Abstract: The present invention provides a light-emitting element lamp 1 capable of preventing a temperature rise of a substrate 9, on which light-emitting elements 4 are mounted, by effectively utilizing a thermally conductive casing 2 and a thermally conductive cover 5. The light emitting element lamp 1 includes a thermally conductive casing 2, a light source part 3, a thermally conductive cover 5, and an insulative cover 6. The thermally conductive casing 2 includes an irradiation opening 2b, is formed so as to be widened toward the irradiation opening 2b, has its outer circumferential surface exposed outwardly, and has a substrate mounting part 2c secured on its inner circumferential surface. The light source part 3 has a substrate 9 having the light-emitting elements 4 mounted thereon and causes the substrate 9 to be thermally coupled to and attached to the substrate mounting part 2c of the thermally conductive casing 2.

Abstract: A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.

Abstract: The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.

Abstract: In one embodiment, a lamp with a ferrule includes a substrate to support a light emitting element and a wire insertion portion formed therein. A support portion to arrange the substrate is formed in one end portion of a base body. A through-hole is formed in the support portion corresponding to the wire insertion portion. A concave container portion is provided in the other end portion of the base body to accommodate a circuit board to mount electric parts. An insulating case is arranged between the circuit board and the concave container portion. The insulating case includes a protection element inserted in the through-hole and the wire insertion portion. The protection element is projected at least to inside of the wire insertion portion. A ferrule for supplying electric power to the light emitting element is provided in the other end portion of the base body.

Abstract: An object of the present invention is to provide an LED bulb in which temperature of a lighting circuit is suppressed from rising during lighting of an LED so that life time of the lighting circuit is maintained without increasing manufacturing cost of components. According to the invention, an LED module 11 having multiple LEDs surface-mounted thereon is mounted in a heat dissipating unit 12. Heat generated by the LEDs is dissipated through multiple heat dissipating fins 18 of the heat dissipating unit 12. A glove 14, covering the LED module 11, radiates outward radiant light from the LEDs. A lighting circuit 17 for lighting the LEDs is incorporated in an inner hollow portion 23 of a cap 16 arranged on a side opposite to the glove 14 of the heat dissipating unit 12. Accordingly, the heat generated by the LEDs of the LED module 11 is mostly dissipated by the heat dissipating unit 12, thereby suppressing the temperature of the lighting circuit from rising.

Abstract: An object of the present invention is to provide a light emitting element lamp and a lighting equipment effectively suppressing a temperature rising of a substrate on which a light emitting element is mounted by using a reflector.

Abstract: A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device.

Abstract: A lamp system which can improve radiation performance is provided. A metallic heat conduction part provided along a peripheral portion of a metallic cover is fitted with a resin heat conduction part provided along a peripheral portion of a transparent cover so as to thermally contact each other. Heat generated by an LED is radiated into air from the metallic cover and at the same time is efficiently conducted from the metallic cover to the transparent cover to be radiated into air from the transparent cover.

Abstract: A plurality of LEDs are provided to an outer edge side of a center position of one main surface of an LED substrate main body in a deviated manner respectively. The wiring part including the connector receiving part and the wiring hole are provided at a position that overlaps the center position of the one main surface side of the LED substrate main body. Since the power feeding part is inserted into the wiring hole, the connection part and the connector receiving part can be easily connected and therefore it becomes possible to ensure ease in assembly. Since the connector receiving part is kept away from each of the LEDs with substantially equal distance so that emitted light is hardly blocked, decrease in uniformity of light distribution can be suppressed.