Abstract: Provided is a work processing apparatus configured so that limitations on the contents of processing for a work piece or the type of work piece can be reduced and processing for a wider range of processing contents and work piece can be performed. In a work processing apparatus 100, a work table 101 is, through a table displacement mechanism 103, supported on a rotation base 120 to be rotatably driven by a table rotary drive motor 125, and a weight holding tool 110 is supported on the rotation base 120 through a weight displacement mechanism 114. The table displacement mechanism 103 includes a rack-and-pinion mechanism configured to displace the work table 101 in an X-axis direction as viewed in the figure. At the table displacement mechanism 103, a power inputter 108 configured to input drive force from a table displacement mechanism drive apparatus 130 is provided.

Abstract: Provided is a work processing apparatus configured so that limitations on the contents of processing for a work piece or the type of work piece can be reduced and processing for a wider range of processing contents and work piece can be performed. In a work processing apparatus 100, a work table 101 is, through a table displacement mechanism 103, supported on a rotation base 120 to be rotatably driven by a table rotary drive motor 125, and a weight holding tool 110 is supported on the rotation base 120 through a weight displacement mechanism 114. The table displacement mechanism 103 includes a rack-and-pinion mechanism configured to displace the work table 101 in an X-axis direction as viewed in the figure. At the table displacement mechanism 103, a power inputter 108 configured to input drive force from a table displacement mechanism drive apparatus 130 is provided.

Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.

Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having a release property is laminated on the surfaces of the uncured resin sheets on upper and lower sides of the printed wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.

Abstract: A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not rendered molten during thermo-compression bonding, and an adherent insulator rendered molten during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator rendered molten in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode can be set constant by interposing the dielectric film between the first and second electrodes. Accordingly, a wiring board ensured in lifetime and improved in reliability, and a fabrication method of such a wiring board can be obtained.

Abstract: A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.

Abstract: A method of manufacturing highly reliable and highly densely printed wiring board which are not warped even by the application of pressure and heat in the step of manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet by using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by the application of pressure and heat, without causing deviation in position even in the step of applying pressure and heat.

Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having release property is laminated on the surfaces of the uncured resin sheets on the upper and lower sides of the inner printed wiring board, a desired position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers formed on the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.

Abstract: To provide a slim and miniaturized semiconductor integrated circuit device which eliminates the needs for making through holes and conducting in through holes and uses a carrier substrate with a small thermal expansion coefficient difference from a semiconductor chip. A semiconductor integrated circuit device using a carrier substrate having a plurality of extraction conductive layers 3 formed as a single layer on an insulating base body 11 having a thermal expansion coefficient of 4.times.10.sup.-6 .degree. C..sup.-1 to 16.times.10.sup.-6 .degree. C..sup.-1 and comprising a plurality of ball-like external connection terminals 7 in a plurality of closed-end holes 15 arriving at external connection parts 4, each of the external connection terminals 7 having a diameter larger than the depth of each of the closed-end holes 15.

Abstract: A tin-containing aluminum alloy is usually pressure-welded to a backing steel plate and used as a bearing. This bearing, however, is defective in that aluminum crystal grains and tin precipitates are coarsened in the alloy structure and the high temperature hardness and fatigue-resistant strength of the bearing alloy are reduced.The present invention provides an aluminum alloy comprising 2.5 to 25% by weight of tin, 0.5 to 8% by weight of zinc and 1 to 7% by weight of at least one element selected from the group consisting of silicon, chromium, manganese, nickel, iron, zirconium, molybdenum, cobalt, tungsten, titanium, antimony, niobium, vanadium, cerium, barium and calcium, with the balance being substantially aluminum. In the aluminum alloy of the present invention 0.1 to less than 1% by weight of chromium may be incorporated of 1 to less than 1% by weight of chromium may the like. The alloy of the present invention is effectively used as a bearing for a crank shaft of an automobile or the like.

Abstract: A stereoscopic X-ray device used for stereoscopic radiography generates X-rays from a pair of X-ray focal spots. The X-ray device is provided with an evacuated envelope, an X-ray target within the evacuated envelope, and a cathode structure having at least two pairs of filaments. The first pair of filaments form relatively large size X-ray focal spots on the target. The second pair of the filaments form relatively small size X-ray focal spots on the target and are situated between the first pair of filaments on the cathode structure. As a result of these two pairs of focal spots on the X-ray target, a relatively small X-ray device can be used to provide magnification of stereoscopic images of high stereo quality.

Abstract: In an X-ray apparatus for a computed tomography scanner, a plurality of combined X-ray tube segments are arranged round the central axis of the apparatus on which a subject to be examined is disposed. The X-ray tube segments each include a large number of electron beam generating means to produce an electron beam, a strip-like target having a surface against which the electron beam strikes and extending along a circular arc round the central axis, and an envelope containing these components. Along the surfaces of the X-ray tube segments facing the central axis lie a large number of X-ray detector elements to detect doses of fan-shaped X-ray beams emitted from the target and transmitted through the to-be-examined subject. The electron beam generating means successively produce electron beams, and fan-shaped X-ray beams are applied one after another to the subject from around the same.

Abstract: An X-ray tube unit for neutral-grounded use which comprises an X-ray tube having an envelope with the central portion formed of a metal cylinder, a housing containing the X-ray tube, and a lead wire extending from the cylinder to the outside of the housing, whereby the X-ray tube is electrically insulated from and fixed to the housing, and charged potential in the metal cylinder is dropped.