Abstract: To provide a jet solder feeding device enabling the prevention of poor wetting of a substrate and molten solder which may occur due to gas or air accumulated under the bottom surface of a substrate when the substrate is conveyed to the point where it is fed with molten solder. The jet solder feeding device is designed in such a manner that multiple ejecting ports are provided in more than one rows relative to the substrate-conveying direction and arranged at a second prescribed pitch in lines substantially along multiple inclined lines which are inclined to the substrate-conveying direction and arranged at a first prescribed pitch relative to the direction perpendicular to the substrate-conveying direction, the first prescribed pitch being set to be larger than the second prescribed pitch, so that a flow of molten solder passing through midway between groups of the ejecting ports is positively created.