Patents by Inventor Takeshi Negishi
Takeshi Negishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240175670Abstract: To improve the detection accuracy of a rotation angle of a rotation shaft caused by the magnetic flux distribution of a magnet. In an absolute encoder, a support shaft has one end fixed to a gear base part as a substrate, and includes a flange part at the other end. A first bearing and a second bearing as at least one bearing include inner rings fixed to the support shaft. The first bearing and the second bearing are disposed between the gear base part and the flange part in an axial direction. A spacer is disposed between the first bearing and the second bearing, and a magnet (Mq), in the axial direction of the support shaft. The spacer is in contact with outer rings of the first bearing and the second bearing from the axial direction inside a bearing fixing part.Type: ApplicationFiled: March 11, 2022Publication date: May 30, 2024Inventors: Katsunori SAITO, Hiroki NEGISHI, Takeshi SAKIEDA
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Patent number: 9503893Abstract: A relay device is communicable with a communication management system that stores relay device identification information for identifying a relay device capable of communicating with a communication terminal using a first communications protocol, in association with configuration data that allows the communication terminal to communicate using a second communications protocol. In response to a configuration data request received from a communication terminal using the first communications protocol, the relay device transmits relay device identification information to the communication management system to obtain configuration data associated with the relay device identification information, and transmits the configuration data to the communication terminal.Type: GrantFiled: January 16, 2014Date of Patent: November 22, 2016Assignee: Ricoh Company, Ltd.Inventors: Takeshi Negishi, Takahiro Asai, Kenji Tanaka, Yoshinaga Kato, Katsuyuki Kaji
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Publication number: 20140204833Abstract: A relay device is communicable with a communication management system that stores relay device identification information for identifying a relay device capable of communicating with a communication terminal using a first communications protocol, in association with configuration data that allows the communication terminal to communicate using a second communications protocol. In response to a configuration data request received from a communication terminal using the first communications protocol, the relay device transmits relay device identification information to the communication management system to obtain configuration data associated with the relay device identification information, and transmits the configuration data to the communication terminal.Type: ApplicationFiled: January 16, 2014Publication date: July 24, 2014Inventors: Takeshi NEGISHI, Takahiro ASAI, Kenji TANAKA, Yoshinaga KATO, Katsuyuki KAJI
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Patent number: 8188376Abstract: A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.Type: GrantFiled: November 10, 2009Date of Patent: May 29, 2012Assignee: Mitsubishi Materials CorporationInventors: Takeshi Negishi, Toshiyuki Nagase
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Patent number: 8164909Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.Type: GrantFiled: May 20, 2010Date of Patent: April 24, 2012Assignee: Mitsubishi Materials CorporationInventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
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Patent number: 8001682Abstract: A high-efficiency production method for a power module substrate with reduced line width of a conductive pattern provides an insulation substrate suitable for realizing a large current and a high voltage of a power module. According to the method, a brazing sheet is temporarily fixed on a first surface of a ceramics substrate by surface tension of a volatile organic liquid. The brazing sheet is also temporarily fixed on the first surface of a conductive pattern member punched from a base material by surface tension of same type of volatile organic liquid. The brazing sheet and the conductive pattern member are heated so as to volatilize the volatile organic liquid and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the first surface of the ceramics substrate.Type: GrantFiled: August 16, 2005Date of Patent: August 23, 2011Assignee: Mitsubishi Materials CorporationInventors: Takeshi Negishi, Toshiyuki Nagase
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Publication number: 20100230473Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.Type: ApplicationFiled: May 20, 2010Publication date: September 16, 2010Applicant: Mitsubishi Materials CorporationInventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
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Publication number: 20100053903Abstract: A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.Type: ApplicationFiled: November 10, 2009Publication date: March 4, 2010Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Takeshi Negishi, Toshiyuki Nagase
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Patent number: 7532481Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5, as an amount of boron measured by fluorescence X-ray analysis, where the amount of boron is defined as a value obtained by an expression: (a peak height of B-K?/a peak height of X-K?) x 100000 and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.Type: GrantFiled: April 4, 2005Date of Patent: May 12, 2009Assignee: Mitsubishi Materials CorporationInventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
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Publication number: 20080248326Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.Type: ApplicationFiled: June 12, 2008Publication date: October 9, 2008Applicant: Mitsubishi Materials CorporationInventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
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Publication number: 20070297162Abstract: High-efficiency production of a power module substrate and reduction of the line width of a conductive pattern, and to provide an insulation substrate suitable for realizing a large current and a high voltage of a power module. A brazing sheet is temporarily fixed on a surface of a ceramics substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the surface of the ceramics substrate.Type: ApplicationFiled: August 16, 2005Publication date: December 27, 2007Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Takeshi Negishi, Toshiyuki Nagase
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Publication number: 20070274047Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.Type: ApplicationFiled: April 4, 2005Publication date: November 29, 2007Applicant: Mitsubishi Materials CorporationInventors: Toshiyuki Nagase, Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi
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Publication number: 20070235246Abstract: A vehicle steering system includes: a sensor mechanism having a sensor coil 13; an antitheft device which has a key lock collar 4 and is disposed on the rear side of the sensor mechanism, in which the outer diameter of the key lock collar 4 of the antitheft device is larger than the inner diameter of the sensor coil 13 of the sensor mechanism; and a member 15 which has a diameter larger than the inner diameter of the sensor coil 13 and which is disposed on the front side of the sensor mechanism, wherein a steering shaft 3 or 6 to which the member 15 having the large diameter is fixed is inserted to the sensor coil 13 and then the key lock collar 4 is fitted to the steering shaft 3 or 6.Type: ApplicationFiled: June 17, 2005Publication date: October 11, 2007Inventors: Yuji Kawaike, Hiroaki Sanji, Takeshi Negishi
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Publication number: 20060196237Abstract: In a steering locking device comprising a locking device for automatically locking a steering shaft when a key of an ignition switch is withdrawn in a state in which the key is withdrawable, a key mechanism section and the locking device of the ignition switch are provided separately, and the locking device is provided at any portion on an output shaft of a steering wheel extending from the steering wheel to a steering gear section. Accordingly, a large space around knees can be secured while securing a sufficient collapse stroke, and a good steerability is maintained by preventing resonance of the steering wheel caused by lowering of a natural frequency vibration of a steering column while reducing the weight of the device.Type: ApplicationFiled: April 19, 2004Publication date: September 7, 2006Inventors: Tadashi Hibino, Takeshi Negishi, Kenji Kurita, Hideki Kojima
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Publication number: 20040188828Abstract: This power module substrate (1) is provided for satisfying both long life with respect to heat cycle and satisfactory thermal conductivity. The power module substrate is provided with an insulating substrate (2) a circuitry layer (3) laminated on one side of insulating substrate, a metal layer (4) laminated on the other side of insulating substrate, a semiconductor chip (5) loaded onto circuitry layer by means of solder (7), and a radiator (6) joined to metal layer. Circuit layer and metal layer are composed of copper of at least 99.999% purity. Temperature cycling life can be extended since there is no accumulation of internal stress even when subjected to repeated heat cycle. In addition, since circuitry layer and metal layer are composed of copper having satisfactory thermal conductivity, heat from semiconductor chip can be efficiently released by transferring to the side of radiator.Type: ApplicationFiled: December 23, 2003Publication date: September 30, 2004Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshiyuki Nagatomo, Takeshi Negishi, Toshiyuki Nagase
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Patent number: 6563709Abstract: A heat sink is obtained that has high thermal conductivity as well as satisfactory moldability and corrosion resistance by using a malleable material made of aluminum or aluminum alloy. Liquid cooled heat sink 11 has a passage 23 in which coolant is able to pass, and is joined to a ceramic substrate. A plurality of through holes 12 extending from one end to the other end are formed by a plurality of dividing walls 13 through 15 in flat casing 12 of which both ends are open, and notches 16 are formed on one or both ends of the plurality of dividing walls. Corrugated fins 17 are respectively inserted into each of the plurality of through holes, and each through hole is demarcated into a plurality of slots 12b extending from one end to the other end of the casing by these fins. Both ends of the casing are closed by a pair of covers 18 and 19, and coolant inlet 18a and outlet 18b are formed in the covers.Type: GrantFiled: July 19, 2001Date of Patent: May 13, 2003Assignee: Mitsubishi Materials CorporationInventors: Takeshi Negishi, Toshiyuki Nagase, Yoshiyuki Nagatomo, Shoichi Shimamura, Asao Tokiwa
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Publication number: 20020157494Abstract: A concave groove 3 formed in a male spline fitting portion 1a of an inner shaft 1 is filled with a synthetic resin via filling holes 4 formed in a female spline fitting portion 2a of an outer shaft 2. Resinous slide portions 5 are formed on the fitting portions 1a, 2a of these two shafts 1, 2. A resinous ring 6 is attached to an inner peripheral surface of a front side end of the female spline fitting portion 2a of the outer shaft 2, whereby even if the front side end of the outer shaft 2 comes off the male spline fitting portion 1a of the inner shaft 1, the front side end of the outer shaft 2, because of the resinous ring 6 sliding on an outer peripheral surface of a small-diameter portion 1b of the inner shaft 1, is capable of smoothly moving towards a front side of a vehicle.Type: ApplicationFiled: September 14, 2001Publication date: October 31, 2002Inventors: Sakae Matsumoto, Tadashi Hibino, Takeshi Negishi, Satoshi Onozato
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Publication number: 20020101718Abstract: A heat sink is obtained that has high thermal conductivity as well as satisfactory moldability and corrosion resistance by using a malleable material made of aluminum or aluminum alloy. Liquid cooled heat sink 11 has a passage 23 in which coolant is able to pass, and is joined to a ceramic substrate. A plurality of through holes 12 extending from one end to the other end are formed by a plurality of dividing walls 13 through 15 in flat casing 12 of which both ends are open, and notches 16 are formed on one or both ends of the plurality of dividing walls. Corrugated fins 17 are respectively inserted into each of the plurality of through holes, and each through hole is demarcated into a plurality of slots 12b extending from one end to the other end of the casing by these fins. Both ends of the casing are closed by a pair of covers 18 and 19, and coolant inlet 18a and outlet 18b are formed in the covers.Type: ApplicationFiled: July 19, 2001Publication date: August 1, 2002Inventors: Takeshi Negishi, Toshiyuki Nagase, Yoshiyuki Nagatomo, Shoichi Shimamura, Asao Tokiwa
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Patent number: 5051989Abstract: In a time division multiple access network comprising a standard station and at least one particular terrestrial station which has a preassigned station address and which is operated in accordance with a current burst time plan and/or channel assignment pattern table, a switching data signal is sent from the standard station to the particular terrestrial station with an indicated preassigned station address, indicated in addition to a switch execution signal. Responsive to the preassigned station address, the particular terrestrial station switches from the current table to a new one. For this purpose, the standard station comprises a station data generation circuit for producing a station address signal representative of the preassigned station address, while the particular terrestrial station comprises a station address decoder which detects the station address signal and switches the tables from the current one to the new one only when the preassigned station address is detected.Type: GrantFiled: February 28, 1989Date of Patent: September 24, 1991Assignee: NEC CorporationInventor: Takeshi Negishi