Patents by Inventor Takeshi Hirose

Takeshi Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977698
    Abstract: A control device including a control section configured to cause a sound output section to output sound in a case where it is determined that an operation is performed on an input section by a target object coming into contact with a contact region, the input section having the contact region touched by the target object, wherein the control section adjusts a sharpness peak as a control parameter for performing control in such a manner that the sound output section outputs the sound, the sharpness peak being a maximum value of sharpness indicating sharpness of the sound.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: May 7, 2024
    Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Takeshi Ohnishi, Fumiaki Hirose, Yuma Nakai
  • Patent number: 11979226
    Abstract: A wavelength cross-connect device performs relay processing, the relay processing being such that wavelength multiplexed signal lights, which are multiband transmitted from a plurality of routes, are demultiplexed into different wavelength bands, and for each route, respective optical signals of the different wavelength bands are amplified, then subject to route change by WSSs and outputted to output side routes M. The device includes C-band WXC units that are the same in total number as the wavelength bands of the optical signals of the respective wavelength bands and perform relay processing on optical signals of a specific wavelength band of the different wavelength bands.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: May 7, 2024
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hiroki Kawahara, Takeshi Seki, Sachio Suda, Kohei Saito, Kenta Hirose
  • Patent number: 11958939
    Abstract: A polyimide precursor solution contains: an aqueous solvent containing water; particles; and a polyimide precursor, wherein the polyimide precursor has a high molecular weight region A containing a high molecular weight side maximum value and a low molecular weight region B containing a low molecular weight side maximum value in an elution curve obtained by gel permeation chromatography, a weight average molecular weight in the high molecular weight region A is 50,000 or more, a weight average molecular weight in the low molecular weight region B is 10,000 or more and 30,000 or less, and a value of a/(a+b) is 0.60 or more and 0.98 or less in which a represents an area of the high molecular weight region A and b represents an area of the low molecular weight region B.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 16, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke Nakada, Shigeru Seitoku, Takeshi Iwanaga, Tomoyo Okubo, Hajime Sugahara, Hidekazu Hirose
  • Patent number: 11925590
    Abstract: An electric wheelchair includes a main frame; a drivable wheel supported by the main frame; an electric motor disposed on the main frame and configured to drive the drivable wheel; a clutch configured to switch a power transmission path from the electric motor to the drivable wheel between an engagement state and a disengagement state; and a clutch operation handle configured to be moved in a predetermined range in an up-down direction. The clutch operation handle is configured to operate the clutch so as to be in: (i) one of the engagement state or the disengagement state when the clutch operation handle is stopped at a lowest position of the predetermined range; and (ii) the other of the engagement state or the disengagement state when the clutch operation handle is stopped at a highest position of the predetermined range.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: March 12, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takayuki Nagata, Motoki Hirose, Takeshi Ishikawa
  • Patent number: 10513797
    Abstract: A manufacturing method of an epitaxial silicon wafer, using an epitaxial growth apparatus including a susceptor and a heat ring, includes: determining a surface position of a silicon wafer to be higher than a surface position of a peripheral portion of the susceptor and to be lower than a surface position of the heat ring; and adjusting a gap between the surface position of the silicon wafer and the surface position of the heat ring to control a difference between a film thickness of the epitaxial layer formed on a peripheral portion in a <110> orientation of the silicon wafer and a film thickness of the epitaxial layer formed on the peripheral portion in a <100> orientation of the silicon wafer.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: December 24, 2019
    Assignee: SUMCO CORPORATION
    Inventors: Takeshi Hirose, Masayuki Tsuji, Fumihiko Kimura
  • Publication number: 20180363174
    Abstract: An object of the invention is to provide a technique for even more firmly joining metal threads of a metal fabric together. A sheet member is formed from a metal fabric that is woven from metal warp threads and metal weft threads such that the metal warp threads and the metal weft threads alternately cross each other, the metal warp threads and the metal weft threads individually including a linear metal strand made of a metal and a coating portion that covers a circumference of the metal strand. The sheet member includes a welded portion where the coating portions of the metal warp threads and the coating portions of the metal weft threads are joined together at crossing portions of the metal warp threads and the metal weft threads.
    Type: Application
    Filed: December 27, 2016
    Publication date: December 20, 2018
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Akihide KONDO, Masamichi YAMAGIWA, Takeshi HIROSE, Masahiro MIZUTANI
  • Publication number: 20180282207
    Abstract: The present invention relates to a manufacturing method of a processed member including removing a first uplift portion from a plate member containing the first uplift portion and a support portion connecting to the first uplift portion, in which the plate member includes a first main surface and a second main surface, the first uplift portion is a projection portion in the first main surface and a portion in the second main surface, corresponding to the projection portion is a recess portion, and the first uplift portion has a line shape in a top view.
    Type: Application
    Filed: April 4, 2018
    Publication date: October 4, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Makoto FUJII, Takeshi Hirose
  • Publication number: 20180257978
    Abstract: Provided is a print layer-attached plate including a plate having a first main surface and a second main surface, and a print layer provided on the first main surface, in which the first main surface at least partially includes a region formed of a recessed and projected layer having an arithmetic average surface roughness Ra of 4 nm or more and 1,000 nm or less, and the print layer is formed so as to cover at least a part of the region.
    Type: Application
    Filed: May 8, 2018
    Publication date: September 13, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Jun MINAMIDATE, Takeshi HIROSE, Makoto FUJII
  • Patent number: 10063004
    Abstract: A controller assembly includes a plurality of controller units, and a heat dissipating unit interposed between the controller units. Male and female connectors are disposed in the controller units, and the connectors thereof are fitted to female and male connectors of the heat dissipating unit to thereby establish electrical contact therebetween. Upon driving electric actuators, heat generated in circuit boards of the controller units is dissipated to the exterior through a plurality of heat dissipating protrusions provided on the heat dissipating unit, so that heat generating sources of the circuit boards are cooled.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: August 28, 2018
    Assignee: SMC CORPORATION
    Inventors: Eiji Iijima, Atsushi Fujiwara, Takeshi Hirose
  • Publication number: 20170250493
    Abstract: A controller assembly includes a plurality of controller units, and a heat dissipating unit interposed between the controller units. Male and female connectors are disposed in the controller units, and the connectors thereof are fitted to female and male connectors of the heat dissipating unit to thereby establish electrical contact therebetween. Upon driving electric actuators, heat generated in circuit boards of the controller units is dissipated to the exterior through a plurality of heat dissipating protrusions provided on the heat dissipating unit, so that heat generating sources of the circuit boards are cooled.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 31, 2017
    Applicant: SMC Corporation
    Inventors: Eiji IIJIMA, Atsushi FUJIWARA, Takeshi HIROSE
  • Publication number: 20160186360
    Abstract: A manufacturing method of an epitaxial silicon wafer, using an epitaxial growth apparatus including a susceptor and a heat ring, includes: determining a surface position of a silicon wafer to be higher than a surface position of a peripheral portion of the susceptor and to be lower than a surface position of the heat ring; and adjusting a gap between the surface position of the silicon wafer and the surface position of the heat ring to control a difference between a film thickness of the epitaxial layer formed on a peripheral portion in a <110> orientation of the silicon wafer and a film thickness of the epitaxial layer formed on the peripheral portion in a <100> orientation of the silicon wafer.
    Type: Application
    Filed: October 6, 2015
    Publication date: June 30, 2016
    Applicant: SUMCO CORPORATION
    Inventors: Takeshi HIROSE, Masayuki TSUJI, Fumihiko KIMURA
  • Patent number: 8247347
    Abstract: The present invention presents a thermosensitive recording medium having excellent color development, image quality and preservation properties as well as excellent stamp receptivity, anti-scratching ability, printability and water blocking resistance. The present invention is a thermosensitive recording medium having a thermosensitive recording layer comprising at least a colorless or pale colored basic leuco dye and an electron accepting developing agent as a coating layer on a substrate, wherein at least an outermost layer among the thermosensitive recording layer and other optionally prepared coated layers contains rice starch particles.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: August 21, 2012
    Assignee: Nippon Paper Industries Co., Ltd.
    Inventors: Ken Takagi, Jun Makihara, Akihito Ogino, Kenji Hirai, Makoto Hasegawa, Shin Suzuki, Takeshi Hirose
  • Publication number: 20100062935
    Abstract: The present invention presents a thermosensitive recording medium having excellent color development, image quality and preservation properties as well as excellent stamp receptivity, anti-scratching ability, printability and water blocking resistance. The present invention is a thermosensitive recording medium having a thermosensitive recording layer comprising at least a colorless or pale colored basic leuco dye and an electron accepting developing agent as a coating layer on a substrate, wherein at least an outermost layer among the thermosensitive recording layer and other optionally prepared coated layers contains rice starch particles.
    Type: Application
    Filed: March 14, 2008
    Publication date: March 11, 2010
    Inventors: Ken Takagi, Jun Makihara, Akihito Ogino, Kenji Hirai, Makoto Hasegawa, Shin Suzuki, Takeshi Hirose
  • Patent number: 7627446
    Abstract: If the diving mode is erroneously entered while travelling at a high altitude, such as when flying in an airplane, the error is detected so that calculating tissue in/out-gassing of inert gases continues. The control unit 50 of the dive computer records the water depth corresponding to the pressure measured by the depth measuring unit 61 together with the elapsed time, determines if the user is moving in a low pressure region based on water entry detection by a water entry detection unit and the depth detected by the depth measuring unit 61, and if the user is determined to be travelling in a low pressure region cancels measuring the water depth, cancels the wrongly selected operating mode, and changes from the operating mode used when diving to an operating used when not diving.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: December 1, 2009
    Assignee: Seiko Epson Corporation
    Inventor: Takeshi Hirose
  • Patent number: 7448378
    Abstract: An information processing device for a diver used for diving by using a plurality of mixed gases in which the mixture ratios of a plurality of diving gases are the same or different determines the switch timing of the mixed gas on the basis of a preset scheduled dive pattern and an actual dive pattern up to present. A notification is issued regarding the switch timing and information for specifying the mixed gas to which a switch is to be made based on this switch timing. When the diver selects one of the cylinders as the cylinder to which the switch is to be made and in which the mixture ratio of the diving gas is different, processing is carried out that prohibits switching to the selected cylinder when it is determined that the selected cylinder may create a danger of oxygen deficiency or oxygen poisoning.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: November 11, 2008
    Assignee: Seiko Epson Corporation
    Inventor: Takeshi Hirose
  • Patent number: 7443121
    Abstract: An actuator control system comprises an electric actuator, a driver, and a controller. The electric actuator is provided with a buffering mechanism which absorbs impact applied to a piston rod. The buffering mechanism includes piston dampers which absorb impact applied to a piston, a first end damper which is provided at an end of a housing facing the piston, and a second end damper which is provided on a rod cover separated from the housing by a predetermined distance.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: October 28, 2008
    Assignee: SMC Kabushiki Kaisha
    Inventors: Shigekazu Nagai, Akio Saitoh, Toru Sugiyama, Ryuichi Masui, Takeshi Hirose, Masaki Miyahara
  • Patent number: D601963
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: October 13, 2009
    Assignee: SMC Kabushiki Kaisha
    Inventors: Yoshihiro Fukano, Takeshi Hirose
  • Patent number: D607821
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: January 12, 2010
    Assignee: SMC Kabushiki Kaisha
    Inventors: Yoshihiro Fukano, Takeshi Hirose
  • Patent number: D695685
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: December 17, 2013
    Assignee: SMC Corporation
    Inventors: Yoshihiro Fukano, Shoichi Makado, Takeshi Hirose
  • Patent number: D924179
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: July 6, 2021
    Assignee: SMC CORPORATION
    Inventors: Takeshi Hirose, Satoshi Kuroda, Yoko Ikegami, Yuta Oshima