Patents by Inventor Takeshi Tajiri
Takeshi Tajiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240150013Abstract: A rotorcraft includes a fuselage, rotors and circular wings. The rotors are attached to the fuselage. The rotors are attached to the fuselage. The circular wings are disposed under the rotors respectively. Upper surfaces of the circular wings have annular curved surfaces and thereby are convex upward respectively. The circular wings cause Coanda effects by the upper surfaces respectively. First lift is generated by rotating the rotors. Second lift is generated by the Coanda effects by the circular wings. Third lift is generated by air jets deflected downward along the upper surfaces of the circular wings respectively.Type: ApplicationFiled: October 26, 2023Publication date: May 9, 2024Inventors: Kensuke YOSHIMURA, Keisuke TAJIRI, Takeshi FUKUROSE
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Patent number: 10794937Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.Type: GrantFiled: December 19, 2017Date of Patent: October 6, 2020Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Masashi Kosuga, Takeshi Kato, Takeshi Tajiri, Hidehiko Takahara, Nobuaki Gorai
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Patent number: 10506744Abstract: Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are secured. In a power conversion device in which a bus bar of a connecting member is connected to an input/output terminal and the like of a semiconductor module protruding through an opening of a metallic member, the connecting member includes extended portions which extend in a space between the bus bar and the opening of the metallic member.Type: GrantFiled: June 19, 2017Date of Patent: December 10, 2019Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masashi Kosuga, Takeshi Tajiri, Hidehiko Takahara
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Publication number: 20190361053Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.Type: ApplicationFiled: December 19, 2017Publication date: November 28, 2019Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Masashi KOSUGA, Takeshi KATO, Takeshi TAJIRI, Hidehiko TAKAHARA, Nobuaki GORAI
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Publication number: 20190230813Abstract: Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are secured. In a power conversion device in which a bus bar of a connecting member is connected to an input/output terminal and the like of a semiconductor module protruding through an opening of a metallic member, the connecting member includes extended portions which extend in a space between the bus bar and the opening of the metallic member.Type: ApplicationFiled: June 19, 2017Publication date: July 25, 2019Inventors: Masashi KOSUGA, Takeshi TAJIRI, Hidehiko TAKAHARA
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Patent number: 7341144Abstract: A case includes a case body, a lid, hinges supporting the lid on the case body and a waterproof seal placed on the joining surface of the case body. The lid can be turned for closing on the hinges so as to compress the waterproof seal perpendicularly to the joining surface of the case body. Each hinge is provided with a hinge pin having opposite cylindrical end parts and an offset middle part defining a groove together with the cylindrical end parts. The grooves of the hinges permit first knuckles formed integrally with the lid to sink therein so that the lid held with its joining surface parallel to the joining surface of the case body can be moved toward the case body perpendicularly to the joining surface of the case body to compress the waterproof seal perpendicularly between the joining surfaces of the lid and the case body. The hinge pin is restrained from coming off by the first knuckles when the first knuckles are engaged in the groove.Type: GrantFiled: February 18, 2005Date of Patent: March 11, 2008Assignee: Hitachi Communication Technologies, Ltd.Inventors: Takeshi Tajiri, Osamu Kamimura, Yasushi Kimura
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Publication number: 20050224508Abstract: A case includes a case body, a lid, hinges supporting the lid on the case body and a waterproof seal placed on the joining surface of the case body. The lid can be turned for closing on the hinges so as to compress the waterproof seal perpendicularly to the joining surface of the case body. Each hinge is provided with a hinge pin having opposite cylindrical end parts and an offset middle part defining a groove together with the cylindrical end parts. The grooves of the hinges permit first knuckles formed integrally with the lid to sink therein so that the lid held with its joining surface parallel to the joining surface of the case body can be moved toward the case body perpendicularly to the joining surface of the case body to compress the waterproof seal perpendicularly between the joining surfaces of the lid and the case body. The hinge pin is restrained from coming off by the first knuckles when the first knuckles are engaged in the groove.Type: ApplicationFiled: February 18, 2005Publication date: October 13, 2005Applicant: Hitachi Communication Technologies, Ltd.Inventors: Takeshi Tajiri, Osamu Kamimura, Yasushi Kimura