Abstract: An inductor device includes a substrate, first and second coils in the substrate and connected in series, and first and second terminals. The first terminal is connected to the first coil, and the second terminal is connected to the second coil. Each of the first and second coils is a spiral or helical coil wound with more than one turn. At least a portion of the first coil overlaps at least a portion of the second coil when seen in a plan view from a direction perpendicular or substantially perpendicular of the substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

Abstract: A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A method for measuring a film strength of a film on an object. An incident angle of pressure waves with respect to an object to be measured, the object including a base coated with a film, is set for applying the pressure waves to the object. The incident angle is varied over a range including a critical angle ?cr. The object generates surface waves, in response to the pressure waves, at and near the critical angle. In response to the surface waves, the object generates leaky waves, which are pressure waves caused by the surface waves. The intensity of pressure waves including reflected waves and leaky waves from the object are measured. A received intensity V0 at an incident angle where no leaky wave is generated, and the intensity difference VC between V0 and the received intensity at the critical angle ?cr when the film strength is high are measured.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: A method for measuring a film strength of a film on an object. An incident angle of pressure waves with respect to an object to be measured, the object including a base coated with a film, is set for applying the pressure waves to the object. The incident angle is varied over a range including a critical angle ?cr. The object generates surface waves, in response to the pressure waves, at and near the critical angle. In response to the surface waves, the object generates leaky waves, which are pressure waves caused by the surface waves. The intensity of pressure waves including reflected waves and leaky waves from the object are measured. A received intensity V0 at an incident angle where no leaky wave is generated, and the intensity difference VC between V0 and the received intensity at the critical angle ?cr when the film strength is high are measured.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: A method for polishing side faces of grooves formed on a workpiece includes a step of forming the grooves on the workpiece; a step of inserting a polishing element into one of the grooves, the width of the polishing element being smaller than that of the groove, by vertically moving at least one of the workpiece and the polishing element; a step of putting a main surface of the polishing element into contact with a side face of the groove by horizontally moving at least one of the workpiece and the polishing element; and a step of sliding the polishing element along the groove by moving at least one of the workpiece and the polishing element to polish the workpiece by relative movement between the workpiece and the polishing element and by urging the main surface of the polishing element toward the side face of the groove.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: A slicing method and slicing apparatus eliminate occurrence of cracking and/or chipping of a to-be-machined object without reducing the processing speed thereof. To this end, the slicing method comprising cutting the to-be-machined object W by supporting the to-be-machined object W on a table 10 and causing this table 10 to travel in an x-axis direction while allowing a slicing blade 20 to rotate at a predetermined position. A sensor 12 detects a variable load F that the to-be-machined object receives during slicing and an actuator 11 operatively responds to receipt of a detection signal of the sensor 12. The actuator 11 forces the to-be-machined object W to deform in a direction which permits reduction of the aforesaid variable load F. The actuator is provided between the sensor 12 and table 10, or alternatively between the to-be-machined object W and sensor 12.

Abstract: A slicing method and slicing apparatus eliminate occurrence of cracking and/or chipping of a to-be-machined object without reducing the processing speed thereof. To this end, the slicing method comprising cutting the to-be-machined object W by supporting the to-be-machined object W on a table 10 and causing this table 10 to travel in an x-axis direction while allowing a slicing blade 20 to rotate at a predetermined position. A sensor 12 detects a variable load F that the to-be-machined object receives during slicing and an actuator 11 operatively responds to receipt of a detection signal of the sensor 12. The actuator 11 forces the to-be-machined object W to deform in a direction which permits reduction of the aforesaid variable load F. The actuator is provided between the sensor 12 and table 10, or alternatively between the to-be-machined object W and sensor 12.

Abstract: A wire 10 made of metal is shaped into a wire having a diameter of 5 mm by a circular die 12 and then, cut to a plurality of lengths of 500 mm. The wire 10 is heated in hydrogen atmosphere at 800.degree. C. for two hours. Then, the wire 10 is drawn by a plurality of triangular dies 14, 16, 18, and 20 sequentially without winding the wire 10 around a reel. As a result, the wire 10 is shaped into an approximately regular triangular configuration in section. The wire 10 shaped into the approximately regular triangular configuration is cut to a plurality of lengths of 40 mm and then supplied to a predetermined place for a subsequent processing.

Abstract: Optimum conditions for extrusion forging by using a powder material are determined by making a cylindrical billet out of the powder material, subjecting it to a deformation stress between plates to measure its strain as well as the time-rate of change in the strain, thereby determining parameters in the stress-strain formula, and carrying out a simulation analysis by an arbitrary Lagrangian-Eulerian method with an equation of motion obtained by the principle of virtual power. In considering the virtual power, bulk work is also taken into consideration. By such simulation analysis, data such as pressure distribution, speed distribution and density distribution are obtained. Optimum conditions are obtained by analyzing these data.