk of the vehicle, and determining a lease fee of the power storage based on the value of the power storage and the insurance fee.Type: ApplicationFiled: October 5, 2023Publication date: April 18, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuko TERASAWA, Makoto KAKUCHI, Toshiaki KARASAWA, Takeshi HIGASHI, Yoshihiko ENDO
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Publication number: 20240116477Abstract: A server includes a communication unit (first communication unit) (second communication unit) that receives information about a request for adjustment of power supply-and-demand in a power grid. The server includes a processor (controller) that predicts a schedule of replacement of a battery (first battery) at a battery station (battery replacement apparatus). The processor specifies, based on the schedule, a battery (second battery) available for charging or discharging for the request for adjustment, and determines, based on the specified battery, whether or not it is possible to respond to the request for adjustment.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuko TERASAWA, Makoto KAKUCHI, Toshiaki KARASAWA, Takeshi HIGASHI, Yoshihiko ENDO
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Publication number: 20240116394Abstract: A server (management apparatus) includes: a communication unit (first acquisition unit) that acquires a request regarding adjustment of electric power supply-and-demand in a power grid; and a processor (controller) that performs, based on the request, control to notify, a user of an electrically powered vehicle, of a replacement cost required for battery replacement at a battery station (battery replacement apparatus). When charging with electric power of the power grid is requested and a battery (first battery) of the electrically powered vehicle has an SOC lower than the SOC of a battery (second battery) having a maximum SOC to be used for charging, among a plurality of batteries (second batteries), the processor performs control to notify the user of the replacement cost lower than a normal replacement cost.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuko TERASAWA, Makoto KAKUCHI, Toshiaki KARASAWA, Takeshi HIGASHI, Yoshihiko ENDO
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Publication number: 20240109869Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.Type: ApplicationFiled: January 25, 2022Publication date: April 4, 2024Inventors: Takeshi ENDO, Yasuyuki MORI, Ippei OKANO, Ryo OGAWA, Junji UEYAMA
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Patent number: 11942501Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.Type: GrantFiled: March 15, 2023Date of Patent: March 26, 2024Assignee: Canon Kabushiki KaishaInventors: Nobuyuki Endo, Tetsuya Itano, Kazuo Yamazaki, Kyouhei Watanabe, Takeshi Ichikawa
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Patent number: 11913367Abstract: There is provided an exhaust gas purifying catalyst including a substrate and catalyst portions. The substrate includes an inflow-side cells, outflow-side cells, and porous partition walls, each partition wall separating the inflow-side cell from the outflow-side cell. The catalyst portion includes: (group A) first catalyst portions, each first catalyst portion being provided on a surface of the partition wall that faces the inflow-side cell on an upstream side in an exhaust gas flow direction; and (group B) second catalyst portions being provided on a surface of the partition wall that faces the outflow-side cell on a downstream side in the exhaust gas flow direction. Each catalyst portion of one of group A and group B includes at least one oxidizing catalyst layer and at least one reducing catalyst layer, and each catalyst portion of the other of group A and group B includes at least one oxidizing catalyst layer and/or at least one reducing catalyst layer.Type: GrantFiled: April 17, 2019Date of Patent: February 27, 2024Assignees: Mitsui Mining & Smelting Co., Ltd., HONDA MOTOR CO., LTD.Inventors: Hiroki Kurihara, Yusuke Nagai, Shingo Akita, Yoshinori Endo, Takeshi Mori, Takayuki Watanabe, Tomoko Tsuyama
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Publication number: 20230326845Abstract: A circuit module includes: a first circuit component having electrode pads on a first surface; and a second circuit component having electrode pads on a second surface. A conductive bonding material joins the electrode pads of the first circuit component to the electrode pads of the second circuit component respectively. A first reinforcing bonding material is not in contact with the conductive bonding material and joins the first surface of the first circuit component to the second surface of the second circuit component. A second reinforcing bonding material is located in contact with the first reinforcing bonding material, and joins the first surface of the first circuit component to the second surface of the second circuit component.Type: ApplicationFiled: December 23, 2022Publication date: October 12, 2023Inventors: YOSHITAKA KATO, TAKESHI ENDO, KAZUHIRO TSURUTA
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Publication number: 20230296799Abstract: A method, article and system are provided for processing and interpreting acoustic data. The method and system includes providing a number of acoustic processing elements, each element being associated with an acoustic mode of a number of acoustic modes of a sonic measurement tool adapted to acquire data representing acoustic measurements in a borehole. In addition the method and system includes providing a user interface to organize a processing chain of the number of acoustic processing elements such that the acoustic processing elements process the acquired data according to a predefined workflow.Type: ApplicationFiled: April 6, 2023Publication date: September 21, 2023Inventors: Henri-Pierre Valero, Takeshi Endo, Hrvoje Markovic, Yoshisuke Fukagawa, Yuta Okabe, Shinichi Sunaga, Mitsuko Kitazawa, Ryoko Hayashi, Ivayla Gueorguieva
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Publication number: 20230221453Abstract: Embodiments provide for a method that utilizes the azimuthally spaced receivers of a sonic logging tool. Signals from monopole and dipole sources are reflected from the geologic interfaces and recorded by arrays of receivers of the same tool. For the incident P-waves from the monopole source, phase arrival times for the azimuthal receivers are compensated for stacking using properties of wave propagation in the borehole, and for the incident SH-waves from the dipole source, signs of waveforms for the receivers are changed for specified azimuths.Type: ApplicationFiled: March 30, 2021Publication date: July 13, 2023Inventors: Nobuyasu Hirabayashi, Yevgeniy Karpekin, Nicholas Norman Bennett, John Adam Donald, Asbjoern Lund Johansen, Takeshi Endo
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Patent number: 11644588Abstract: A method, article and system are provided for processing and interpreting acoustic data. The method and system includes providing a number of acoustic processing elements, each element being associated with an acoustic mode of a number of acoustic modes of a sonic measurement tool adapted to acquire data representing acoustic measurements in a borehole. In addition the method and system includes providing a user interface to organize a processing chain of the number of acoustic processing elements such that the acoustic processing elements process the acquired data according to a predefined workflow.Type: GrantFiled: September 23, 2016Date of Patent: May 9, 2023Assignee: SCHLUMBERGER TECHNOLOGY CORPORATIONInventors: Henri-Pierre Valero, Takeshi Endo, Hrvoje Markovic, Yoshisuke Fukagawa, Yuta Okabe, Shinichi Sunaga, Mitsuko Kitazawa, Ryoko Hayashi, Ivayla Gueorguieva
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Publication number: 20230106733Abstract: A semiconductor device includes: an active region having a semiconductor element and a surface electrode provided by a wiring electrode material and connected to the semiconductor element on a side adjacent to a surface of a semiconductor chip; and a pad arrangement region having a pad provided by the wiring electrode material. The pad arrangement region overlaps the active region in a direction normal to the surface of the semiconductor chip. In a part where the pad arrangement region and the active region overlap, the pad is disposed on the surface electrode through an isolation insulating film so that the wiring electrode material is in two layers to provide a double-layer wiring electrode structure. In a part of the active region without overlapping the pad arrangement region, the surface electrode has a single-layer wiring electrode structure composed of a single layer of the wiring electrode material.Type: ApplicationFiled: September 16, 2022Publication date: April 6, 2023Inventors: Masato NOBORIO, Yoshitaka KATO, Takeshi ENDO
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Publication number: 20230105437Abstract: Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1): wherein X is an oxygen atom or a sulfur atom; R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an aryl group; and R3 and R4 each independently represent a hydrogen atom, an alkyl group, or an aryl group, or R3 and R4 are connected to each other to represent a divalent group to form a ring.Type: ApplicationFiled: March 16, 2021Publication date: April 6, 2023Inventors: Takeshi ENDO, Junji UEYAMA, Ryo OGAWA
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Publication number: 20230005726Abstract: An ion detector includes: a first electron multiplier for detecting first ions having a first polarity; a second electron multiplier for detecting second ions having a second polarity different from the first polarity; a first anode for capturing electrons emitted from the first electron multiplier; a second anode for capturing electrons emitted from the second electron multiplier; and a switching circuit including a first input terminal electrically connected to the first anode, a second input terminal electrically connected to the second anode, and an output terminal, the switching circuit selectively connecting one of the first input terminal and the second input terminal to the output terminal.Type: ApplicationFiled: May 13, 2022Publication date: January 5, 2023Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi ENDO, Hiroshi KOBAYASHI
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Publication number: 20230001482Abstract: A method of producing silver fine particles includes continuously reducing silver ions contained in a silver compound to precipitate silver fine particles by introducing at least two fluids from separate flow paths and mixing the fluids, wherein one fluid of the at least two fluids contains the silver compound, and another fluid contains a reducing agent, and at least one fluid of the at least two fluids contains an amino acid. With this method, silver fine particles can be produced with sufficient continuous productivity and quality uniformity, without problems of deterioration of working environment and generation of explosive fulminating silver due to the use of a large amount of ammonia.Type: ApplicationFiled: November 28, 2019Publication date: January 5, 2023Applicant: M. Technique Co., Ltd.Inventors: Kazutaka TAKEDA, Takeshi ENDO
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Patent number: 11532534Abstract: A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.Type: GrantFiled: February 10, 2021Date of Patent: December 20, 2022Assignee: DENSO CORPORATIONInventors: Yoshitaka Kato, Takeshi Endo
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Publication number: 20220392828Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.Type: ApplicationFiled: May 25, 2022Publication date: December 8, 2022Inventors: YOSHITAKA KATO, TAKESHI ENDO, KAZUHIRO TSURUTA
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Publication number: 20220366700Abstract: Provided is an object recognition device capable of accurately estimating a distance from an own vehicle to an object such as a pedestrian.Type: ApplicationFiled: September 8, 2020Publication date: November 17, 2022Applicant: HITACHI ASTEMO, LTD.Inventors: Takeshi ENDO, Haruki MATONO, Takeshi NAGASAKI
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Publication number: 20220359229Abstract: Joining a second supporting member to one surface of a semiconductor chip through an upper layer joining portion includes: forming, on the one surface, a pre-joining layer by pressure-sintering a first constituent member containing a sintering material on the one surface such that spaces between the plurality of protrusions are filled with the pre-joining layer and the pre-joining layer has a flat surface on a side of the pre-joining layer away from the semiconductor chip; arranging, on the flat surface, the second supporting member through a second constituent member containing a sintering material; and heating and pressurizing the second constituent member. Thereby, an upper layer joining portion is formed by the second constituent member and the pre-joining layer.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Tomohito IWASHIGE, Takeshi ENDO
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Patent number: 11417505Abstract: A CEM and an ion detector of one embodiment have a structure for enabling ion detection with higher sensitivity than the prior art. A channel electron multiplier includes a channel body, an input-side conductive layer, an output-side conductive layer, and an electrode. The channel body includes a channel, and a resistance layer and an electron emission layer formed on the channel's inner wall surface. The input-side conductive layer is provided on the channel body, and a part thereof extends into the tapered opening. The output-side conductive layer is provided on the tapered opening. The electrode has openings through which charged particles pass, and is disposed on an opposite side of the output end face to the input end face. The electrode and the input-side conductive layer are set to the same potential to eliminate the influence of an external electric field in the tapered opening.Type: GrantFiled: May 27, 2021Date of Patent: August 16, 2022Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi Endo, Hiroshi Kobayashi
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Publication number: 20220246417Abstract: The present embodiment relates to an ion detector and the like that can reduce a dark current serving as a noise component. An ion detector having an electron multiplier includes a shield structure confining a potential gradient spreading in all directions starting from an input electrode into a limited space including the input electrode, and an input cable having one end electrically connected to the input electrode. The shield structure has a structure surrounding at least the input electrode, and includes one or more members. Each of the members is comprised of a metal material or an insulating material. Further, a part of the shield structure is constituted by a metal mesh window. An outer peripheral surface of the input cable is covered with an insulating coating in order to block the arrival of unnecessary ions and electrons generated inside and outside the shield structure.Type: ApplicationFiled: December 6, 2019Publication date: August 4, 2022Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi ENDO, Hiroshi KOBAYASHI