Abstract: An optical module includes an optical waveguide; a lens sheet including a lens; a substrate on one surface of which at least one of a light emitting element and a light receiving element is mounted; a first adhesion film that adheres the optical waveguide and the lens sheet; a second adhesion film that adheres the lens sheet and the substrate; and an adhesive agent introducing area, provided at at least one of the first adhesion film and the second adhesion film, to which an adhesive agent is supplied.

Abstract: An optical module includes an optical waveguide; a lens sheet including a lens; a substrate on one surface of which at least one of a light emitting element and a light receiving element is mounted; a first adhesion film that adheres the optical waveguide and the lens sheet; a second adhesion film that adheres the lens sheet and the substrate; and an adhesive agent introducing area, provided at at least one of the first adhesion film and the second adhesion film, to which an adhesive agent is supplied.

Abstract: A method for manufacturing an optical connector includes mounting a lens member to which a lens is formed to another optical connector by inserting a guide pin provided on the another connector into a hole of the lens member, mounting a ferrule body to the lens member by inserting the guide pin into a hole of the ferrule body, and bonding the lens member and the ferrule body in a state where the guide pin is accommodated in the hole of the lens member and the hole of the ferrule body.

Abstract: A mounting apparatus for mounting a device onto a substrate includes a table that holds the substrate, a mounting head that carries a device to be mounted on the substrate, a camera that is movable to a position between the table and the mounting head and includes a first imager that captures an image of the substrate on the table and a second imager that captures images of the device carried by the mounting head, a third imager that captures an image of a first device mounted on the substrate, and a controller that controls the mounting head to position a second device to be mounted on the substrate and being carried by the mounting head based on a position of the first device that is determined based on the image captured by the third imager.

Abstract: An optical connector includes an optical waveguide having multiple cores for propagating light arranged in a width direction, a connector body including a distal end reference surface that contacts a distal end of the optical waveguide, a first reference surface that contacts a first surface of the optical waveguide, a lens array that face the multiple cores, and an opening, and a positioning member that is mounted to the opening, the positioning member including a pressing part that contacts a second surface of the optical waveguide and presses the optical waveguide to the first reference surface, and a first positioning part that contacts a first side of the optical waveguide in the width direction.

Abstract: A method for manufacturing an optical connector includes mounting a lens member to which a lens is formed to another optical connector by inserting a guide pin provided on the another connector into a hole of the lens member, mounting a ferrule body to the lens member by inserting the guide pin into a hole of the ferrule body, and bonding the lens member and the ferrule body in a state where the guide pin is accommodated in the hole of the lens member and the hole of the ferrule body.

Abstract: An optical connector includes an optical waveguide having multiple cores for propagating light arranged in a width direction, a connector body including a distal end reference surface that contacts a distal end of the optical waveguide, a first reference surface that contacts a first surface of the optical waveguide, a lens array that face the multiple cores, and an opening, and a positioning member that is mounted to the opening, the positioning member including a pressing part that contacts a second surface of the optical waveguide and presses the optical waveguide to the first reference surface, and a first positioning part that contacts a first side of the optical waveguide in the width direction.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

Abstract: A composite optical disk structure includes a first transparent disk plate having a first center hole, a first stamper clamp groove and a first information recording area on its one main surface; a second transparent disk plate having a second center hole having a diameter equal to that of the first center hole, a second stamper clamp groove and a second information recording area on its one main surface; a transparent adhesive sandwiched between the first and second transparent disk plates to bond the one main surfaces of them; and a mechanism formed between the one main surfaces for preventing the transparent adhesive from leaking our into the center holes.

Abstract: A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq.Cr<2 wt. % and 0.1.ltoreq.Ni<10 wt. % and further at least one additive component selected from the group consisting of the following composition ratios: the following composition ratios: 0<Fe<5 wt. %, 0.ltoreq.Co<5 wt. %, 0.ltoreq.Al<10 wt. %, 0.ltoreq.Ti<20 wt. %, 0.ltoreq.Mo<3 wt. %, 0.ltoreq.Si<3 wt. %, 0.ltoreq.V<3 wt. %, 0.ltoreq.Mg<1 wt. %, and 0.ltoreq.

Abstract: A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq.Cr<2 wt. % and 0.1.ltoreq.Ni<10 wt. % and further at least one additive component selected from the group consisting of the following composition ratios: the following composition ratios: 0<Fe<5 wt. %, 0.ltoreq.Co<5 wt. %, 0.ltoreq.Al<10 wt. % 0.ltoreq.Ti<20 wt. %, 0.ltoreq.Mo<3 wt. %, 0.ltoreq.Si<3 wt. % 0.ltoreq.V<3 wt. % 0.ltoreq.Mg<1 wt. % and 0.ltoreq.

Abstract: A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq. Cr< 2 wt. % and 0.1.ltoreq. Ni< 10 wt. % and further at least one additive component selected from the group consisting of the following composition ratios: the following composition ratios: O<Fe< 5 wt. %, O.ltoreq.Co< 5 wt. %, O.ltoreq.Al< 10 wt. %, O.ltoreq.Ti< 20 wt. %, O.ltoreq.Mo< 3 wt. %, O.ltoreq.Si< 3 wt. %, O.ltoreq.V< 3 wt. %, O.ltoreq.Mg< 1 wt. % and O.

Abstract: On a printed circuit board, according to the present invention, IC packages are arranged in a matrix layout. The IC packages are soldered to the printed circuit board via their lead wires provided on the package sides along row and column lines of the matrix chip components are soldered to the printed circuit board, under each of the IC packages along lines angularly deviated from the row lines or the column lines of the matrix. Thus, the soldered portion of a chip component behind its adjacent chip component can be visually inspected along a view line parallel to the row line or the column line on a highly integrated printed circuit board.